Nvidia-based modules deliver AI to the edge

Four carrier boards and a finished system from Diamond Systems are all targeted at delivering artificial intelligence (AI) at the edge computing. The family is based on Nvidia Jetson TX2, TX2i and AGX Xavier modules and target industrial and military applications, particularly those in harsh environments such as vehicles and other outdoor applications.

The Ziggy (pictured) and Jethro carriers are designed to work with the Jetson TX2 and TX2i system on modules (SoMs). Stevie and Elton implement AGX Xavier. Elton is distinguished by a PCI/104 Express expansion socket. According to Diamond Systems, Elton bridges Ai and machine learning (ML) with the durable, rugged industrial PC/104 computing ecosystem.

Elton provides support for PCI-104, PCIe/104 type 2 (x8 lane), and PCIe/104 OneBank expansion modules (4 x1 lanes), for the rapid creation of rugged, custom-configured PCIe-based computing using off-the-shelf I/O modules from a large number of manufacturers.

Another feature of all four modules is the data acquisition circuit with analogue input, analogue output and digital I/O to interface to analogue and digital sensors and controls. There is a programming library with support for custom development and an application with graphical user interface (GUI) for real time control of the data acquisition I/O and data logging.

Ziggy is the carrier for Jetson TX2 and TX2i. It is compact, measuring just 50 x 87mm. The compact ZiggyBox computer system houses the Ziggy carrier and Jetson module and has DIN rail mounting capability, both characteristics that make it suitable for equipment racks and cabinets.

Jethro measures 76 x 107mm –  slightly larger TX2/TX2i carrier – and  offers more I/O and expansion capability, as well as a rugged connector scheme, explains Diamond Systems. It includes a PCIe MiniCard socket, an M.2 SATA flash socket, and a LTE modem socket designed to work with Nimbelink SkyWire cellular modems. Pin headers can accommodate both low-cost, traditional connector technology, or more rugged latching connectors where resistance to vibration and shock are required

Stevie is a translator board that enables the Ziggy and Jethro TX2 carriers to be used with the higher performance AGX Xavier module. It is the same size as Xavier (87 x 100mm) and adds an M.2 PCIe NVMe flash socket, two CAN ports, and an additional USB 3.0 port, as well as a socket for connecting high performance cameras.

Finally, Elton is a rugged carrier board for NVidia’s Xavier SoM. It uses a PCB that is around 50 per cent thicker than the others in the family, and has latching connectors and the rugged PCI/104-Express expansion bus for the most demanding compute-intensive harsh-environment applications. It is larger too, measuring 102 x 152mm which allows it to include all the I/O and expansion of Diamond’s other carriers, namely data acquisition, M.2 and PCIe minicard sockets, and LTE modem socket.

Visit Diamond Systems at Embedded World (Hall 2, stand 2-350) for a chance to win one of three ZiggyBox Nvidia Jetson TX2 embedded computers.

http://www.diamondsystems.com

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Microcontroller has virtualisation assist for self-drive vehicles

For next-generation automotive architectures, Renesas Electronics has introduced a 28nm microcontroller with virtualisation-assisted functions. The 600MHz flash microcontroller combines enhanced built-in self-test (BIST) and a Gbit Ethernet (GbE) interface.

The company described the verification of the automotive test chip as a technological stepping stone toward the realisation of next-generation automotive-control flash microcontrollers employing a 28nm low power process.

The microcontroller has four 600MHz CPUs with a lock-step mechanism and a large flash memory capacity of 16Mbyte as well as virtualisation-assisted functions. This technology allows multiple software components to run on a single microcontroller without interfering with each other to satisfy the requirements of the highest automotive safety integrity level specified under the ISO 26262 functional safety standard for road vehicles, ASIL D.

The enhanced BIST functionality allows for microcontroller self-diagnostic fault-detection, which is necessary to implement ASIL D. The newly developed standby-resume BIST (SR-BIST) function is executed during the standby-resume period.

There is also enhanced networking functionality, including a GbE interface for high-speed transfer of sensor information.

Automotive microcontrollers need to meet the requirements of running software components with varying safety integrity levels simultaneously and without interference. Automotive control requires software independence as well as real time responsiveness. To meet these next-generation requirements, Renesas has developed new technologies led by virtualization-assisted functions for automotive-control MCUs, as demonstrated in the new test chip.

Typically, software-based (hypervisor) virtualisation requires greater processing time as it has to emulate hardware virtually. The increased processing time is problematic for automotive-control microcontrollers that must maintain real time responsiveness. The hardware-based virtualisation-assisted functions were developed to reduce the virtualisation overhead and boost responsiveness. Allowing software components to operate independently makes it possible for the microcontroller to deliver both virtualisation and real-time performance as required by ASIL D.

One way to avoid disturbing a CPU processing period is to to perform self-diagnostics in the period between when the microcontroller enters the standby state and when resume occurs. There is, however, limitation regarding current fluctuations, meaning that the increase in the current fluctuation rate caused by resume due to self-diagnostics is a concern. Renesas has developed SR-BIST to minimise the current fluctuation rate. SR-BIST runs before the CPU begins operating each time there is a transition from standby to resume. To ensure rapid start up, the on-chip oscillator supplies a clock for the fault diagnostics. An N/M divider is used to gradually increase the frequency of the clock, reducing the current fluctuation rate when SR-BIST is executing. As a result, it allows functional safety that meets the requirements of ASIL D, confirms Renesas.

