Advantech bases industrial motherboards on 12th Gen Intel Core 

Industrial ATX motherboards, industrial ATX / MicroATX server boards and PICMG 1.3 single board computers (SBCs) from Advantech, together with modular IPC, Compact IPC and edge accelerator servers will be upgraded to 12th Generation Intel Core i9 / i7 / i5 / i3 processors with up to 16 cores and 24 threads.

The result is a “significant” boost in computing performance by up to 89 per cent, reported Advantech.

These systems can be upgrades for smart factory and machine automation, machine vision, transportation, and edge AI applications.

12th Generation Intel Core processors are the first Intel Core processors to feature performance hybrid architecture, integrating up to eight performance-cores (P-cores) and up to eight Efficient-cores (E-cores) for background task management and multi-tasking. According to Advantech, this will boost performance up to 1.36x times faster in single- thread performance and up to 1.35x times faster in multi-thread performance compared to 10th Gen Intel Core processors. The 12th Gen Intel Core processors are also the first Intel Core processor series that introduces support for up to DDR5-4800 memory modules (or DDR4-3200), to enhance bandwidth by 50 per cent. The upgrade to PCIe 5.0/4.0 increases expansion options and allows the embedded boards to support high numbers of simultaneous applications.

The AIMB-788 and AIMB-708 ATX motherboards are equipped with seven PCIe/PCI expansion slots (including one PCIe x16 Gen 4, and up to three PCIe x4 Gen 3), M.2 (NVMe), and DDR4-3200 memory. Target applications are industrial automation and video surveillance.

Other boards are the ASMB-588 and ASMB-788 MicroATX / ATX server boards, as well as PCE-5033 and PCE-5133, PICMG 1.3 full-size SBC. ASMB- 588/788 supports DDR5 ECC/ non-ECC memory and PCIe 5.0 connectivity. It can connect to frame grabber cards, motion control cards and accelerators. 

The MIC-770 V3, IPC-320 and PCE-2033/2133 and ASMB-610V3 will also be upgraded to 12th Generation Intel Core processors. The MIC-770 V3 is an embedded box IPC. The fanless design is suitable for heavy industrial hazardous environments. 

The IPC-320 will feature the 12th Gen Intel Core I CPUs. These systems are designed for central control rooms in substations and industrial automation. They have low noise acoustics (40dB). The PCE-2033 / 2133 motherboards are bundled with compact IPC-200 chassis series (IPC-220 / 240 / 242) designed for machine vision and motion control in equipment manufacturing and the semiconductor industry. 

The ASMB-610V3 is a proprietary server board bundled with a short-depth edge accelerator server chassis HPC-6120. It has four PCIe expansion slots in a 1U 18 inch short-depth chassis and is suitable for machine automation, machine vision, factory automation, AI, smart cities and medical technology.

These upgraded products support multiple operating systems and Advantech’s WISE-DeviceOn, and WISE-Cloud software platforms.  The AIMB-788 is available for order now with other introductions scheduled for late 2022. 

http://www.advatech.com 

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Dev kit evaluates multi-connectivity indoor-outdoor tracking

To support engineers building proof of concept for asset tracking systems, STMicroelctronics offers the STEVAL-ASTRA1B multi-connectivity evaluation kit. It is battery powered, has a small form factor and includes firmware to simplify development targeted applications such as livestock monitoring, fleet management, and logistics.

The kit helps users evaluate ST’s short- and long-range STM32 wireless SoCs. The STM32WL55JC sub-GHz SoC is for long-range connectivity or low power wide area networks (LPWAN) and implements the LoRaWAN (long range WAN) protocol. It provides LoRa, (G)FSK, (G)MSK, and BPSK modulations. 

The second wireless SoC is the STM32WB5MMG module for 2.4GHz Bluetooth Low Energy and Zigbee connectivity. Each SoC has an Arm Cortex-M4 core for application processing with a dedicated Cortex-M0+ to manage the radio.

The development kit also includes an ST25DV64K near field communication (NFC) contactless chip for secure pairing and communication and an STSAFE-A110 secure element for privacy and protection against hacking.

There is also a Teseo-LIV3F miniature GNSS module which provides outdoor positioning. Sensors from the company provide data for monitoring asset condition and environment. Sensors available include an STTS22H low voltage, low power temperature sensor with ±0.5 degrees C accuracy, HTS221 digital humidity and temperature sensor, the LPS22HH barometric pressure sensor, and LIS2DTW12 low power three-axis accelerometer. Also available is the LSM6DSO32X always-on inertial module, which contains a3D accelerometer and 3D gyroscope with machine-learning core.

The STEVAL-ASTRA1B has a smart power and battery management architecture that helps developers maximise application runtime, said ST. It also includes the ST1PS02 nano-quiescent synchronous step-down converter, STBC03 Li-ion battery charging controller, and TCPP01-M12 USB-C port-protection IC.

The ecosystem available for evaluating applications in development include software and tools from ST. The choice includes the FP-ATR-ASTRA1 STM32Cube software function pack with firmware libraries and typical application examples. There is also ST’s asset-tracking mobile app, available on Apple Store and Google Play. The DSH-Assetracking cloud dashboard is also available, free of charge to demonstrate an end-to-end proof of concept.

