dSpace integrates development and test for smart charging

The DS5366 Smart Charging Solution from dSpace offers automobile manufacturers and charging station providers developing and testing technologies for smart charging. International standards are adhered to and interoperability guaranteed, says the company. There is support for developers of onboard chargers, charging columns and, in the future, inductive charging systems.

The DS5366 Smart Charging Solution integrates existing test systems and a test depth that can be adjusted, depending on customer requirements. Extensive manipulations are possible, both at the electrical and at the protocol level. The software element of the solution contains an open model and there is a special hardware module for communication, according to ISO 15118, for an adaptation to the powerline communication.

All communication events are logged to allow for manual or automatic checks of the intended behaviour and compliance with the protocol specification. This can also be used to perform an error diagnosis to support conformance testing.

Typical applications are tests of the on-board chargers and charging stations, as well as the communication modules according to various charging standards. It can also be used in error simulation during communication. The dSpace DS5366 Smart Charging Solution enables the simulation of a variety of charging stations in the lab, emulates communication errors, and ensures that the engine control unit (ECU) functions without errors.

It will also be possible to test the compatibility between the developed charging stations and numerous simulated vehicles during tests on the charging station, dSpace adds.

For the development of on-board chargers, if no software or hardware is available for charging communication during the development of a vehicle charge controller, the DS5366 can replace the vehicle ECUs or their communication controllers for testing in-vehicle prototypes.

In combination with dSpace Automotive Simulation Models (ASM), which is the tool suite for simulating motors, vehicle dynamics, electric components, and the traffic environment, the DS5366 can be used for battery-powered electric vehicles, including real-time, high-voltage battery simulation. The models include emulation of a charging station in which the charging voltage depends on the vehicle power consumption, which is determined by the charging control unit that is tested in the vehicle. If no charge controller is available, ASM lets users simulate a controller using a constant current constant voltage (CCCV) charging process. Demo models are prepared in such a way that all signals required for communication with the control units are available to test control algorithms and the interfaces between all devices, according to CHAdeMO, ISO 15118, and GB/T 20234.2 standards.

http://www.dspace.de

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Ethernet 800G Verification IP meets networking demands

Meeting the increases in bandwidth for video-on-demand, social networking and cloud services, Synopsys has introduced the Native System Verilog Ethernet VIP to complement its 112G high-speed SerDes PHY IP to enable high-performance cloud computing. It is claimed to be the industry’s first verification IP (VIP) and Universal Verification Methodology (UVM) source code test suite for Ethernet 800G.

The Synopsys VC VIP for Ethernet 800G is based on the Ethernet Technology Consortium (ETC) specification. It enables SoC teams to design next-generation networking chips for data centres with ease of use and fast integration, to accelerate verification closure and time-to-market. The VC VIP is used to verify Synopsys’ DesignWare 56G Ethernet, 112G Ethernet, and 112G USR/XSR PHYs for FinFET processes, which designers can integrate into 800G SoCs.

The ETC standard provides specifications for an 800G implementation based on eight lane x 100Gbits per second technology, enabling adopters to deploy advanced high bandwidth interoperable Ethernet technologies.

Francois Balay, president of MorethanIP, believes the Synopsys VC VIP will prove an advantage to developers. “Being first in the industry, Synopsys VIP, source code test suite and DesignWare IP for Ethernet 800G strengthens the ecosystem and facilitates early adoption of the technology and fast development of high-speed networking applications,” he said.

Synopsys VC VIP for Ethernet uses a native System Verilog UVM architecture, protocol-aware debug and source code test suites. It can switch speed configurations dynamically at run time and includes an extensive and customisable set of frame generation and error injection capabilities. Source code UNH-IOL test suites are available for key Ethernet features and clauses, to facilitate custom testing and accelerate verification closure.

