Starter kit for AI vision systems is based on a SMARC CoM

For artificial intelligence (AI) accelerated intelligence embedded vision applications, congatec has announced the i.MX 8M Plus starter set based on a SMARC computer on module (CoM) with i.MX 8M Plus processor. The new processor from NXP has an integrated neural processing unit (NPU).

The i.MX 8M Plus processor delivers up to 2.3 Toperations per second (TOPS) performance for deep learning based AI. It can run inference engines and libraries such as Arm Neural Network (NN) and TensorFlow Lite. It also integrates seamlessly with Basler embedded vision software to give OEMs an application-ready embedded platform for the development of AI accelerated embedded vision systems.

The starter set contains the entire ecosystem developers need to instantly start designing applications for vision and AI integration, says congatec.

The SMARC 2.1 CoM conga-SMX8-Plus features four powerful Arm Cortex-A53 cores, one Arm Cortex-M72 controller and the NXP NPU to accelerate deep learning algorithms. It is also equipped with passive cooling.

The 3.5 inch carrier board conga-SMC1/SMARC-ARM directly connects the 13Mpixel Basler dart daA4200-30mci BCON for MIPI camera with an F1.8 f4mm lens via MIPI CSI-2.0 without any additional converter modules. As well as MIPI CSI-2.0, USB and GigE vision cameras are also supported.

congatec provides a bootable SD card with pre-configured boot loader, Yocto OS image, matching board support packages (BSPs), and processor-optimised Basler embedded vision software enabling immediate AI inference training on the basis of captured images and video sequences.

Typical applications range from price sensitive automated checkout terminals in retail environmetns to building safety, and from in-vehicle vision for navigation to surveillance systems in buses. They can also be used in industry, for example in human machine interfaces (HMIs) with vision based user identification and gesture based machine operation as well as vision supported robotics and industrial quality inspection systems.

The kit is designed to support the development of vision-based sytems. “A dedicated processing unit for neural algorithms that is supported by open source AI software solutions such as TensorFlow is an efficiency accelerator for many vision based systems,” said Martin Danzer, director product management at congatec. He added: When all this is integrated as an application ready, hardware and software validated platform including Basler pylon Camera Software Suite, it puts developers on a fast track to designing NPU accelerated smart vision applications.”

The Basler pylon Camera Software Suite delivers a unified software development kit for BCON for MIPI, USB3 vision and GigE vision cameras, and enables camera access from source code, GUI or third party software. The high-performance pylon viewer allows for camera evaluation.

The congatec i.MX 8M Plus starter set for AI accelerated vision applications provides engineers instant access to AI-supported machine vision features such as triggering, individual image capture, and highly differentiated camera configuration options. There is also access to customised inference algorithms on the basis of the Arm NN and TensorFlow Lite ecosystem.

https://www.congatec.com

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Keil Studio Cloud accelerates IoT development says Arm

Two initiatives have been announced by Arm for embedded, IoT, ML, and MCU software developers. The Open-CMSIS-Pack project will deliver the infrastructure to integrate and manage software components and improve code reuse across projects, while Keil Studio Cloud provides a cloud-hosted platform with direct Git integration and modern CI workflows for rapid IoT device development.

Software compatibility for component re-use in the IoT presents a challenge as the IoT landscape is much more diverse at the hardware level compared to PCs or the data centre. In response, Arm offers the Common Microcontroller Software Interface Standard (CMSIS). This vendor-independent abstraction layer for microcontrollers, specifically for Arm Cortex-M processors, includes CMSIS-Pack, a packaging technology that supports nearly 9,000 different microcontrollers. It is designed to make project integration of drivers, middleware and other software components across multiple Arm-based devices much easier.

Arm is now moving parts of CMSIS into an open project called Open-CMSIS-Pack, which will deliver the infrastructure to integrate and manage software components and improve code reuse across projects. The Open-CMSIS-Pack project will begin its life as an incubation initiative under the Linaro IoT and Embedded Group, focusing on a standard for software component packaging and related foundation tools for validation, distribution, integration, management, and maintenance.

The initial focus of the Open-CMSIS-Pack project will be command-line tools and CMake workflows that enable the broader ecosystem to integrate CMSIS-Pack-based development flows. This project is the starting point for evolving the CMSIS-Pack technology into a true open standard for microcontroller software component packaging, targeting key interfaces for major IoT platforms and producing a framework that can be embraced across the ecosystem.

The second announcement is simplified cloud-based IoT development tools in Keil Studio Cloud. This is the first component of the next-generation Keil tool suite. This early access beta will allow developers to experience the Keil Studio workflow first hand with a limited set of supported development boards and features. The tool will evolve over several software releases, delivering a desktop and cloud experience that will provide developers with:

An integrated development environment runs in the browser and connects directly to boards on a desktop. There is no complicated tool installation, and example projects along with the related resources are always up to date so developers can have code running on a device within minutes, assures Arm.

Direct Git integration enables distributed teams, collaborative development, and modern CI workflows that leverage Arm modelling technology.

Flexible cloud-hosted development first introduced by the Mbed Online Compiler, with professional Keil capabilities such as CMSIS-Pack software components and run-control debug.

A portal for the broader software ecosystem to collaborate on, submit examples and share feedback will be available in a later release in 2021.