The STEVAL-ASTRA1B evaluation kit is available to order now through ST’s eStore.

http://www.st.com

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Duagon’s SBC has up to eight cores to operate in rail systems

A 3U CompactPCI serial CPU board by Duagon features the 11th generation Intel Core and Intel Xeon W-11000E series processors / Tiger Lake-H CPUs. The G28 has up to eight cores and up to 64Gbyte RAM and is suitable for embedded computing for rail systems (onboard and trackside) as well as for the medical and critical automation industries. 

Optional 10Gbit Ethernet interfaces allow for high data throughput and direct connection to the network backbone.

For a robust performance in harsh environments, DRAM (up to 64Gbyte DDR DRAM with error code correction or ECC) is soldered to the board, the components are underfilled and additionally coated to guarantee optimum shock and vibration resistance and durability against harsh environmental conditions. The CPU is scalable from 25 to 45W TDP (thermal dynamic performance) and four to eight cores allows operation in ambient temperatures of up to +85 degrees C with active cooling. According to Duagon, a single board can cover different environmental conditions and market applications.

In onboard rail applications, the G28 can be used as central maintenance and virtualisation platform and main computing unit for passenger Wi-Fi and internet access. As part of a rail wayside server system, the SBC can be used for condition monitoring and in medical applications, the G28 can be used in surgical robots. It can also be used in factory automation for motion control and robotics in industrial automation.

For system security, a Trusted Platform Module (TPM 2.0) is assembled. This provides the G28 support for remote device authentication, measured boot, and secure updates. There is also an independent board management controller (BMC) which monitors onboard voltages, current and temperature. It also performs dedicated tasks like external watchdog management, power supply control and reset handling.

The G28 features three RJ45 or two M12 Ethernet front connectors, one USB 3.2 Gen 2×1 connector and one USB-C connector for one USB 3.2 Gen 2×1 and one DisplayPort. Main backplane interfaces include four SATA (6Gbit), eight PCIe 3.0 root ports with lane configurations of one, four or eight, and two 1Gbit Ethernet ports.

The SBC is supported by Linux Yocto Project, Windows 10 IoT Enterprise 64-bit as well as real time operating systems (RTOS) that supports Intel’s multi-core architecture. 

Duagon also offers long-term availability of the components for a minimum of 10 years. The G28 is backwards compatible to the predecessor products G25, G25A and G23.

The fully qualified G28 will be available from September 2022.

https://www.duagon.com/

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AMD and ECARX collaborate on immersive cockpit in-vehicle computing

AMD and mobility technology company, Ecarx, will work together on an in-vehicle computing platform for electric vehicles (EVs), expected to be in mass production in late 2023. The Ecarx digital cockpit in-vehicle platform will be offered with AMD Ryzen Embedded V2000 processors and AMD Radeon RX 6000 Series GPUs (graphic processor units) and Ecarx hardware and software. 

The digital cockpit’s features will include driver information mode, heads-up display, rear seat entertainment, multiple-displays, multi-zone voice recognition, gaming and a 3D user experience. 

Ecarx is AMD’s first strategic ecosystem partner in China for the digital cockpit. 

“The global automotive industry is transforming towards an intelligent future at an unprecedented pace with demand for computing power and graphics capabilities rapidly increasing,” said Ziyu Shen, chairman and CEO of Ecarx. “With this collaboration, we will further enable OEMs and tier 1 suppliers to enhance their digital cockpit experiences as they seek to create greater consumer value through intelligent connected cars.”

“EV adoption is now a key underlying factor for growth in the automotive semiconductor market and the associated semiconductor demand is forecast to grow at a CAGR [compound annual growth rate] of 31 per cent over 2021 to 2026,” said Asif Anwar, executive director – PBCS and EVS, Strategy Analytics. He believes domain- and zonal-based architecture will drive adoption of the digital cockpit, ADAS (advanced driver assistance systems) and the connected vehicle.

The Ryzen Embedded V2000 Series processors are the second generation designed for automotive in-vehicle infotainment and instrumentation applications. They are also used in industrial edge, thin client and miniPC systems. The processors can power up to four independent displays simultaneously in 4K resolution; it is equipped with up to eight CPU cores and seven GPU compute units. A single AMD Ryzen Embedded V2000 Series processor provides up to two times the multi-threaded performance per Watt, up to 30 per cent better single-thread CPU performance and up to 40 per cent better graphics performance over the previous generation. 

AMD Radeon RX 6000 Series GPUs are built upon the AMD RDNA 2 graphics architecture. This is, said AMD, the only graphics architecture that spans from next-generation desktop PCs, laptops and consoles to mobile devices and automotive infotainment systems. It offers up to two time higher performance) and up to 50 per cent more performance per Watt in select titles compared to the previous generation AMD RDNA architecture.

Ecarx’s current core products include infotainment head units (IHU), digital cockpits, vehicle chipsets, a core operating system and integrated software stack. It is also developing a full-stack automotive computing platform. 

Its technology has been integrated into more than 3.2 million cars worldwide. 

For more than 50 years, AMD has developed computing, graphics and visualisation technologies. 

http://www.amd.com 

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