IoT

Morse Micro announces mass production of Wi-Fi HaLow SoC, modules, evaluation kit and HaLowLink 2

Tue, Sep 23, 2025

Morse Micro has announced the mass production and general availability of its second-generation MM8108 System-on-Chip (SoC). This milestone represents a major leap-forward for Wi-Fi HaLow, bringing data throughput at range, which will enable the next generation of IoT and Edge AI solutions.

The MM8108 Wi-Fi HaLow SoC, which delivers long-range Wi-Fi at speeds up to 43Mbps, is now in full-scale production. This milestone paves the way for a new generation of long-range, low-power IoT devices. Complementing the SoC’s rollout, Morse Micro has made available a series of its Evaluation Kits (EVKs):
● MM8108-EKH01, integrating Morse Micro’s MM8108 SoC with Broadcom’s BCM2711 SoC on a Linux-based Raspberry Pi 4 platform
● MM8108-EKH05, integrating Morse Micro’s MM8108 SoC with ST Microelectronics’s STM32U585 on a FreeRTOS-based IoT platform
● MM8108-EKH19, integrating Morse Micro’s MM8108 SoC on a USB-A dongle with GLi.net’s GL-MT3000 router with MediaTek’s MT7981B Wi-Fi 6 SoC

With the MM8108 entering mass production, module availability is rapidly expanding to meet growing customer demand. Morse Micro’s MM8108-MF15457 reference module is now available to the general public on Mouser.com, while AzureWave’s AW-HM677 module is available for high volume customers directly from AzureWave.

MOB-AH-8108 module is already available to support low- to mid-volume customer requirements, with full mass production scheduled for later this year. Similarly, Quectel’s modules are also scheduled for mass production later this year. This breadth of options ensures developers and OEMs have multiple pathways to integrate Wi-Fi HaLow and bring products to market faster.

As part of this announcement, Morse Micro also unveiled its next-generation evaluation platform, HaLowLink 2. Building its HaLowLink 1, the new platform upgrades the core Wi-Fi HaLow SoC from MM6108 to the MM8108, delivering 43Mbps throughput at extended range thanks to 256QAM modulation rate and 26dBm internal PA on MM8108.

Designed to make Wi-Fi HaLow adoption faster and easier, HaLowLink 2 provides a powerful reference design that simplifies evaluation, prototyping, and deployment of Wi-Fi HaLow networks.

www.morsemicro.com

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e-con Systems expands camera support for Renesas’ new RZ/G3E

Fri, Sep 19, 2025

e-con Systems has announced camera support for Renesas’ latest RZ/G3E microprocessor, strengthening its partnership with Renesas in powering next-generation embedded vision applications such as industrial automation, smart city, automotive and more. Building on their integration with Renesas’ RZ/V2N and RZ/V2H processors, e-con Systems now brings its production-ready camera modules to the newly launched RZ/G3E microprocessor.

The RZ/G3E microprocessor, part of Renesas’ scalable MPU portfolio, is engineered for low-power edge computing and advanced graphics-rich and vision-based applications, offering dual-display support, secure connectivity, and a high-performance Arm Cortex-A55 processor.

As part of its RZ/G3E-compatible offerings, e-con Systems provides:
• e-CAM22_CURZH – Full HD ultra-low light colour camera with Sony STARVIS IMX462 sensor. This camera excels in capturing high-quality images in challenging lighting conditions.
• e-CAM25_CURZH – Full HD Global Shutter camera with onsemi AR0234 sensor. Its global shutter capability, combined with a 120 fps frame rate, minimises frame-to-frame distortion, ensures distortion-free imaging for fast-moving objects.

Both cameras are equipped with a built-in ISP (Image Signal Processor), fully aligned with Renesas’ integration requirements for RZ/G3E. These modules are compatible with the RZ/G3E evaluation kit, and they are available for immediate evaluation.

“The Renesas RZ/G3E MPU’s advanced edge computing and low-power features align perfectly with our camera technology, enabling developers to build reliable and high-quality AI vision systems that operate efficiently even in demanding scenarios. Our collaboration with Renesas continues to drive innovation across industrial automation, robotics, and smart surveillance markets.” said Suresh Madhu, Head of Industrial Business Unit at e-con Systems.

