Cadence adds DSP IP cores for always-on applications

Two DSP IP cores for embedded vision and artificial intelligence (AI) have been added to Cadence Design System’s Tensilica Vision DSP family.

The Vision Q8 and Vision P1 DSPs are designed for automotive, mobile and consumer markets. The Cadence Tensilica Vision Q8 DSP delivers what is claimed to be an industry-leading 3.8T operations per second (TOPS), to double performance and memory bandwidth compared to the Tensilica Vision Q7 DSP. It also increases energy efficiency for high-end vision and imaging applications in the automotive and mobile markets. The Tensilica Vision P1 DSP is an energy-efficient DSP, optimised for always-on and smart sensor applications in the consumer market.

Based on the SIMD and VLIW architecture found in the existing Tensilica Vision DSPs, the Vision Q8 and Vision P1 DSPs feature an N-way programming model that preserves software compatibility for an easy migration from earlier Tensilica Vision DSPs with different SIMD widths. Like the rest of the Tensilica Vision DSP family, the Vision Q8 and Vision P1 DSPs support Tensilica Instruction Extension (TIE) language, allowing customers to customise the instruction set. Both DSPs also support Xtensa Neural Network Compiler (XNNC) and the Android Neural Networks API (NNAPI) for neural network support. In addition, they support more than 1,700 OpenCV-based vision library functions, OpenCL and the Halide compiler for computer vision and imaging applications. Both cores are automotive-ready with ASIL B hardware random faults and ASIL D systematic fault certification.

The seventh-generation Tensilica Vision Q8 DSP is optimised for mobile and multi-camera automotive applications. The single core simplifies system design, reducing power by up to 20 per cent, claims Cadence while an up to four-fold improvement in performance for non-convolution layers addresses the AI workload.

The Tensilica Vision P1 DSP is optimised for always-on applications including smart sensors, AR/VR glasses and IoT/smart home devices. The 128-bit SIMD architecture delivers 400G operations per second (GOPS) and offers one third the power and area, compared to the Vision P6 DSP, yet with 20 per cent higher frequency, says Cadence. The architecture is optimised for small memory footprint and operation in low power mode.

The Tensilica Vision Q8 and Vision P1 DSPs support Cadence’s Intelligent System Design strategy. The Tensilica Vision Q8 DSP is available now, while the Tensilica Vision P1 DSP is expected to be available for general release in the second quarter of 2021.

http://www.cadence.com

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Impulse Embedded adds Axiomtek’s DIN-rail mounted IoT gateway for cars

Vehicle IoT applications can be served by the UST210-83K-FL. Axiomtek’s compact DIN-rail fanless in-vehicle box PC is powered by the Intel Atom x5-E3940 processor (codenamed Apollo Lake-I). The PC is now available from Impulse Embedded.

The UST210-83K-FL has been specifically designed for in-vehicle applications such as vehicle controls, fleet monitoring, management systems and in-vehicle edge computing. It is compatible with Windows 10 and Linux Ubuntu 18.04.

The in-vehicle IoT gateway provides secure bi-directional communications for public transport and shuttle buses, police cars, ambulances, commercial vehicles and heavy-duty trucks. According to Impulse Embedded it is not only cost-effective but its fanless design removes acoustic noise while increasing reliability.

The versatile PC can be DIN-rail or wall-mounted. It is rugged for in-vehicle use and features front-accessible I/O ports for easy access and maintenance and a smart ignition function for power on/off scheduling to protect vehicle battery. The UST210-83K-FL complies with ISO 7637-2 and can endure vibration of up to 3Grms, for stable and reliable operation under challenging environmental conditions.

It can operate over a wide temperature range from -40 to +70 degrees C and it passes MIL-STD-810G shock and vibration resistance certifications. It has a wide input voltage range from 9.0 to 36V DC to accommodate most vehicle types and is CE- and FCC-certified. It supports COM, CAN, USB, PoE and SocketCAN as well as 8-bit programmable DIO and AMS.AXView intelligent remote monitoring. It also features Trusted Platform Module 2.0 (TPM 2.0) for critical information security.

There is one DDR3L-1866 SO-DIMM slot with a maximum of 8Gbyte of system memory. The configurable design supports an array of functional I/O ports, including two COM ports or one COM port and one CANBus 2.0 A/B port supporting SocketCAN, one HDMI port, four RJ-45 Gigabit PoE ports or four RJ-45 Gigabit LAN ports (with Intel Ethernet Controller I211-AT), two USB 3.0 ports, one DB9 8-bit programmable DIO port and four antenna openings. It also has one full-size PCI Express Mini Card slot (USB interface with SIM socket) and one half-size PCI Express Mini Card slot (mSATA/USB interface) for a wide selection of modules. A half-size mSATA can be used in the PCI Express Mini card slot and an internal 2.5-inch SATA drive are available for additional storage.

https://www.impulse-embedded.co.uk/

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Sensor fusion creates software alternative for autonomous indoor bots

Precise dead reckoning software can save indoor robots the cost of expensive camera or lidar-based systems, says Ceva, as it introduces MotionEngine Scout.

MotionEngine Scout can also be used for indoor robots and autonomous mobile robots (AMRs) in industrial or commercial settings.

The sensor and processor-agnostic embedded software fuses measurements taken from the robot’s optical flow sensor, wheel encoders and inertial measurement unit (IMU) to deliver dead reckoning accuracy above individual sensor errors. According to Ceva, it reduces the trajectory error by a factor of five on vinyl, tile, and various styles of carpet flooring.

