Embedded

For IoT applications space is limited, u-blox has developed the SARA-R500E LTE-M module with an embedded SIM (eSIM). It offers LTE-M connectivity in applications that need to be robust and secure, for example, connected healthcare and asset trackers. 

Embedded SIMs are replacing the plastic SIMs typically found in mobile devices which connect the device to the cellular network. Like the plastic versions, eSIMs are provisioned with a profile that allows devices to connect to a specific mobile network operator.

The eSIM embedded in the SARA-R500E offers product developers and end users a number of advantages, said u-blox. For example, they are more robust than standard plastic SIMs and cannot be stolen or removed, increasing the security of the device. There is also no need for the components required to hold and connect plastic SIM cards which enable smaller devices, reduce the bill of material and simplify manufacturing. The SARA-R500E streamlines logistics by offering the module, data plans and the SIM from one source, added u-blox.

“SARA-R500E greatly simplifies logistics for device makers, as the eSIM is already integrated inside the module,” said Samuele Falcomer, product manager, product centre cellular at u-blox. All the customers have to do is activate connectivity, choose the data plan that best fits their needs via the u-blox Thingstream IoT service delivery platform. Particularly those customers that are too small to negotiate dedicated data plans with mobile network operators will benefit from a competitively priced offering,” he added.

Product developers can design tightly sealed devices that meet the demanding IP67 and IP68 criteria because the SARA-R500E module’s eSIM does not need to be inserted manually by the end user. As a result, the module is suitable for rugged IoT applications such as smart meters, surveillance cameras and environmental sensors.

The module also offers the option to access u-blox’s MQTT Anywhere service, which reduces bandwidth requirements for cellular data transfer, saving costs and power. U-blox’s IoT Location as a service portfolio, including AssistNow for real-time GNSS assistance data, and CellLocate, for cellular network-based positioning, is also available.

SARA-R500E is pin-to-pin compatible with all the other modules in the SARA family and uses the SARA-R5 AT command interface, making it easy to drop the SARA-R500E into existing designs.

First samples of the SARA-R500E will be available in September.
The first variant of the module will offer out-of-the-box connectivity on a North American LTE-M cellular network.

http://www.u-blox.com

Support for NXP Semiconductor‘s S32G3 vehicle network processor in the miriac MPX-S32G399A system on module (SoM) enables real time data processing power for mixed-critical safety applications. The miriac MPX-S32G399A SoM by MicroSys exceeds its NXP S32G2-based predecessor with 2.5 times more applications processing performance. 

There are also eight Arm Cortex-A53 cores instead of four and four Arm Cortex-M7 dual-core lockstep pairs instead of three. OEMs using this miriac SoM benefit from more processor bandwidth for safety-critical applications but also from the SoM’s inherent instant access to prototyping and extended connectivity as well as comprehensive software support and safety documentations mandatory for certifications, said MicroSys. 

The miriac MPX-S32G399A SoM offers multiple native CAN interfaces, as well as comprehensive FlexRay, LIN and Ethernet support including time sensitive networking. Target markets are real-time connected vehicles, mobile machinery and automotive test and measurement equipment. MicroSys said they can also be used for data loggers, edge gateways and fail-safe programmable logic controllers (PLCs).

The NXP S32G vehicle network processor is targeted for ASIL D safety applications in OEM and Tier-1 automotive applications. MicroSys Electronics extends its application areas to SIL certifications for any market where functional safety standards analogue to IEC 61508 are required, including railway technology (EN 50155), aviation (DO-160), stationary and mobile machinery (ISO 13849), as well as manufacturing robots (ISO 10218), control systems (IEC 62061), and drive systems (IEC 61800‑5‑2). Approvals in the aviation context (DO-254/DO-160) can be supported with manufacturer documentation.

The eight Arm Cortex-A53 cores with Arm Neon technology are organised in two clusters for applications and services. For real-time tasks, the S32G3 has also four dual core lockstep Arm Cortex-M7 pairs for which MicroSys offers support for dedicated FreeRTOS implementations beside NXP’s standard automotive support. Clustered and operated in lockstep mode, the set of heterogenous cores of the S32G3 can support ASIL-D applications or any other functional safety standard comparable to IEC 61508. 

The SoM also integrates 4Gbyte of soldered LPDDR4 RAM at 3200 Mtransfers per seocnd, up to 32Gbyte eMMC non-volatile memory and 64Mbyte QuadSPI flash. External SD card storage can be multiplexed with the on-board eMMC. 

There are generic and communication interfaces including four SerDes interfaces configurable as PCIe Gen3 2×1 or 2×2, three 2.5 Gigabit Ethernet plus three Gigabit Ethernet, 18x CAN FD bus, two FlexRay and four LIN. There are also 14 general purpose I/Os, 12 analogue inputs (ADC), four FlexSPI, two UART, one USB and four I2C interfaces.

For trace and debug tasks, the SoM supports Aurora and JTAG interfaces. MicroSys also offers a board support package including bootloader configuration and all required Linux drivers.

The miriac MPX-S32G399A SoM is scheduled to become available for approved OEM evaluation including the carrier board, cable set and cooling solution during 2022. Larger lots in series production quality are scheduled to become available in Q1 2023.

https://www.microsys.de/en

Equipped with up to two times as many cores as the previous generation of Ryzen Embedded SoC processors, the Ryzen Embedded R2000 series targets industrial and robotics systems, machine vision, the IoT and thin client equipment, said AMD.

The R2514, for example has up to 81 per cent higher CPU and graphics performance than the comparable R1000 series processor, confirmed AMD. Performance-per-watt efficiency is also optimised using Zen+ core architecture with AMD Radeon graphics for multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in 4K resolution.

Embedded R2000 Series processors are scalable up to four Zen+ CPU cores with eight threads, 2Mbyte of L2 cache and 4Mbyte of shared L3 cache, allowing embedded system designers can scale performance and power efficiencies with a single processing platform, said the company. The Ryzen Embedded R2000 also supports up to 3200Mtransfer per second DDR4 dual channel memory and expanded I/O connectivity, to deliver 33 per cent higher memory bandwidth and up to two times greater I/O connectivity compared to R1000 series processors. 

The series is suitable for industrial applications like robotics and machine vision as well as thin clients and mini-PCs, which require performance, optimised power and graphics, commented the company. 

They can power up to four independent displays in 4K resolution leveraging DisplayPort 1.4, HDMI 2.0b or eDP 1.3 interfaces. They also feature peripherals and interfaces with up to 16 lanes of PCIe Gen3, two SATA 3.0 and six USB ports (USB 3.2 Gen2 and 2.0).

OS support includes Microsoft Windows 11/10, and Linux Ubuntu LTS.

 The series consists of the R2324 and R2312 SoC processors which are in production now and the R2544 andR2541 which are expected to be available in October 2022. Planned product availability extends up to 10 years, providing customers with a long-lifecycle support roadmap

http://www.amd.com