Ethernet will be the high-speed communication interface to handle the volume of data generated by connected vehicles. Renesas has developed a GbE interface using 5V transistors that supports the Serial Gigabit Media Independent Interface (SGMII) standard and provides electrical noise tolerance. To deal with deterioration of the signal bandwidth due to the use of 5V transistors, dedicated circuits were added for receiver and driver. This results in signal quality that complies with the SGMII standard, says Renesas.

Renesas presented the test results at this week’s International Solid-State Circuits Conference (ISSCC) 2019, in San Francisco, USA.

http://renesas.com

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Compact LoRa module uses Renesas Synergy

Hardware and software supplied by Renesas Electronics is used by Miromicro following the companies’ collaboration to develop an enhanced LoRa module, based on Synergy.

The compact and low-power FMLR-61-x-RSS3 module is based on LoRa devices and wireless radio frequency (RF) technology. The Miromico module enables customers to connect easily to LoRaWAN-based networks and uses the Synergy platform to give customers access to microcontrollers (MCUs) and a large production-grade software package.

Engineers can use the S3A6 MCU on the LoRa-based module to handle various tasks, while seamlessly streaming data across a LoRaWAN-based network to the cloud. The LoRaWAN protocol is quickly becoming the de facto standard to connect the ‘things’ of the IoT across long distances (up to 50km), flexibly and securely, while keeping batteries alive for years.

The FMLR-61-x-RSS3 measures only 14.2 x 19.5mm. Operating voltage is 1.8 to 3.3V and power consumption ranges from 1.4 microA in sleep mode to 25.5mA (typical) in TX mode (14dBm). Receiver sensitivity is -148dBm in LoRa mode SF12 at 10.4 kHz and operating temperature range is -40 to +85 degrees C.

The licensed LoRaWAN stack has firmware over the air (FOTA) capabilities. The module’s specifications make it suitable for urban as well as rural sensing applications such as metering, asset tracking, building automation, security, wearables and predictive maintenance, says Renesas.

The FMLR-61-x-RSS3 module employs the S3A6 MCU with integrated 48MHz Arm Cortex-M4 core, and features 256kbyte code flash memory, 8kbyte data flash, and 32kbyte SRAM. Most MCU signals are available at the module level to make them externally accessible.

Manufactured in a low- power process, the S3A6 peripheral set includes analogue features such as a 14-bit SAR ADC, 12-bit DAC, op amps, and comparators. Timer channels and serial ports, USB function, CAN, DMA, and powerful safety and security hardware makes the S3A6 suitable for battery-operated applications. As part of the Renesas MCU portfolio, the S3A6 can be scaled up for more functionality or scaled down for cost optimisation.

The Renesas Synergy Platform features production-grade software in the Synergy Software Package (SSP). This includes the ThreadX RTOS and associated middleware such as a file system, USB stack, graphical user interface (GUI) software, application frameworks and functional libraries that can be used for encryption and DSP functions.

Samples of the FMLR-61-x-RSS3 LoRa module are available now from Miromico and distributor, Avnet Silica. Mass production is scheduled to start in Q2 2019.

Both Renesas and Miromico are LoRa Alliance members.

The FMLR-61-x-RSS3 demo kit will be on display at the Avnet Silica at Embedded World 2019, in Nuremberg, Germany (Hall 1 – Stand 1-370).

http://www.renesas.com

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Renesas Electronics simplifies automation network for buildings

At this year’s Embedded World, Renesas Electronics will show a proof-of-concept G3-PLC modem with KNX protocol that is claimed to simplify building automation for smart buildings.

The company has implemented KNX protocol on its G3-PLC powerline communication (PLC) solution. Based on the Powerline Modem Solution, Renesas will demonstrate a proof of concept to illustrate how to implement KNX networks and take advantage of the flexibility and efficiency of modern G3-PLC technology while eliminating the need for new network cable deployment.

Combining data line and power line onto one cable system and using the most efficient modulation techniques, PLC is a cost-efficient way to expand connectivity through the building in particular over long distances and across the walls.

Most commercial buildings have areas where RF and tradition network cabling do not reach. The Renesas Powerline Modem Solution demonstrates the possibilities for G3-PLC technology to address these needs without requiring new cable deployment by combining the advantages of the open G3-PLC standard with the popular KNX protocol. The result, says Renesas, will enable the deployment of reliable and cost-effective networking solutions for HVAC, lighting, fire and safety, and building access security.

Primarily developed for energy metering applications, the G3-PLC protocol is freely usable as an open standard and continuously maintained by the G3-PLC Alliance. 

The Renesas Powerline Modem Solution comprises Renesas’ OFDM PLC software modem (R9A06G037), a Renesas Synergy microcontroller (MCU) and the ISL15102, which serves as the power line driver. The software stack is based on the Synergy Software package (SSP) and combines the Renesas G3-PLC stack with a KNX software stack provided by Tapko Technologies. The proof-of-concept allows customers to build KNX over the G3-PLC protocol, offering a smooth migration path from existing KNX standard towards upcoming KNX IoT standard.

G3-PLC is a protocol for narrow band low frequency powerline communication that facilitates high-speed, highly-reliable, long-range communication over the existing powerline grid. The protocol is developed and maintained by the G3-PLC Alliance.

The Renesas G3-PLC Modem Solution with complete set of software supporting KNX Protocol will be available in Q3, 2019.

Visit Renesas at Embedded World in Nuremberg, Germany (26 to 28 February) Hall 1 – stand 1-310.

http://www.renesas.com

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