Combined with Keil MDK, Keil Studio will offer the best-in-class IoT, machine learning (ML) and embedded development environment even for the most demanding real-time and functional safety projects, says Arm.

https://www.keil.arm.com/

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MicroSys Electronics bases automotive gateway SoM on NXP S32G274A

Believed to be the first system on module (SoM) with NXP Semiconductor’s S32G274A processor.   

The miriac MPX-S32G274A SoM features 1GHz quad Arm Cortex-A53 cores with Arm Neon technology organised in two clusters for applications and services. For real-time tasks, there are also triple dual-core lockstep Arm Cortex-M7 cores for which MicroSys offers support for dedicated FreeRTOS implementations beside NXP’s standard automotive support. Clustered and operated in lockstep mode, this set of heterogenous cores can support ASIL-D applications or any other functional safety standard comparable to IEC 61508. The ASIL D safety and hardware security has more than 10 times the real-time performance and networking throughput of NXP’s previous automotive gateway devices, reports MicroSys Electronics.

The SoM integrates 4Gbyte of soldered LPDDR4 RAM at 3200Mtransfers per second, 16Gbyte eMMC non-volatile memory and 64Mbyte QuadSPI flash. External SD card storage can be multiplexed with the on-board eMMC.

The SoM offers an extensive range of generic and communication interfaces including four SerDes interfaces configurable as PCIe Gen3 2×1 or 2×2, four Gigabit Ethernet, 18x CAN FD bus, two FlexRay, and four LIN. There are also 14 GPIOs, 12 analogue inputs (ADC), three SPI, two UART, one USB and three I2C interfaces.

For trace and debug tasks, the SoM supports Aurora and JTAG interfaces. MicroSys also offers a board support package including bootloader configuration and all required Linux drivers.

The SoM offers multiple native CAN interfaces as well as comprehensive FlexRay, LIN and Ethernet support. Target markets are real-time connected vehicles, mobile machinery and automotive test and measurement equipment. It can also be used for data loggers, edge gateways and fail-safe programmable logic controllers (PLCs).

There is native support for 18 CAN interfaces, making the MicroSys SoM particularly suitable for developing comprehensive vehicle networks. The SoM is an alternative to using generic expansion buses to connect CAN controllers which can generate high interrupt loads on the main processor. The other alternative is to use FPGAs but these can be expensive, requiring additional development resources for FPGA programming.

The NXP S32G2 processor was developed specifically for vehicle networks and the MicroSys miriac MPX-S32G274A is the world’s first SoM to integrate the processor, says the company. “OEMs benefit from an application-ready building block for their connected real-time controllers in automotive and other functional safety applications. They also benefit from high computing performance, faster Ethernet and automotive connectivity including massive native CAN support, plus comprehensive functional safety and security features,” explains Ina Sophia Schindler, CEO of MicroSys Electronics.

MicroSys Electronics offers application-ready hardware and function-validated hardware-related software. It also offers customer-specific carrier boards and system level design services. These extend to SIL certification for any markets where functional safety standards analogue to IEC 61508 are required, including railway technology (EN 50155), aviation (DO-160), stationary and mobile machinery (ISO 13849), as well as manufacturing robots (ISO 10218), control systems (IEC 62061), and drive systems (IEC 61800‑5‑2). Approvals in the aviation context (DO-254/DO-160) are also greatly simplified by the existing manufacturer documentation.

https://microsys.de/

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LTE CAT-M1 module eliminates gateways in IoT networks

Pre-tested and certified RYZ014A Cat-M1 cellular modules by Renesas are the company’s first cellular IoT modules to support the specification. Devices can directly connect to the internet using an existing communication infrastructure owned by mobile network operators, without the need for a gateway, says Renesas. This makes it economical to connect each device, which is beneficial when installing larger networks that require a low cost per unit.

To build a wireless IoT project from scratch, the RYZ014A module includes RF regulatory certification, PTCRB/GCF (network operators) certification and carrier certification for the customer’s network operator of choice.

The module has been certified with all major radio frequency regulations in the world as well as with leading network operators in North America, APAC and European countries. 

The RYZ014A module is suitable for metering, smart home, infrastructure and industrial markets, where they can seamlessly interface Renesas microcontroller-based applications to the internet through their cellular network, for example Bluetooth Low Energy, Ultra-wide band (UWB) and Wi-SUN protocols.

Renesas has partnered with 4G and 5G chip and IoT module supplier, Sequans Communications, to provide the Monarch LTE CAT-M1 hardware and software technology used in the module.

Renesas offers customers a web-based portal, managed by ONE Tech, that provides easy access to read sensor values and manage SIM card plans remotely, reducing operating cost. ONE Tech’s embedded AI and cloud technology, with the Renesas CAT-M1 module offers embedded intelligence with an enterprise-grade platform, allowing customers to build, manage and scale smart machines in a cost-effective end-to-end ecosystem, says Renesas.

Support for world-wide frequency bands in a single design removes the need to create multiple customer platforms for different global regions, points out Renesas. There is also high output power supporting both power class options 20 and 23dBm and low current consumption in power saving mode of only 1.0 microA

The RYZ014A module and the RYZ014A-EVK evaluation kits are available now.

 The RYZ014A modules can be combined with components from Renesas, such as power ICs, Li-ion battery charger, light-to-digital sensor, and RA family microcontrolelrs to create systems, such as remote industrial process monitoring and automatic plant watering with an LTE Connection.

http://www.reneasas.com

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