Chad Lucien, vice president and general manager of the sensor fusion business unit at Ceva believes: “MotionEngine Scout paves the way for a new class of indoor robots that can intelligently navigate their environment while enabling OEMs to achieve the challenging price points necessary to meet end user demand.”

MotionEngine Scout simplifies and accelerates an OEM integration timeline by providing a single software package that interfaces with the IMU, optical flow sensor and wheel encoders. It also provides an integrated sensor output with the unified robot pose (includes location and orientation in 3D space).  It supports a broad range of commercial IMU sensors from market leaders, including STMicroelectronics, Bosch-Sensortec, and TDK InvenSense for supply chain flexibility, reducing the risk of supply shortages and providing options for cost and performance trade-offs.

Ceva has partnered with PixArt to incorporate its PAA5101 dual light optical tracking sensor.

PixArt’s director of strategic marketing, Charles Chong, adds: “Our PAA5101 sensor and the MotionEngine Scout software combines to deliver a robust, high-performance solution, without the need for customised sensors or lenses, lowering the overall [bill of materials] BoM and simplifying the design effort.”

MotionEngine Scout joins Ceva’s portfolio for autonomous indoor robots which includes MotionEngine Robotics software, the FSP200 sensor hub, the BNO086 system-in-package, and the FSM300 module.

Ceva also offers complementary intellectual property (IP) products required for autonomous robots, including its RivieraWaves Bluetooth and Wi-Fi platforms for connectivity and its SensPro2 sensor hub digital signal processor (DSP) which is capable of handling multiple sensor processing workloads from sensors such as cameras, lidar and IMUs.

MotionEngine Scout is available for evaluation now.

http://www.ceva-dsp.com 

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Industry-wide partnerships result in SOSA-aligned development platform

Integration is accelerated with the Pentek Model 8256 3U VPX platform which has been developed with several partners and key contributors to the emerging SOSA (Sensors Open System Architecture) technical standard.

The Model 8256 VPX platform has the intelligent platform management interface (IPMI) and connectivity for RF and optical interfaces. The eight 3U VPX slots can be used for a variety of acquisition and processing modules. The Model 8256 is a ready-to-run development platform for Pentek’s Models 5550 and 5553 eight-channel A/D and D/A Zynq UltraScale+ RFSoC processors. It can be used for application development with Pentek’s Quartz RFSoC data acquisition and processing boards.

Several Pentek partners and key contributors to the emerging SOSA Technical Standard are involved in the development of this platform. Pentek teamed up with Elma Electronic for backplane and system management components, Interface Concept for backplane switch modules, Concurrent Technologies for single board computer modules, and Crossfield Technology for IPMI and chassis management support; all specifically designed to be in alignment with the SOSA Technical Standard.

The Open Group SOSA Consortium created a common framework, the emerging SOSA Technical Standard, for sensor systems based on key interfaces and open standards established by industry-government consensus. The forthcoming SOSA Technical Standard implements numerous VITA standards that are reflected in the Pentek Model 8256 configuration which also takes advantage of several advanced features including cooling, platform system management and RF/optical interface options.

The Model 8256’s built-in forced-air cooling is designed to support conduction-cooled boards in a standard 19-inch rackmount profile chassis. This provides the convenience of development on conduction-cooled boards in a desktop or laboratory environment.

Pentek’s SOSA aligned development chassis uses VITA 46.11 and HOST-aligned chassis management module (CMM). This CMM is software upgradeable to the forthcoming SOSA v1.0 standards. SOSA-aligned systems will feature, and the CMM will enable, meaningful integration between the functional elements (SOSA modules) and the system manager, the CMM and every plug-in card (PIC).

Each RF payload slot in the Model 8256 can be optioned with 20 coaxial breakout connectors located on the back panel of the chassis providing direct connections to the VITA 67.3C backplane connector. In addition, each RF payload slot can be optioned with two rear panel MPO adapters to provide access to the VITA 67.3C dual optical interfaces.

Pentek said that customers can be up and running quickly because there are no initial start-up and configuration issues. To reduce the development effort and risk, Pentek offers integration assistance to select and configure modules.

The Model 8526 platform includes a backplane from Elma Electronic. Ken Grob, director of embedded computing, Elma Electronic, said “This SOSA-aligned development platform is delivered ready-to-use and tested, saving engineers much needed development time”.

Concurrent Technologies provided the single board computer. “The Model 8256 is an ideal development platform for Pentek’s Models 5550 and 5553 eight-channel A/D and D/A Zynq UltraScale+ RFSoC 3U VPX processors in conjunction with our compute intensive TR H4x single board computer,” said Brent Salgat, president, Concurrent Technologies. The modules and platform are particularly suitable for radar, electronic warfare, signals intelligence, electro-optical and communications applications, added the company.

“The MOSA-aligned goals of the emerging SOSA Technical Standard go beyond common OpenVPX hardware slot profiles,” observed Terry Hulett, products general manager, Crossfield Technology. “To be truly interoperable with each other, the system software must have common access and interfaces into system management functions, he said. “Pentek’s Model 8256 development platform not only provides access to leading edge hardware, but does so with open-standards-based chassis management capabilities for just such common access.”

The Model 8256 is immediately available. Several options for Quartz RFSoC data acquisition and processing boards, RF and optical interconnections are possible. Pentek integration assistance is available to select and configure modules that are most appropriate for prototyping specific applications.

http://www.pentek.com

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