Mouser now stocking new TDK converters for AI, IoT, 5G, and big data

Mouser is now shipping the new FS160x µPOL DC-DC converters from TDK. The FS160x µPOL DC-DC converters feature full telemetry and increased performance in a compact, power-dense package. These converters are ideal for big data, artificial intelligence (AI), 5G cells, and IoT.

The FS160x µPOL DC-DC converters are easy to integrate and offer a wide input voltage range of 4.2V to 16V and three continuous load capacities: 3A, 4A, and 6A. The FS160x µPOL low-profile package (3.3 × 3.3 × 1.35 mm) is suitable for automated assembly using standard surface-mount equipment and features an on-chip pulse-width modulation (PWM) controller and integrated MOSFETs, with an incorporated inductor and capacitors, creating an extremely compact and accurate regulator.

The FS160x µPOLs device’s built-in protections include pre-biased start-up, overvoltage protection, soft-start protection, thermal shutdown with auto-recovery, and thermally compensated overcurrent protection with hiccup mode. The TDK FS160x µPOL DC-DC converters feature full telemetry for high power-density applications with optimised construction that delivers extraordinary power density in surprisingly small modules, with a wide operating range from -40 °C to 125 °C.

Mouser also stocks the TDK EV1603-5000-A evaluation boards, which provide a demonstration and development platform for the FS160x µPOL DC-DC converters. The evaluation boards provide an example application circuit, allowing rapid prototyping when incorporated into existing designs.

https://www.mouser.com

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Quectel Wi-Fi 6/Bluetooth 5.3 modules for smart and industrial IoT applications

Mouser is now shipping the new FCMA62N Wi-Fi 6/Bluetooth 5.3 modules from Quectel. The FCMA62N modules boast an ultra-compact LCC form factor (38.3mm × 21.6mm × 4.75mm), with multiple low-power consumption modes and custom features that provide flexibility and versatility for smart homes, industrial IoT, automotive, and medical device applications.

The Quectel FCMA62N modules are optimised for size and cost savings with an integrated, high-performance Arm® Cortex®-M33 processor running up to 260MHz. These devices support the IEEE 802.11a/b/g/n/ac/ax Wi-Fi protocol and Bluetooth Low Energy (BLE) 5.3. The modules feature built-in 1.2MB SRAM and 8MB flash, ensuring efficient performance that complies with WPA-PSK, WPA2-PSK, and WPA3-SAE security standards with an AES-128 encryption algorithm.

The FCMA62N modules support UART, SWD, and GPIO interfaces (by default), as well as SPI, I2C, I2S, and PWM interfaces in Quectel’s QuecOpen solutions. QuecOpen is a development platform that enables Quectel IoT modules to act as the main processor for an IoT device, allowing customers to program their own applications alongside the module’s standard processes. The FCMA62N modules support both the QuecOpen solution and standard AT commands with a compact protocol that enhances user product development.

The FCMA62N modules are supported by the FCMA62NABTB-0P-08 and FCMA62NABTB-1X-08 evaluation boards. The evaluation boards each feature a pre-mounted FCMA62N module, debugger, and PCB antenna.

https://eu.mouser.com

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Microchip enhances their digital signal controller lineup

Evolving security and functional safety demands, coupled with the growing complexity of real-time embedded applications, are driving designers to seek innovative solutions that deliver greater accuracy, improved reliability and compliance with industry standards. To address these challenges, Microchip Technology has added the dsPIC33AK512MPS512 and dsPIC33AK512MC510 Digital Signal Controller (DSC) families to its dsPIC33A DSC product line. The devices enable the implementation of computation-intensive control algorithms for improved energy efficiency in motor control, AI server power supplies, energy storage systems and complex sensor signal processing with Machine Learning (ML)-based inferencing.

The dsPIC33AK512MPS family delivers precise, high-speed control through 78 ps high-resolution Pulse Width Modulations (PWMs) and low-latency 40 Msps ADCs, enabling fast and accurate control loops essential for optimising the performance of Silicon Carbide (SiC) and Gallium Nitride (GaN)-based DC-DC converters. Additionally, dsPIC33AK512MPS devices include advanced security features, an integrated touch controller and a high pin count of up to 128 pins. The dsPIC33AK512MC family is designed to offer low-latency, 40 Msps ADCs and 1.25 ns PWM resolution, providing a feature- and cost-optimised solution for multi-motor control and complex embedded applications.

The dsPIC33A DSC families, with up to 512 KB Flash and a rich peripheral set, integrate a double precision floating-point unit to accelerate mathematical computations and leverage a 32-bit architecture for seamless adoption of model-based design code. Their enhanced instruction set and Digital Signal Processing (DSP) capabilities, including single-cycle MAC operations and a 200 MHz core speed, make these devices highly efficient for low-latency, real-time control applications. Supported by MPLAB Machine Learning Development Suite, dsPIC33A devices streamline the ML workflow by automating data preparation, feature extraction, training, validation and firmware conversion of optimized models.

With a range of hardware safety features, dsPIC33AK512MPS/MC DSCs are compliant with functional safety standards and are developed in accordance with International Organisation for Standardisation (ISO) 26262 and International Electrotechnical Commission (IEC) 61508 processes, making them suitable for safety-critical automotive and industrial applications. To further enhance system-level security, the dsPIC33AK512MPS DSC family includes integrated crypto accelerators and a Flash security module, enabling immutable root of trust, secure boot, secure firmware upgrades and secure debug capabilities.

https://www.microchip.com

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Tria’s new family of compute modules powered by Qualcomm processors

The new family of embedded compute modules from Tria, an Avnet company specialising in manufacturing embedded compute boards, not only have Qualcomm Dragonwing processors on board—they now support different operating systems. These options include Android, Windows 11 IoT Enterprise, and Yocto Linux. The variety of operating systems supported enable the modules to be used for embedded designs in the industrial, medical, agriculture and construction sectors, as well as any embedded application that can benefit from edge computing, machine learning and AI.

At the heart of these modules are high-performance, low-power Qualcomm Dragonwing processors, providing advanced technology in customised solutions. With advanced edge AI and seamless networking capabilities, Qualcomm Dragonwing targets embedded systems for various industries. These processors have been designed for speed, scalability and reliability, enabling customers to achieve smarter decision making, better efficiencies and to reach the market faster.

This means that Tria’s new lineup offers a powerful CPU and AI combination at lowest power consumption, enabling embedded designs to benefit from higher performance and increased capabilities.

Tria also now provides Microsoft Windows with ARM, allowing a transition from the x86 architecture to ARM with the same OS. This transition was previously not possible, since Windows on ARM was not available.

“Our collaboration with Qualcomm Technologies has enabled us to deliver high performance and low power technology with highest quality they are used to receiving from Tria in our new compute modules,” said Christian Bauer, Product Marketing Manager, Tria Technologies. “This family of modules is the only one available to offer compatibility with multiple operating systems at a competitive price.”

“With multi-OS support across Tria’s new modules powered by Qualcomm Dragonwing and Snapdragon platforms, customers gain the flexibility of Windows, Android and Linux across our different platforms”, said Douglas Benitez, Senior Director, Business Development, Qualcomm Europe, Inc. “Our collaboration with Tria is accelerating industrial innovation—delivering high performance, low power compute and accelerated AI at the edge.”

Qualcomm Dragonwing processors are known for their performance, efficiency and advanced AI capabilities, offering powerful performance in multi-core tasks and great GPU performance, but also more efficient power consumption in mobile and portable systems.

https://www.Tria-technologies.com

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