32-bit MCU performance optimises motor control

Based on the third generation RXv3 CPU core, the RX66T group of microcontrollers (MCUs) improves performance, by as much as 2.5 times better than previous RX family MCUs, says Renesas Electronics Europe.

The RX66T MCUs combine the powerful RXv3 core with the strengths of the existing current RX62T and RX63T MCUs, to address the real-time performance and enhanced stability required by inverter control. The RX66T MCUs are designed for use in industrial applications in smart factory equipment, such as industrial motors, power conditioners and robots, as well as smart home appliances, including air conditioners and washing machines.

When operating at 160MHz, the RX66T MCUs achieve best-in-class performance of 928 CoreMark2, enabling more precise inverter control, reports Renesas. The MCUs can control up to four motors simultaneously, making them particularly well-suited to conventional motor control and applications requiring multi-axis motor control, such as compact industrial robots and personal robots. In addition, the RX66T’s extra processing capacity allows developers to add programs utilising embedded AI (e-AI) for motor fault detection. Such programs can detect motor faults and identify fault location in real time based on the motor’s current or vibration characteristics. The RX66T MCUs also integrate a 5V power supply that is claimed to deliver “excellent noise tolerance”.

The RX66T MCU group will accelerate the use of intelligent endpoints employing real-time e-AI performance, Renesas believes, a trend which will drive smarter home appliances and improve production efficiency in smart factories.

As devices join the IoT, motorised devices in the field will require online firmware updates throughout their life cycles. Applying e-AI for predictive failure diagnostics requires endpoint MCUs to be securely updated with learning results generated in the cloud. The RX66T MCU Group incorporates Trusted Secure IP (TSIP), which has a track record of CAVP certification3 and provides secure firmware updates and encrypted communication.

The RX66T group comprises 80 MCUs with pin counts ranging from 64 to 144 pins and on-chip flash memory sizes of 256 to 1024kbyte. Mass production has started today for the 100-pin package MCU with 256 or 512kbyte of program flash and 64kbyte of SRAM. Other MCU versions will be release over time.

Renesas is demonstrating the RX66T MCUs in Hall 10.1 – booth 130 at SPS IPC Drives, 27 to 29 November 2018 in Nuremberg, Germany.

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NB-IoT shield enhances ARIS-Edge platform

An NarrowBand IoT shield by Shiratech has been added to the ARIS (Arrow Renesas IoT Synergy) platform, available from the distributor Arrow Electronics. The ARIS-Edge-NB-IoT shield features a Quectel BG96 module and plugs onto the ARIS-Edge-S3 board, which is based on the low-power Renesas Synergy S3A3 microcontroller. These two boards combined, enable users to evaluate streaming of sensor data to Microsoft’s Azure cloud via a cellular connection (2G/3G, NB-IoT or CAT-M1 depending on network availability), easily and fast.

The shield has an Arduino form factor and the low-power Quectel BG96 LTE CAT-M1 and NB-IoT modem, together with built-in GPS plus an antenna. Download speed up to 300kbits per second and upload up to 375kbits per second are supported. The ARIS-Edge-S3 board features a radio module with Bluetooth Low Energy (BLE 4.1/4.2), Thread, and ZigBee stacks. The kit is suitable for home automation, smart meters, smart lighting, wearable electronics, medical monitors and industrial sensing. Arrow plans to add a LoRa shield as well.

The ARIS-Edge-S3 features a Bosch Sensortec BNO055 nine-degrees-of-freedom (9-DOF) application specific sensor node (ASSN). This sensor is widely used in robotics, augmented and virtual reality, drones, gaming, and other industrial applications. There is also an on-board BME280 environmental sensor from Bosch Sensortec, which combines temperature, humidity and pressure sensing, a separate MEMS microphone and an ambient light sensor for contextual awareness.

Arrow’s ARIS-Edge concept connects developers with the Renesas Synergy platform giving access to an optimised operating system, qualified stacks, consistent software libraries, and APIs that streamline IoT-device development and lower total cost of ownership.

Arrow Electronics maintains a network of more than 345 locations serving over 80 countries.