“The Renesas RZ/GE is developed to target intelligent edge computing integrated with full graphics and high-speed capabilities including an Arm Ethos-U55 neural processing unit,” said Daryl Khoo, Vice President, Embedded Processing Product Group at Renesas. “We expected this collaboration with e-Con will help customers in the Vision AI market to simplify their design in order to realize faster time to market.”

www.e-consystems.com

 

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TI unlocks premium motor control with ultra-low-cost real-time MCUs

Wed, Sep 17, 2025

Texas Instruments has introduced its most affordable C2000 real-time microcontrollers (MCU). The F28E120SC and F28E120SB MCUs deliver 30% faster computing power compared to previous C2000 MCUs for single motor and power factor correction systems, helping transform the performance of home appliances, from washing machines and dishwashers to vacuum cleaners and power tools.

Powered by TI’s proprietary InstaSPIN field-oriented control (FOC) software and advanced algorithms, these new MCUs enable smoother, quieter and more efficient motor performance. Their advanced capabilities – including high-speed sensorless FOC, high-torque zero-speed startup and vibration compensation – deliver precise, responsive motor control for everyday applications.

Today’s consumers demand appliances and power tools that operate as efficiently, smoothly and quietly as possible. Yet, historically, system designers have had to compromise by using MCUs with less computing performance and analog integration to meet cost targets.

The F28E12x series of MCUs helps solve this challenge by delivering the performance needed to enable premium motor-control features at a lower price than competing devices. These MCUs eliminate additional components by integrating TI’s C28x digital signal processor core and industry-leading analog peripherals, including a high-speed analog-to-digital converter and programmable gain amplifier, helping simplify designs and lowering costs.

Moreover, TI’s F28E12x series facilitates fast execution of the sensorless FOC algorithm, enabling motor speeds over 120,000rpm, or 2kHz electrical frequency. The ability to run a motor at high speeds reduces gear transition noise and improves reliability, enabling engineers to design products with smooth, quiet operation. The MCUs can also run a vibration compensation algorithm to achieve up to 60% speed ripple reduction, counteracting the acoustic noise and vibrations caused by an imbalanced load in applications such as washing machines.

https://www.ti.com

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Infineon expands XENSIV MEMS microphone lineup

Tue, Sep 16, 2025

Infineon has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for use in demanding environments.

The IM72D128V is distinguished by its top-tier Signal-to-Noise Ratio (SNR) of 71.5 dB(A), making it particularly suited for applications requiring precise low-noise audio pick-up. It operates at ultra-low power consumption, with 430 µA in high-performance mode and 160 µA in low-power mode, which makes it ideal for energy-efficient, battery-powered devices such as high-end headphones. With a footprint of 4 x 3 x 1.2 mm³, it is still small enough to fit most space constraint consumer devices.

The IM69D129F is tailored for compact design, with a footprint of 3.5 x 2.65 x 0.98 mm³, which makes it ideal for space-constrained devices. It achieves reliable audio performance with an SNR of 69 dB(A) and features low power consumption, operating at 450 µA in high-performance mode and 170 µA in low-power mode, contributing to extended battery life in portable devices ensuring extended battery life. Its small size makes it particularly suited for multi-microphone designs in compact systems. The devices can be used in Active Noise Cancellation (ANC) headphones and earbuds, as well as high-quality audio capturing in laptops, tablets, conference systems, and cameras.

The IM72D128V and IM69D129F also support Voice User Interface (VUI) applications in smart speakers, automotive infotainment, IoT devices, and home and industrial automation. Furthermore, both microphones can be used in industrial or home monitoring applications that require audio pattern detection, such as industrial monitoring and home security systems.

In addition, the IM72D128V and IM69D129F are equipped with a low-noise preamplifier and a sigma-delta ADC, providing digital PDM output for seamless integration into modern audio systems. Their shared features include an 11 Hz flat frequency response for precise sound reproduction and a ±1 dB sensitivity tolerance, making them ideal for multi-microphone arrays. Whether used for far-field audio pick-up or portable devices, these microphones enable high-quality audio capturing in challenging environments while enhancing energy efficiency and reliability. Both microphones comply with IEC (60747, 60749) and JEDEC (47/20/22) standards, ensuring reliability and robustness for consumer and industrial applications.

www.infineon.com/mems

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