Embedded

Optiga Connect 5G authenticates mobile consumer devices

Mon, Mar 16, 2020

Infineon has extended its embedded SIM (eSIM) portfolio, adding the Optiga Connect eSIM for mobile consumer devices. It supports all GSMA standards from 3G to 5G and securely authenticates the device to the chosen subscribed carrier network of choice. It has a small imprint, making it suitable for smartphones, tablets and wearable devices (smart watches or fitness trackers).

Based on Infineon’s SLC37 security chip, the new Optiga Connect meets the GSMA’s security requirements and is tested according to Common Criteria CC EAL4+ high. The SLC37 secures sensitive keys and data against fraudulent use. The Optiga Connect eSIM complies with the latest 5G specifications from the GSMA (SIMAlliance Profile Interoperability 2.3 Spec) and the 3GPP. It supports the profiles of major mobile network providers with Remote SIM Provisioning capabilities and offers up to 1.2Mbyte of free user memory for network operator profiles, data and additional applications. The package measures just 2.9 x 2.5 x 0.4mm for the restricted PCB space of many new consumer applications.

ABI Research predicts that global shipments of eSIM enabled smartphones will reach over 225 million in 2020 and it expects a minimum of 500 million eSIM-capable smartphones to ship gloabally in 2024.

The Optiga Connect eSIM consumer chip be available from March 2020.

http://www.infineon.com

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MSC HCC-CFLS client module series is first in Avnet’s new line-up

Thu, Feb 27, 2020

Based on the new PICMG COM-HPC Client standard, Avnet Integrated has launched the first of the company’s Computer-On-Module for High Performance Computing (COM-HPC) product line, the MSC HCC-CFLS client module series.

The MSC HCC-CFLS client module family suits a range of applications, including human machine interface systems, complex industrial controls, monitoring systems with numerous sensors, artificial intelligence solutions, industrial Internet of Things applications, medical devices and gaming systems.

The client interface offers a large selection of graphic interfaces, 1G and 10G Ethernet ports, PCI Express interfaces and USB ports. In addition, Avnet Integrated provides the appropriate COM-HPC client carrier board MSC HC-MB-EV, including comprehensive design support, for a first evaluation of the high-performance computing modules in the new standard for rapid prototyping and for fast application development.

The MSC HCC-CFLS COM-HPC client module family is based on the 9th generation socketed Intel Core S processor family, which the company says ensures high scalability – from cost-effective, entry-level variants to high-end processors with up to eight cores and 16 threads.

The new COM-HPC Computer-On-Module standard was optimised by PICMG for powerful high-performance computing applications that focus on high computing and graphics performance with high data throughput. In contrast to the server form factors, the client variants also offer a selection of graphics interfaces.

Available in a range of module variants, the MSC HCC-CFLS COM-HPC client product family ranges from Intel Celeron processors to high-performance Intel Xeon and Intel Core i7 processors with thermal design power from 35 W to 80 W.

For data-intensive applications, the modules can be equipped with up to 64 GB DDR4-2666 SDRAM with optional error checking and correction.

The modules’ graphics support graphics acceleration and hardware-based video encoding/decoding. Up to three independent display units, with a maximum resolution of 4k x 2k, can be connected via three DDI interfaces and one eDP interface.

The PCI Express Graphics x16 port based on PCIe Gen3 enables the integration of external graphics and artificial intelligence accelerators. In addition, further interfaces including 16 PCI Express x1 lanes, USB 3 Gen1 and 2, SATA 3.0, 1G and 10G Ethernet as well as GPIOs are available on the COM-HPC boards.

The MSC HCC-CFLS module family corresponds to the COM-HPC size C form factor and has dimensions of 160 x 120 mm. The module height is determined by the cooling solutions, which depend on the thermal requirements.

http://www.avnet.com

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Embedded safety controller is ‘first to be ASIL-D certified to ISO 26262:2018’

Wed, Feb 26, 2020

Infineon Technologies second generation Aurix (TC3xx) microcontrollers are the first embedded safety controllers worldwide to be certified for the highest automotive safety integrity level (ASIL D), according to the latest version of the ISO 26262 standard.

This standard describes a globally binding procedure for the development and production of safety-critical systems in cars. In December 2018, the current version of the standard replaced the original version from 2011. The certificate was issued by SGS TUEV Saar.

“This certification underpins our leadership in automotive safety,” said Peter Schaefer, vice-president and general manager automotive microcontrollers at Infineon. “We defined the safety architecture of our second generation Aurix microcontrollers before the new version of ISO 26262 was even available, and yet it fulfills all requirements for an ASIL D safety controller. We have achieved this through a holistic approach to safety that resulted in a sophisticated and robust architecture. Second generation Aurix microcontrollers thus provide the safety and trust necessary to make automated driving happen.”

AURIX TC3xx devices have up to six processor cores with 300 MHz clock frequency each. Up to four of them have an additional Lockstep core. With around 3,000 DMIPS, Aurix allows for functionally safe computing power supporting ASIL D among safety microcontrollers. Other features include safe internal communication buses and a distributed memory protection system.

Aurix allows the integration of software with different safety levels from different sources. This allows multiple operating systems and applications, such as steering, braking, airbag and driver assistance systems, to be hosted on a common platform.

As well as computing platforms for automated driving using Aurix as their safety host controller, the microcontrollers are used in radar systems for processing sensor data, in engine and transmission control, brake, airbag and steering systems, central gateways, domain control units, hybrid and electric cars, among other applications.

http://www.infineon.com

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iMotion IMC300 adds Arm MCU for variable speed drive flexibility

Mon, Feb 24, 2020

Infineon Technologies AG has released the IMC300 motor controller series combining the iMotion Motion Control Engine (MCE) with an additional microcontroller based on the Arm Cortex-M0 core.

IMC300 complements the IMC100 series and is aimed at variable speed drives that require high application flexibility. Both families, IMC100 and IMC300, share the same implementation of MCE 2.0 providing ready-to-use motor and optional PFC control.

Applying the MCE for controlling the motor, customers can focus on their system application that runs fully independently on the embedded Arm microcontroller.

Infineon’s field-proven MCE 2.0 implements efficient field oriented control of permanent magnet synchronous motors. The MCE integrates all required hardware and software building blocks as well as all necessary protection features resulting in a reduced bill of material. It undergoes continuous improvements with typically two releases per year.

The autonomous MCU offers a flexible peripheral set and can serve a multitude of purposes such as system functions, specific communication or drive monitoring. IMC300 devices are pre-certified for applications requiring functional safety according to UL/IEC 60730 (‘Class B’).

IMC300 derivatives are offered for motor drives with and without PFC control. Devices in LQFP-64 packages are in mass production, and LQFP-48 types will be released in the second quarter 2020.

Rapid prototyping of a drive inverter is enabled via two new control boards for the iMotion modular application design kit (MADK). MADK is a modular and flexible development platform providing a range of control and power board options for motor drive applications up to 1kW.

Infineon will showcase the new IMC300 series at Embedded World in Nuremberg, February 25 to 27, booth 225, hall 3A.

Highlights include solutions for automated driving and in-vehicle health monitoring, wireless charging, drones as well as automotive and industrial motor control.

http://www.infineon.com

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