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Low power SOTB process technology means no batteries to power IoT devices

Renesas Electronics believes its energy-harvesting embedded controller can eliminate the need to use or replace batteries in IoT devices. The process was developed based on Renesas’ silicon-on-thin-buried-oxide (SOTB) process technology to achieve an “extreme reduction in both active and standby current consumption”. The company says this combination was not previously possible to achieve in conventional microcontrollers. These low current levels of the SOTB-based embedded controller enables system manufacturers to use harvesting ambient energy sources such as light, vibration, and flow and eliminate batteries. The use of extreme low-power and energy harvesting gives rise to a new market of maintenance-free connected IoT sensing devices with endpoint intelligence for applications in industrial, business, residential, agricultural, healthcare, and public infrastructure, as well as health and fitness apparel, shoes, wearables, smart watches, and drones.

Renesas’ first commercial product using SOTB technology, the R7F0E embedded controller, is a 32-bit, Arm Cortex-based embedded controller capable of operating up to 64MHz for rapid local processing of sensor data and execution of complex analysis and control functions. Consuming just 20 microA/MHz active current, and only 150 nanoA deep standby current, approximately 10% of conventional low-power microcontrollers, the R7F0E is suited for extreme low-power and energy harvesting applications.

The R7F0E has a configurable energy harvest controller (EHC) function that increases robustness and minimises costly external components. The EHC enables direct connection to many different types of ambient energy sources, such as solar, vibration, or piezoelectric, while protecting against harmful inrush current at start-up. The EHC also manages the charging of external power storage devices, such as supercapacitors or optional rechargeable batteries.

Other system characteristics for extreme low power are the ability to sense and capture external analogue signals at all times because the 14-bit ADC consumes only three microA. There is also the ability to retain up to 256kbyte of SRAM data content while consuming just one nanoA per kbyte SRAM. It can also provide graphics data conversion including rotation, scroll, and colorisation with low-power hardware techniques for driving an external display using memory-in-pixel (MIP) LCD technology that consumes virtually no power to retain an image.

Yoshikazu Yokota, executive vice president and general manager of Industrial Solution Business Unit of Renesas said: “By removing the need for batteries, or the need to replace batteries, new markets will open for us and our customers. Energy harvesting will become a mandatory technology for a smart society . . . Renesas continues to push forward with e-AI to realize AI at the endpoint, in embedded devices. Looking forward, our SOTB technology will expand our reach into use cases where combining e-AI and energy harvesting will make a very large positive impact to our day-to-day lives”.   

Samples of the R7F0E embedded controller are available now for beta customers, and samples are scheduled to be available for general customers from July 2019. Mass production is scheduled to start from October 2019.

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Two Xeon processor additions target HPC and AI

Intel announces two member of its Xeon processor portfolio. The Cascade Lake advanced performance processor is expected to be released the first half of 2019 and the Intel Xeon E-2100 processor for entry-level servers is available now.

Cascade Lake represents a new class of Intel Xeon Scalable processors designed for the most demanding high-performance computing (HPC), artificial intelligence (AI) and infrastructure-as-a-service (IaaS) workloads. The processor incorporates a performance optimised multi-chip package to deliver up to 48 cores per CPU and 12 DDR4 memory channels per socket.

Cascade Lake advanced performance processors will deliver both core CPU performance gains and leadership in memory bandwidth constrained workloads, promises Intel. Performance estimates include Linpack up to 1.21x versus Intel Xeon Scalable 8180 processor and 3.4×2 versus AMD EPYC 7601; Stream Triad up to 1.83x versus Intel Scalable 8180 processor and 1.3×2 versus AMD EPYC 7601;

AI/deep learning inference up to 17x images-per-second versus Intel Xeon Platinum processor at launch.

Intel SGX on the Intel Xeon E-2100 processor family delivers hardware-based security to secure customer data and applications. This feature allows new entry-level servers featuring an Intel Xeon E-2100 processor to provide an additional layer of hardware-enhanced security measures when used with properly enabled cloud applications.

The Xeon E-2100 processor is targeted at small- and medium-size businesses and cloud service providers. It supports workloads suitable for entry-level servers as well as any computing applications requiring enhanced data protection for sensitive workloads.

The Intel Xeon E-2100 processor-based servers will support the latest file-sharing, storage and backup, virtualisation, and employee productivity solutions.

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