Tensilica DSP IP cores target radar and lidar

Two IP cores have been added to the Tensilica ConnX family of DSPs by Cadence. Intended for embedded processing in automotive, consumer and industrial markets, the ConnX 110 and ConnX 120 DSPs’ architecture is optimised for small memory footprint and low-power signal processing. The ConnX 110 and ConnX 120 DSPs share a common instruction set architecture (ISA) with the ConnX B10 and B20 DSPs preserving software compatibility for easy migration. 

The 128-bit ConnX 110 DSP and 256-bit ConnX 120 DSP feature an N-way programming model an, like the rest of the Tensilica DSP portfolio, support the Tensilica Instruction Extension (TIE) language, which allows customers to tailor the instruction set, add specialised data types, and implement tightly integrated interfaces between the DSP and external logic. 

The new DSPs are supported by a comprehensive set of complex math library functions in the NatureDSP, Eigen and Radar libraries. As with all existing ConnX DSPs, they are automotive-ready with full ISO 26262 compliance to ASIL-D with FlexLock or to ASIL-B.

The Tensilica ConnX 110 and 120 DSPs have an optimised instruction set for radar, lidar and communications applications. They also feature optional acceleration operations for linear-feedback shift, convolutional encoding, single peak search and dual peak search. The 128-bit (ConnX 110) and 256-bit (ConnX 120) SIMD are suitable for complex math operations based on eight-, 16- and 32-bit fixed-point and half-, standard- and double-precision floating-point.

The ConnX 120 additionally offers Viterbi and Turbo decoders.
NXP uses Cadence Tensilica DSP cores for its ADAS (advanced driver assistance system) product offerings, said Robert Dunnigan, director program management ADAS at NXP Semiconductors. 

Another customer, indie Semiconductor develops multiple sensor modalities “in the pursuit of the uncrashable car”. Lionel Federspiel, executive vice president of engineering for indie Semiconductor, commented: “Cadence’s Tensilica ConnX processor family in conjunction with indie’s architecture is ideally suited to implement unique design solutions with high performance, low power, and gate count optimisation. As a pure-play automotive solutions innovator, quality and reliability are essential to the success of our products.”

“Radar and communications processing trends require solutions that perform more processing in less time,” explained David Glasco, vice president of research and development for Tensilica IP at Cadence. “Automotive radar demands multi-antenna, high-resolution systems with rapid response. Similarly, 5G wireless communications requires much higher data rates and lower latencies than previous generations. The Tensilica ConnX 110 and ConnX 120 DSPs meet these demands by extending the already-efficient processing capability of the ConnX DSPs and enhancing them with even more fixed- and floating-point complex data processing capacity at low power and area.”

http://www.cadence.com

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ANS-8A64 server protects data centres to IPSec

The ANS-8A64 server series is based on an Intel Atom C3000 processor, which qualifies it for network acceleration system for software defined wide area network (SD-WAN) users, said Portwell. 

SD-WAN is used to connect a wide range of corporate networks, data centres, internet applications and cloud services, which aims to help reduce a WAN’s operating cost and improve connection flexibility, explained Portwell. More and more applications will depend on the cloud to process data, which also brings the escalating demands for network security as this data on the cloud may contain personal ID, credit card numbers and other private information. 

IPSec protocol works in the third layer of the OSI (open systems interconnection) model and supports two modes, host-to-host mode and tunnel mode, either of which can be used to build a virtual private network (VPN) to increase the security of network transmission.

The Intel Atom C3000 processor series features industry-leading performance per watt, claimed Portwell, with low thermal design power (TDP) and configurable high-speed I/O, making it suitable for networks, storage devices, IoT and scalable designs. It is also equipped with Intel QuickAssist Technology (Intel QAT). The Intel QAT engine means IPSec protocol operation, data encryption, decryption and compression can be handled independently. It saves the CPU resource for other critical workloads and eventually optimises the overall work efficiency and performance, said Portwell.  

During field tests of the data plane development kit (DPDK) and Intel QAT, the ANS-8A64 was used as IPSec gateways and the encryption and decryption performance was repeatedly tested. 

In a one-way test, packets are sent unidirectionally from server port1 to server port2, and encryption and decryption are performed by IPSec gateway1 and IPSec gateway2.

A two-way test, consists of the server port1 and server port2 sending packets at the same time, and encrypting and decrypting packets through IPSec gateway1 and IPSec gateway2.

Portwell reported that the hardware acceleration engine, Intel QAT offers a “significant system optimisation and effectively betters the overall performance in both one-way and two-way testing”. 

Portwell is an Associate member of the Intel Internet of Things Solutions Alliance, designs and manufactures a full range of IPC products (SBC, backplane, redundant power supply, rack mount and node chassis), embedded architecture solutions, DVR system platforms and communications appliances. It provides R&D and project management services to decrease customers’ time to market and reduce project risk and cost. Portwell is also an ISO 13485, ISO 9001 and ISO 14001 -certified company that deploys quality assurance through product design, verification and manufacturing cycles. 

http://www.portwell.eu 

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Eight-bit MCU development board connects to 5G LTE-M NB-IoT networks

Microchip Technology’s AVR-IoT cellular mini development board is the latest to join its ABR family. It is based on the AVR128DB48 eight-bit microcontroller (MCU). It provides a platform to start building sensor and actuator nodes on 5G narrowband IoT (NB-IoT) networks.  

