Secure i.MX 91 processors bring Linux to the edge, says NXP

Bringing Linux capabilities to “thousands of edge applications” the i.MX 9 series of processors streamlines the development of cost-optimised edge devices that require security, performance and Linux support in a scalable, reliable platform, said NXP Semiconductors.

The processors are designed for the next generation of Linux-based IoT and industrial applications.

Emerging protocols, such as Matter or the ISO 15118-20 standard for electric vehicle (EV) chargers, create inflection points for new products, many of which rely on Linux for use in IoT and industrial markets. The i.MX 91 family has been developed to enable users to quickly create new Linux-based edge devices, such as home controllers, connected appliances, home entertainment, industrial scanning and printing, building control, EV chargers and medical platforms, advised NXP.

The i.MX 91 is the entry point of the i.MX 9 series and has hardware and software commonality with NXP’s i.MX 93 family. 

It will “provide the foundation for thousands of new device classes, with its high performance, connectivity and EdgeLock secure enclave setting a new standard for Linux platforms across IoT and industrial applications,” said Charles Dachs, senior vice president and general manager, of industrial and IoT edge, at NXP. He continued: “The i.MX 91 family enables the rapid development of platforms that may easily pivot into new markets and new applications, leveraging existing investments and streamlining product line updates.”

The i.MX 91 applications processor features an Arm Cortex-A55 running at up to 1.4GHz with support for LPDDR4 memory and dual Gigabit Ethernet for gateway or multi-network segment support. There are also dual USB ports and I/O for products in smart factory, smart home, smart office, medical device, metering and cost-optimised system on module platforms.

An integrated EdgeLock secure enclave provides lifecycle management, tamper detection, secure boot, and a simplified path to certifications. These important security capabilities are easily accessed by the developers through NXP-provided security software enablement.

The i.MX 91 family is available with NXP’s co-developed and cost-optimised power management solution, available as part of the i.MX 93 family ecosystem. The evaluation kits and software packages for the i.MX 91 family integrate with NXP’s scalable wireless portfolio which includes the IW612, the industry’s first monolithic tri-radio family that supports Wi-Fi 6, Bluetooth 5.2 and 802.15.4. The IW612, focused on Matter, frees consumers from the restrictions of single-protocol ecosystems, allowing them to enjoy seamless interoperability across different ecosystems and wireless network technologies.

NXP’s i.MX applications processors are available worldwide through distributors and eTailers. They are enabled by NXP software, a broad ecosystem of tools and software, and comprehensive support. To help ensure a stable supply of products for embedded designs, all i.MX 8 series and i.MX 9 series products are guaranteed for a minimum of 15 years of availability as members of the NXP product longevity programme.

NXP expects to enable select customers with i.MX 91 development platforms in the second half of 2023 as part of the early access programme. 

http://www.nxp.com

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DFI focuses on AI edge for smart transportation

At Computex Taipei this week, embedded motherboard and industrial computer specialist, DFI has introduced its low power vehicle system, based on Arm architecture.

The high performance computing micro-industrial motherboard is compact, allowing it to overcome space limitations in roadside equipment. It can be used for people flow identification in vehicle systems. DFI said it can improve energy efficiency and provide safety for future cities through intelligent, automated and miniaturised product design.

Exhibiting in the BenQ Group Computex Smart+ exhibition stand number MO619a at Computex Taipei (30 May to 2 June) at the Taipei Nangang Exhibition Center, Taipei, Taiwan, DFI has actively deployed smart transportation solutions to upgrade public infrastructure, lower operating costs and increase efficiency, said DFI president, Alexander Su.

DFI’s smart transportation embedded solutions support road and information security. The company has joined VicOne, a vehicle information security company and IoT system integration company, 5GIoTLead Technology, to introduce in-vehicle cybersecurity technology and the 5G Smart Pole Management platform, which demonstrate simulations of smart traffic intersections.

Another highlight is the miniature industrial fanless EC70A-TGU, equipped with the 11th generation Intel Tiger Lake Core processor. This processor has low power consumption and built-in GPU based on the Intel Iris Xe architecture, for edge computing. The fanless design allows the EC70A-TGU to be light and compact. Its accurate AI judgment also considers performance and real-time responses, making it ideal for handling heavy workloads, said DFI.

The EC70A-TGU can perform real-time AI calculations and speed up pedestrian recognition, tracking, and video streaming. It can also identify violations committed by others and synchronously send the information to the smart pole management platform, providing a real-time visual dashboard and data control to enhance management efficiency.

Another innovation is the VC900-M8M in-vehicle system which adopts low power ARM architecture and supports in-vehicle information security software.

