IoT

Rohde & Schwarz enhances FSW analyser’s dynamic front end

Thu, Apr 14, 2022

Error vector magnitude (EVM) measurement for wideband modulated signals in the mmWave range distinguish the R&S FSW signal and spectrum analyser from Rohde & Schwarz. The company has enhanced the dynamic front end of the instrument which is suitable for testing communication components or systems, including 5G NR (new radio) FR2 or IEEE 802.11ay / ad chipsets, amplifiers, user equipment and base

stations.

The enhanced dynamic front end of the R&S FSW meet demands for EVM measurements for 5G base station and component development at FR2 frequencies as well as for high frequency satellite applications. Accuracy is achieved with the latest enhancements to the modified front end of the R&S FSW, as well as the microwave hardware optimised for frequencies above 26 GHz, says Rohde & Schwarz.

The signal and spectrum analyser has a wide internal analysis bandwidth which allows the characterisation of wideband components and communications systems. Its measurement applications simplify and speed up in-depth analysis of the physical layer, allowing testing at higher frequencies and wider measurement bandwidths to cover all the physical layer options specified in the standard, says Rohde & Schwarz.

Newly produced R&S FSW43, R&S FSW50 and R&S FSW67 models now ship with the enhancements as standard. The R&S FSW-B24U can also be ordered as an upgrade to many R&S FSW signal and spectrum analysers already in use.

The Rohde & Schwarz technology group specialises in test and measurement, technology systems and networks and cybersecurity.

Founded more than 85 years ago, the group is a partner for industry and government customers around the globe. 

Rohde & Schwarz is headquartered in Munich, Germany.

http://www.rohde-schwarz.com

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Virtual development environment for accelerates automotive development

Wed, Apr 13, 2022

A virtual development environment announced by Renesas Electronics enables  development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). 

The environment includes a virtual turnkey platform, which allows engineers to develop application software before devices or evaluation boards are available. There is also a multi-core debug and trace tool, which enables users to analyse and evaluate software as if running on an actual chip. 

“With the evolution of E/E architecture, there is an increasing demand for software design that can maximise performance at a system level,” explains Hiroshi Kawaguchi, vice president, Automotive Software Development division at Renesas. At the same time, the increasing time and cost associated with software development have become a big challenge. “Our integrated software development environment that can be used across gateway systems, ADAS, and xEV development, enables customers to benefit from the scalability of Renesas products such as R-Car and the RH850 family for both software and hardware development.”

 The virtual turnkey platform application software development environment consists of the R-Car Virtual Platform (R-Car VPF) development environment and a software development kit (R-Car SDK) that includes pre-tested software libraries and sample code. R-Car VPF is based on Virtualizer Development Kits (VDKs) from Synopsys, and integrates virtual models of IP specific to R-Car to customise for R-Car devices. By overlaying the R-Car SDK engineers can immediately start development of application software virtually. The platform accurately recreates the behaviour of the chip and eliminates the need to build up a development environment with a physical evaluation board. Multiple users can also develop software simultaneously on separate PCs or servers.

The next step is to integrate the software and verify that it runs on a single chip. Software components share resources such as the multiple CPUs and IPs on R-Car SoCs. If operational problems are detected after the software components are integrated, it requires a tremendous amount of work to analyse and solve them, explains Renesas. The Multicore Debug and Trace tool analyses and identifies the causes of errors occurring from the interaction of the multiple hardware resources in R-Car SoCs. This enables synchronous and simultaneous debugging of the entire heterogeneous architecture of R-Car without using the actual device.

The development environment is available for the R-Car S4 SoC for automotive gateways. Renesas has plans to support the R-Car V4H as well as future versions of R-Car products and RH850 automotive MCUs.

https://www.renesas.com

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Cadence completes Ethernet subsystem with controller IP

Wed, Apr 13, 2022

High speed Ethernet controller IP released by Cadence enables complete Ethernet subsystem solutions up to 800G. Optimised for power, performance and area (PPA), the low latency, high speed controller IP expands Cadence’s Ethernet controller IP portfolio and supports aggregated bandwidths for 100G, 200G, 400G and 800G Ethernet.

It also offers support for both single- and multi-Ethernet channel solutions and complies with IEEE 802.3 and Ethernet Technology Consortium specifications. 

The IP provides full-featured media access control (MAC), physical coding sub-layer (PCS), forward error correction (FEC) and physical medium attachment (PMA) blocks, for a complete architecture, says Cadence.

The integrated RS(528,514), RS(544,514), Firecode and Ethernet Technology Consortium Low Latency RS FEC support allows customers to choose the best option for an application’s requirements.

“The exploding bandwidth demand from cloud, AI / ML and 5G has driven Ethernet protocols to evolve and has accelerated 800G market adoption,” said Rishi Chugh, vice president of product marketing, IP Group at Cadence. The company also supplies 112G / 56G and other Ethernet SerDes PHY IP for a sub-system with integrated PHY and controller that enable customers to integrate and streamline SoC designs. 

Cadence has more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP. Cadence’s customers develop electronic products from chips to boards to systems for consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. 

http://www.cadence.com

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Amphenol RF releases Wi-Fi 6-capable cable assemblies

Tue, Apr 12, 2022

Miniature cable assemblies from Amphenol RF have been supplemented with the introduction of SMA to AMC configurations on micro-coax cable types, capable of Wi-Fi 6 performance. 

The additional SMA to AMC configurations are on 1.13 and 1.32mm micro-coax cables. The configurations offer more efficient bandwidth sharing and RF performance up to 9.0GHz. According to Amphenol, the versatile SMA connector is coupled with the small footprint AMC connector, making the assemblies suitable for IoT, antenna and Wi-Fi 6 applications.

SMA connectors are a popular choice for designs that require vibration resistant capabilities because the threaded coupling mechanism ensures a secure connection. The front mount SMA bulkhead jacks are constructed with gold plated brass bodies and gold plated phosphor bronze contacts. The AMC connectors are compatible with the industry standard U.FL for miniature connectors. In addition to saving space, the AMC connectors introduced by Amphenol RF have a user friendly tactile lock which guarantees a reliable connection, says the company. These right-angle connectors are engineered with either gold plated black PBT (polybutylene terephthalate) or silver plated phosphor bronze bodies and gold plated phosphor bronze contact. Flexible micro-coax cables complete this assembly design; they are also designed for applications where space is limited. The 1.32mm version is also double shielded to ensure low signal loss.

These 50 Ohm SMA to AMC cable assemblies join Amphenol RF’s collection of existing miniature cable assemblies. They feature an extended frequency range that allows them to support Wi-Fi 6 and Wi-Fi 6E, high-efficiency Wi-Fi designs. This type of Wi-Fi is typically used in dense environments and employs advanced antenna technology which allows for more simultaneous communications and improved speeds.

Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency (RF), microwave, and data transmission system applications. Headquartered in Danbury, Connecticut, USA, Amphenol RF has sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions. 

https://www.amphenolrf.com

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