STMicroelectronics’ new inertial modules enable AI training inside the sensor

STMicroelectronics has introduced ISM330ISN inertial sensors that contain an intelligent sensor processing unit (ISPU). The company said the power the onlife era: interacting with trained devices, with intelligence moving from “on” the edge to “in” the edge.

The ISM330ISN always-on, six-axis inertial measurement unit (IMU) for movement and position sensing uses its embedded intelligence to deliver unrivalled performance and accuracy for its size and power, claimed ST. Used in IoT and industrial applications, the IMU sets to accelerate response time and extend battery life in equipment such as condition monitors for predictive maintenance, as well as battery-operated asset trackers and industrial applications, such as robots.

The intelligence built into the ISM330ISN enables smart devices to perform advanced motion detection functions in the sensor without interaction with the external microcontroller (MCU), thus saving power at system level. ST’s approach integrates a specialised processor, the ISPU, in a small area directly on the sensor chip, optimised for machine learning applications. This enables the ISM330ISN module to have a 50 per cent smaller footprint and consume 50 per cent less power than a typical co-packaged MCU, claimed the company.

Developers can programme the ISPU using ST’s NanoEdge AI Studio. This tool is used to deploy AI applications on STM32 microcontrollers. The technology is now available for programming the ISPU, enabling users to easily generate automatically optimised machine learning libraries. Designing an anomaly detection library with AI learning capability directly inside the ISPU is possible with minimal data and just a few clicks, claimed the company, and with no specific data science skills needed.

“Intelligence formerly implemented at the network edge, in an application processor, is now moving to the deep edge, inside the sensor,” said Simone Ferri, general manager of marketing, Analogue MEMS and Sensors Group, STMicroelectronics. “Our ISM330ISN IMU heralds a new category of smart sensors, leveraging embedded AI to handle complex operations such as pattern recognition and anomaly detection with greatly increased efficiency and performance.”

The ISM330ISN has the same 3.0 x 2.5 x 0.83mm package outline as conventional inertial modules. Designers can therefore upgrade products quickly and cost-effectively with no obligation to change an established circuit board layout.

The ISM330ISN is covered by ST’s 10-year longevity programme, which provides long-term availability assurance for product designers and manufacturers. 

The ISM330ISN is part of ST’s iNEMO family of IMUs. It contains a three-axis accelerometer and three-axis gyroscope with low-noise sensing performance, and an output data rate (ODR) of 6.6kHz. With the ISPU, the sensor ensures consistently high accuracy while consuming only 0.59mA in combination mode with the accelerometer and gyroscope active.

ST’s ISPU architecture, based on digital signal processing (DSP), is compact and power-efficient, with 40kbytes of RAM, and occupies just 8,000 gates on the sensor die. Performing floating-point operations with single-bit precision, ISPU is suitable for machine learning applications and binary neural networks, claimed the company.

The ISM330ISN is scheduled to enter production in the second half of  2022 and will be available from st.com or distributors. NanoEdge AI Studio enabling the creation of libraries designed for specific ISPU part numbers is available at no charge on ST.com.

ST’s ISPU and the NanoEdge.AI tools have been shortlisted for the Embedded Award at Embedded World 2022, in the Hardware and Software categories respectively (in Nuremberg, Germany, 21-23 June). ST will be exhibiting in Hall 4A-148.

https://www.st.com

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Four-channel beamformers advance 5G mmWave precision, says NXP 

Two four-channel, dual-polarised analogue beamformers, the MMW9012K and MMW9014K enable advanced precision in beam steering for 5G mmWave, improving system reliability, said NXP.

The analogue beamformers have been developed using NXP’s silicon germanium (SiGe) process. They support dual-polarisation to improve 5G reliability and offer a high degree of integration to help reduce 5G base station size and costs, said the company. They also reduce current consumption for 5G mmWave designs. 

5G mmWave solutions are typically deployed in dense urban areas, where the higher frequency and bandwidth are well-suited to meet consumers’ needs for higher bit rates. However, the higher frequency also decreases the distance an mmWave signal can cover, as does the interference of buildings and other obstacles. The dual-polarised, four-channel analogue beamformers enable more precise steering of simultaneous beams to users, explained NXP, mitigating the propagation loss common to 5G mmWave deployments and improving overall system reliability.

The MMW9012K operates at 28GHz, while the MMW9014K operates at 26GHz. Both devices offer a high transmit and receive gain with EVM (error vector magnitude) at 2.5 per cent at Pout of 9dBm.

Doeco Terpstra, vice president and general manager, Smart Antenna Solutions, NXP, said: “Reliability is more important than ever, and OEMS need the ability to precisely direct simultaneous beams to the different users that require the low latency and high bandwidth that 5G mmWave offers. At the same time, utilising a dual-polarisation on a single antenna panel enables a higher degree of integration for 5G mmWave panels, reducing system size and cost for OEMs.”