The VC900-M8M, with ARM-based NXP i.MX8M CPU, can support Yocto Linux 2.5 and Android 9.0 operating systems. It has a variety of I/O configurations and features an anti-vibration design and wide operating temperature range to allow the vehicle to function even in extreme environments, said DFI. 

The VC900-M8M has a built-in six-axis IMU sensor, which monitors vehicle and driver behaviour to prevent speeding, sudden braking, and collisions. It can also manage abnormal signals and provide real-time warnings.

https://www.dfi.com/

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Micro-ATX motherboard sets benchmarks for storage and processing 

The MAX-Q670A sets new benchmarks for expandability, storage capacity, and processing power, said Aaeon. The addition to its Micro-ATX range is the company’s first Micro-ATX industrial motherboard to incorporate the new 13th Generation Intel Core processor platform (formerly Raptor Lake). 

It supports a diverse range of CPUs from both the 12th and 13th Generation Intel Core processor ranges, from 35W i3 to 65W i9 devices, with the most advanced of these offering eight P-cores, 16 E-cores and 32 threads. Advanced technologies available on this platform include Intel TCC for real-time computing, Intel vPro Enterprise for robust security and stability and Intel Turbo Boost Max Technology 3.0 for targeted workload management.

Aaeon designed the MAX-Q670A with upgrades in storage, hardware-based security features and increased speed and bandwidth via both onboard interfaces and expansion modules. 

It is equipped with two 16-lane PCIe Gen 5 slots to accommodate multiple expansion modules such as graphic cards. There is also a further option of installing two eight-lane cards per slot. There are four LAN ports, two of which support 2.5GbE via Intel I225-LM and high-speed peripheral device interfaces, bolstered by up to 128Gbyte of DDR5 system memory to accelerate data transmission. This is in addition to a dense I/O comprised of a DB-9 port, alongside an internal nine-pin header for RS-232 function and an 8-bit digital I/O interface.

Security features include four rear USB 3.2 Gen 2 ports, which are bootable, and two internal USB 3.2 Gen 1 and USB 2.0 ports which also support a USB switchable power feature for remote peripheral device rebooting.

Eight SATA III drives with RAID 0, 1, 5, 10 support provide storage capacity and there are two M.2 2242/2280 M-Keys which provide four-lane PCIe Gen 4 functionality.

The MAX-Q670A is now in mass production.

Established in 1992, Aaeon designs and manufactures industrial IoT and AI edge products. It provides industrial motherboards and systems, rugged tablets, embedded AI Edge systems, uCPE network appliances and LoRaWAN/WWAN solutions as well as OEM/ODM services worldwide. It also works closely with cities and governments to develop and deploy smart city ecosystems, offering individual platforms and end-to-end solutions. 

http://www.aaeon.com

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Small form factor computing system is based on Nvidia Jetson AGX Orin

Elma Electronic has expanded its line of rugged small form factor (SFF) edge computing systems to include the JetSys-5330, based on the Nvidia Jetson AGX Orin System on Module (SoM). The artificial intelligence (AI) platform delivers up to 275 TOPS, coupled with expansion sites for custom I/O and storage requirements, making the JetSys-5330 suitable for rugged, deployed deep-learning applications. 

The JetSys-5330 utilises wireless multi-access edge computing. Industrial applications, including robotics, autonomous mining, agriculture and construction vehicles, can also benefit from the JetSys-5330 edge computing capabilities.

Mark Littlefield, director, system products for Elma Electronic, commented: “The power of AI brought to the edge by this latest Nvidia Jetson-based JetSys platform is enhanced by the versatile and extensive I/O interfaces and storage capabilities. This new system can handle multiple concurrent video pipelines, which means enhanced data handling and processing power for rugged systems.”

The Nvidia Jetson AGX Orin is a powerful SoM for AI applications, featuring a 2048-core Nvidia Ampere architecture GPU with 64 Tensor Cores and a 12-core Arm Cortex-A78AE. Deep learning and vision accelerators, a video encoder/decoder, high-speed I/O, 204GB/s of memory bandwidth and up to 64GB of DRAM contribute to its processing capabilities.

Claimed to be easily configurable and expandable, the JetSys-5330 combines the Nvidia Jetson AGX Orin module with Elma’s JetKit-3110 carrier card, which provides the necessary power and interfaces for the SoM as well as three mini-PCIe slots (one that doubles as mSATA) and two M.2 slots (one B-Key and one M-Key) for custom I/O or fixed storage expansion.

The platform’s rugged design is IP67-rated and qualified to standards including MIL-STD-810G, MIL-HDBK-704F and MIL-STD-1275D. The platform’s power consumption ranges from 53W to 130W depending on the system configuration. Maximum weight is 16lbs with an optionally available fan kit.

https://www.elma.com

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