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Rutronik introduces the new SoCs from Nordic Semi for next-generation (I)IoT applications

Thu, Nov 28, 2024

With three SoCs from the new nRF54L series, the nRF54L15, nRF54L10 as well as nRF54L05, Rutronik is expanding its portfolio of Bluetooth Low Energy Systems-on-Chip (SoCs) from Nordic Semiconductor. Higher performance, efficiency and security make this recently launched product the optimal and future-proof choice for realising the next generation of wireless IoT products.

All SoCs in the nRF54L series offer MCU functionality with a 128 MHz Arm Cortex-M33 processor, doubling the processing power and tripling the processing efficiency – compared to the nRF52840. This enables enhanced functionality in end products while consuming up to three times less power.

Security is one of the key challenges in the (I)IoT environment, which is why Nordic Semiconductor relies on advanced security features with physical protection for the nRF54L series: secure booting, secure firmware updates, secure storage, as well as a TrustZone-enabled trusted execution environment, a cryptographic accelerator with side-channel leakage protection and tamper detectors, already allow the development of applications that will meet future security regulations.

The hardware and software highlights of the nRF54L series compared to the predecessor flagship nRF52 (nRF52840):
• Significantly better specifications in terms of:
o Arm Cortex-M33 (128 MHz), instead of Arm Cortex-M4 (64 MHz)
o 1.5 MB NVM / 256 KB RAM, instead of 1 MB Flash / 256 KB RAM
o Bluetooth LE version 6.0 and higher, instead of Bluetooth LE version 5.4

Further benefits:
• Non-volatile memory: 1.5 MB (nRF54L15) // 1.0 MB (nRF54L10) // 0.5 MB (nRF54L05)
• 256 KB RAM (nRF54L15) // 192 KB RAM (nRF54L10) // 96 KB RAM (nRF54L05)
• Ultra-low power multiprotocol 2.4 GHz radio: Bluetooth Low Energy, Bluetooth Mesh, Bluetooth Channel Sounding, Zigbee, Thread, Matter, proprietary 2.4 GHz protocols and support for ecosystems such as Amazon Sidewalk, Google Find My Device and Apple Find My
• RISC-V co-processor and integrated peripherals: new real-time global clock, also available when the system is switched off, 14-bit analogue-to-digital converter and high-speed serial interfaces
• PSA Level 3 certified
• Design flexibility & pin-to-pin compatibility

Application examples:
• Smart Home & Matter, Smart Wearables, VR/AR,
• PC peripherals, HID, remote control
• (Industrial) IoT, building automation, access control
• Medical / healthcare, fitness

https://www.rutronik24.com

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u-blox launches its first LTE Cat 1bis module with embedded eSIM

Tue, Nov 19, 2024

u-blox has launched the SARA-R10001DE, a LTE Cat 1bis module featuring an embedded eSIM with Wireless Logic connectivity designed to improve the robustness, reliability, and resilience of IoT applications. The integral eSIM ensures flexible connectivity management and gives customers the ability to switch to the best network in terms of coverage and cost. Offering faster deployment and reliable connectivity regardless of geography, the SARA-R10001DE offers multiple benefits in applications including asset tracking, telematics, micro-mobility, solar technology, smart homes, and cities, and point of sales.

The new u-blox SARA-R10001DE provides full LTE Cat 1bis band support and an eSIM with multi-IMSI technology and eUICC capability. The eSIM is already profiled with a series of Wireless Logic SIM profiles but can also be remotely profiled via OTA using Remote SIM Provisioning.

The multiple SIM profiles stored in the Wireless Logic eSIM allow the module to connect to the best network automatically. This gives confidence that the module will always connect to the best network and that the eSIM will maintain reliable connectivity by switching automatically to a different operator if any issues arise.

The embedded eSIM simplifies customer logistics because it minimises the time and effort involved in managing SIM procurement and eliminates the need to source companion components such as SIM holders.

Additional savings are possible because the SARA-R10001DE allows customers to simplify logistics and reduce complexity. Bundling an IoT module with flexible connectivity allows customers to use a single SKU instead of having several SKUs with different SIM cards in the warehouse, simplifying stock itineraries and reducing storage requirements.

The embedded eSIM enhances robustness for reliable operation in harsh environments. Unlike plastic SIMs that can warp and fail, the eSIM component is soldered in like a standard electronic component to guarantee permanent electric contact.

Designed to provide LTE global coverage, the SARA-R10001DE provides an easy migration path for legacy 2G and 3G devices to 4G LTE global coverage.

https://www.u-blox.com

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u-blox launches tri-radio module that delivers the latest wireless technologies for IoT

Tue, Nov 12, 2024

u-blox has announced the launch of the MAYA-W4, a tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device connectivity and interoperability.
Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.
The MAYA-W4 addresses the market’s need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR* (Techno Systems Research CO. LTD.). It alleviates network congestion, enhances power efficiency, and, with a temperature range of -40°C to +85°C, is suitable for industrial environments. With its entry-level feature set and optimised data throughput, the MAYA-W4 offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.
The new module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 x 14 x 1.9 mm), u-blox simplifies migration across previous generations.

https://www.u-blox.com

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Web-based tool from ST accelerates AIoT projects with smart sensors

Wed, Nov 06, 2024

ST AIoT Craft, a new web-based tool from ST, simplifies developing and provisioning node-to-cloud AIoT (Artificial Intelligence of Things) projects that use the machine-learning core (MLC) of ST’s smart MEMS sensors.

The MLC is unique to the ST MEMS portfolio and enables decision-tree learning models to run directly in the sensor. Capable of operating autonomously, without host-system involvement, the MLC ensures low latency with low power consumption and efficiently handles tasks that require AI skills such as classification and pattern detection.

ST AIoT Craft also integrates all the steps needed for developing and provisioning IoT projects that leverage the MLC for in-sensor AI and offers a secure and user-friendly approach. There is robust cyber protection for data in the cloud and the web-based tool is conveniently accessed online without downloading to desktop. This saves time for users as it requires no installation, and eases collaboration between different team members such as as AI specialists and embedded software engineers.

The tool provided for creating decision-tree models includes the AutoML function, which automatically selects optimal attributes, filters, and window size for sensor datasets. This framework also trains the decision tree to run on the MLC and generates the configuration file to deploy the trained model. For beginners it is a quick and easy introduction to ST smart sensors that simplifies developing AI applications. In addition, to provision the IoT project, the gateway can be programmed with the Data Sufficiency Module (DSM) tool that intelligently filters data points for transmitting to the cloud, to optimise communication and minimise power consumption, and facilitates future retraining.

Users can find examples that show how to work with decision trees to build IoT sensor-to-cloud solutions, including fan-coil monitoring, asset tracking, human activity recognition, and head gestures. The examples are ready to flash and run for evaluation in ST reference IoT boards such as SensorTile.box Pro, STWIN and STWIN.box. Users can customise these examples to accelerate their own projects, bringing their own data or enhancing available datasets.

ST AIoT Craft is included in the ST Edge AI Suite repository. This contains all software tools, examples, and models for developing machine-learning algorithms to deploy on ST edge-AI devices such as STM32 microcontrollers (MCUs), Stellar MCUs, and MEMS sensors that contain the MLC or the intelligent sensor processing unit (ISPU).

https://www.st.com

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Rutronik introduces the new SoCs from Nordic Semi for next-generation (I)IoT applications

u-blox launches its first LTE Cat 1bis module with embedded eSIM

u-blox launches tri-radio module that delivers the latest wireless technologies for IoT

Web-based tool from ST accelerates AIoT projects with smart sensors

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