Synopsys VC VIP and source code test suite for Ethernet 800G are both available today as early access standalone products. The DesignWare 56G and 112G Ethernet PHYs are available now and the silicon design kit for the DesignWare USR/XSR PHY IP in 7nm FinFET process is also available.

http://www.synopsys.com

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Optiga Connect 5G authenticates mobile consumer devices

Infineon has extended its embedded SIM (eSIM) portfolio, adding the Optiga Connect eSIM for mobile consumer devices. It supports all GSMA standards from 3G to 5G and securely authenticates the device to the chosen subscribed carrier network of choice. It has a small imprint, making it suitable for smartphones, tablets and wearable devices (smart watches or fitness trackers).

Based on Infineon’s SLC37 security chip, the new Optiga Connect meets the GSMA’s security requirements and is tested according to Common Criteria CC EAL4+ high. The SLC37 secures sensitive keys and data against fraudulent use. The Optiga Connect eSIM complies with the latest 5G specifications from the GSMA (SIMAlliance Profile Interoperability 2.3 Spec) and the 3GPP. It supports the profiles of major mobile network providers with Remote SIM Provisioning capabilities and offers up to 1.2Mbyte of free user memory for network operator profiles, data and additional applications. The package measures just 2.9 x 2.5 x 0.4mm for the restricted PCB space of many new consumer applications.

ABI Research predicts that global shipments of eSIM enabled smartphones will reach over 225 million in 2020 and it expects a minimum of 500 million eSIM-capable smartphones to ship gloabally in 2024.

The Optiga Connect eSIM consumer chip be available from March 2020.

http://www.infineon.com

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MSC HCC-CFLS client module series is first in Avnet’s new line-up

Based on the new PICMG COM-HPC Client standard, Avnet Integrated has launched the first of the company’s Computer-On-Module for High Performance Computing (COM-HPC) product line, the MSC HCC-CFLS client module series.

The MSC HCC-CFLS client module family suits a range of applications, including human machine interface systems, complex industrial controls, monitoring systems with numerous sensors, artificial intelligence solutions, industrial Internet of Things applications, medical devices and gaming systems.

The client interface offers a large selection of graphic interfaces, 1G and 10G Ethernet ports, PCI Express interfaces and USB ports. In addition, Avnet Integrated provides the appropriate COM-HPC client carrier board MSC HC-MB-EV, including comprehensive design support, for a first evaluation of the high-performance computing modules in the new standard for rapid prototyping and for fast application development.

The MSC HCC-CFLS COM-HPC client module family is based on the 9th generation socketed Intel Core S processor family, which the company says ensures high scalability – from cost-effective, entry-level variants to high-end processors with up to eight cores and 16 threads.

The new COM-HPC Computer-On-Module standard was optimised by PICMG for powerful high-performance computing applications that focus on high computing and graphics performance with high data throughput. In contrast to the server form factors, the client variants also offer a selection of graphics interfaces.

Available in a range of module variants, the MSC HCC-CFLS COM-HPC client product family ranges from Intel Celeron processors to high-performance Intel Xeon and Intel Core i7 processors with thermal design power from 35 W to 80 W.

For data-intensive applications, the modules can be equipped with up to 64 GB DDR4-2666 SDRAM with optional error checking and correction.

The modules’ graphics support graphics acceleration and hardware-based video encoding/decoding. Up to three independent display units, with a maximum resolution of 4k x 2k, can be connected via three DDI interfaces and one eDP interface.

The PCI Express Graphics x16 port based on PCIe Gen3 enables the integration of external graphics and artificial intelligence accelerators. In addition, further interfaces including 16 PCI Express x1 lanes, USB 3 Gen1 and 2, SATA 3.0, 1G and 10G Ethernet as well as GPIOs are available on the COM-HPC boards.

The MSC HCC-CFLS module family corresponds to the COM-HPC size C form factor and has dimensions of 160 x 120 mm. The module height is determined by the cooling solutions, which depend on the thermal requirements.

http://www.avnet.com

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