The small form factor board aimed at developers who want to connect IoT devices to an available 5G network. This is an essential feature for devices on the go or located in remote areas with limited availability of long range (LoRa) networks or other low power wide area networks (LPWAN). 

The AVR128DB48 eight-bit MCU family includes security protection with Microchip’s ATECC608 CryptoAuthentication device. The ATECC608 can be configured to most major cloud service providers through Microchip’s IoT provisioning tool. 

“Microchip continues to expand its family of AVR eight-bit MCUs for developers to implement a variety of embedded designs with ease and flexibility,” said Greg Robinson, vice president of marketing for Microchip’s eight-bit MCU business unit. 

The ability to connect remote and mobile devices to a 5G narrowband network with an eight-bit MCU opens up new opportunities for battery-operated devices due to the low power combined with high-quality analogue peripherals, he added.

The AVR-IoT cellular mini development board comes pre-configured to send data from on-board light and temperature sensors to the cloud, viewable using Microchip’s sandbox portal. The sandbox portal lets customers track and monitor their device in real time from a remote location. 

This functionality covers the core requirements of many applications in various industries including agriculture, industrial and energy, as well as consumer spaces such as transportation of goods, alarm systems, building automation and remote monitoring. 

To provide an easier, more efficient and more cost-effective solution for connecting IoT devices to 5G using the AVR128DB48 MCU, Microchip has partnered with Sequans to include its Monarch 2 GM02S single-chip radio equipped with 5G LTE-M and narrowband IoT. Microchip also partnered with Truphone to provide the SIM card for cellular service that offers coverage worldwide. 

The Monarch 2 GM02S is a 5G-ready LTE-M and NB-IoT solution on a single chip, designed specifically for NB-IoT applications, including sensors, wearables and other low data, low power devices. By partnering with Microchip on its AVR-IoT cellular board, Sequans claimed to simplify and lower the costs of IoT device design.

“Owning and operating all elements of the eSIM ecosystem in-house coupled with access to a large number of low-power cellular networks through a single SIM SKU, provides Microchip customers looking to connect IoT devices a future proof cellular service.” said Steve Alder, chief business development officer of Truphone.

The AVR-IoT cellular mini development board fits the Adafruit Feather form factor. It features a Qwiic/Stemma I2C connector for easy functionality extension, creating a clear path to production. It is also Arduino-compatible and is supported by Microchip’s Github Library, which provides functionality for HTTPS, MQ telemetry transport (MQTT), and low power.   

Users can access the Microchip sandbox page for a tutorial on how to get up and running and establish a connection with the AVR-IoT cellular mini development board.

Microchip Technology provides smart, connected and secure embedded control, serving more than 120,000 customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers technical support along with dependable delivery and quality. 

https://www.microchip.com

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Renesas’ SmartBond DA1470x SoCs are integrated for wireless connectivity

Renesas Electronics has announced the SmartBond DA1470x family of Bluetooth low energy (LE) integrated SoCs for wireless connectivity. 

Renesas claimed the DA1470x family to be the only device in the Bluetooth LE space to integrate a power management unit, a hardware voice activity detector (VAD), a graphics processing unit (GPU) and Bluetooth LE connectivity all into a single chip. 

This combined functionality provides smart IoT devices with advanced sensor and graphical capabilities and seamless, low power, always-on audio processing. The SoCs are suitable for wearables, such as smart watches and fitness trackers, glucose monitor readers and other consumer medical and healthcare devices, home appliances with displays, industrial automation and security systems, and Bluetooth consoles such as e-bikes and gaming equipment.

“The DA1470x family … enables developers to push the boundaries of connected consumer and industrial applications and future-proof their IoT products to fit the needs of multiple applications, while optimising their bill of materials,” commented Sean McGrath, vice president of the connectivity and audio business division in Renesas’ IoT, Industrial and Infrastructure business unit.

The high level of integration results in “significant cost savings” on the bill of materials (BoM), enabling cost-effective system solutions, according to the company. It also reduces component count on the PCB, enabling smaller form factor designs and freeing up space for additional components or larger batteries. With fewer components on the PCB, the reliability of the system improves, it claimed, delivering a further reduction in the total cost of goods sold (COGS) of the end product. 

The wireless SoCs feature a multi core system – with an Arm Cortex-M33 processor as the main application core and Cortex -M0+ as the sensor node controller.

An integrated 2D GPU and display controller supports DPI, JDI parallel, DBI and single  / dual / quad serial peripheral interfaces (SPIs) and there is a configurable Mac supporting Bluetooth LE 5.2 and proprietary 2.4GHz protocols. 

An integrated 720mA JEITA-compliant USB charger supports rechargeable Li-ion / Li-Po batteries, while an integrated low quiescent current SIMO DC/DC converter of the PMU supplies internal system and external components.

Low power hardware VAD enables seamless and always-on audio processing. 

The DA1470x family consists of four new devices, all of which are in mass production and available now. 

The DA14706 has already been used in the Xiaomi Mi band 7 wearable activity tracker with a 1.62-inch, 192×490 Amoled display, 120 sports modes and a 15-day battery life for typical use.

The DA1470x family will be demonstrated at Embedded World (21-23 June) in Nuremberg, Germany, at Booth Hall 1-234.

A provider of microcontrollers, Renesas combines its expertise in embedded processing, analogue, power and connectivity to deliver complete semiconductor solutions. These combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications.

http://www.renesas.com 

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