NXP also announced an antenna system developer kit to complement the beamformers. It features an 8×8 antenna panel, with a control board with GUI (graphic user interface) and power supplies. According to NXP, the antenna developer system makes it easy for OEMs to accelerate their panel designs to more quickly build 5G antenna systems.

The MMW9012K and MMW9014K four-channel, dual polarised analogue beamformers are in volume production. 

http://www.nxp.com

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Variation of SARA-R5 LTE-M works with AWS 

A variant of the SARA-R5 LTE-M cellular module series has been introduced by u-blox to make it easier, cheaper and quicker to develop secure IoT networks with AWS (Amazon Web Services).
The SARA-R510AWS module serves a variety of applications that require reliable and secure cloud connectivity, for example asset tracking, smart farming, sensor monitoring and connected medical equipment.

Building and commercialising secure and scalable cloud-connected IoT networks that are easy to maintain over their lifetime can be challenging, said u-blox, explaining the introduction of the AWS module. In addition to requiring expertise in embedded development, networking, cryptography and cloud architecture, developers need to be proficient in handling a complex software stack. The SARA-R510AWS module offers product developers a straightforward path to secure and scalable AWS cloud services, said u-blox. This considerably reduces product development time and effort and cuts time to market. Using a stripped-down command interface, the module can connect to the AWS cloud using just two dedicated AT commands.

The SARA-R510AWS runs validated AWS IoT ExpressLink firmware which handles steps such as networking, authentication, and secure data transfer. There are also security features, including a pre-provisioned hardware-based root of trust, secure boot, and secure storage, as well as encrypted communication to and from the cloud, enabling secure over the air updates of the host processor and the module’s communication firmware.

u-blox will exhibit the SARA-R510AWS at Embedded World in Nuremberg, Germany from 21 to 23 June 2022, on the AWS stand in Hall 4-548.

u-blox specialises in positioning and wireless communication in automotive, industrial and consumer markets. Its services and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. The company has a broad portfolio of chips, modules, and secure data services and connectivity. 

The company has headquarters in Thalwil, Switzerland and offices in Europe, Asia, and the USA.

http://www.u-blox.com

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RA and RX development kits power cellular-to-cloud IoT development

Microcontrollers, sensors, analogue and power devices are combined with Cat-M1 cellular modules by Renesas Electronics to enable end-to-end cloud connectivity.

Renesas has announced two cloud development kits, the CK-RA6M5 and CK-RX65N, for the RA and RX Families of 32bit microcontrollers. The cloud kits are the first to be equipped with Renesas’ RYZ014A Cat-M1 module, a certified LTE cellular module that can establish wireless connection between microcontrollers and cloud services quickly and securely without a gateway. 

Armed with these cloud kits, users can rapidly develop IoT cloud products and solutions without having to design their own complex circuitry and software stacks, Renesas explained. 

The kits include the RYZ014A Cat-M1 Pmod module, multiple sensors, a high-performance microcontroller, hardware-based security and a reliable software stack. 

The cloud kits are ready to connect to global cloud service providers such as AWS Cloud and IoT services. Both kits are designed to run on AWS (Amazon Web Services) FreeRTOS for CK-RA6M5 using FSP (Flexible Software Package) and CK-RX65N using RDP (RX Driver Package). Once connected to AWS IoT Core, the kits have access to many cloud and IoT services from AWS for data analytics and IoT device management.

“With Renesas’ first cellular Cat-M1 module, we are adding ubiquitous cellular connectivity to our cloud solution offerings, providing our customers more flexible and reliable cloud connectivity options,” said Roger Wendelken, senior vice president in Renesas’ IoT and Infrastructure business unit. Engineers can focus on designing IoT systems that can be adopted in a variety of applications such as building and home automation, smart metering, healthcare and industrial applications, Wendelken added.

“Mobile cloud computing is leading a new era for data storage and processing, especially now that cellular IoT devices have become so pervasive,” said Georges Karam, CEO of Sequans Communications. “Packed with on-board sensors and the Cat-M1 module powered by Sequans’ Monarch technology, Renesas’ cloud kits will be ideal platforms for evaluating and deploying mobile cloud applications for wireless IoT systems.” 

The CK-RA6M5 and CK-RX65N both have identical hardware and software features and a common dashboard user interface to access real-time cloud data. 

In addition to the Cat-M1 RYZ014A wireless module, the kits also provide an option to use Ethernet to securely connect to cloud when the Cat-M1 network is not available. Renesas plans to offer more wireless connectivity options in the future. 

The CK-RA6M5 and CK-RX65N kits are available from Renesas worldwide distributors.

http://www.renesas.com 

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