Cadence Design Systems has collaborated with Arm for its Neoverse V2 by fine-tuning its AI-driven RTL-to-GDS digital flow for Neoverse V2 and delivered corresponding 5nm and 3nm Rapid Adoption Kits (RAKs) which are designed to support customers achieve power, performance and area (PPA) targets faster. The Cadence AI-driven verification full flow supports Neoverse V2, providing designers with optimal verification throughput and preparedness for Arm SystemReady compliance, added Cadence.
The AI-driven Cadence RTL-to-GDS digital full flow RAKs for 3nm and 5nm nodes include Genus Synthesis, Modus DFT Software, Innovus Implementation System, Quantus Extraction, Tempus Timing and ECO Option, Voltus IC Power Integrity, Conformal Equivalence Checking, Conformal Low Power and the AI-based Cerebrus Intelligent Chip Explorer.
Benefits of the digital RAKs for Arm Neoverse V2 designers include, for example, the Cerebrus AI capabilities which automate and scale digital chip design, delivering better PPA and improving designer productivity. The inclusion of Cadence iSpatial technology provides an integrated and predictable implementation flow for the faster design closure, added the company. The RAKs also include a smart hierarchy flow that delivers optimal turnaround times on large, high-performance CPUs.
In another example, the Tempus ECO technology offers sign off-accurate final design closure based on path-based analysis. The incorporation of the GigaOpt activity-aware power optimisation engine is claimed to significantly reduce dynamic power consumption.
The AI-driven verification full flow is optimised to support Arm Neoverse V2 and includes the Xcelium Logic Simulation platform, Palladium Enterprise Emulation platforms, Protium Enterprise Prototyping systems, Helium Virtual and Hybrid Studio, Jasper Formal Verification platform, Verisium Manager Planning and Coverage Closure tools, Perspec System Verifier, and VIP and System VIP tools and content for Arm-based designs.
The verification full flow provides Neoverse V2 designers with pre-silicon server base system architecture (SBSA) compliance verification and optimised PCI Express (PCIe) integration while the Helium Virtual and Hybrid Studio includes editable virtual and hybrid platform reference designs for Neoverse V2. These designs incorporate Arm Fast Models to jumpstart early software development and verification. The Helium gearshift technology enables customers to position workloads in a high-performance hybrid environment before shifting to a fully accurate RTL environment, offering detailed verification using either the Palladium or Protium platforms.
“The growing demand for complex workloads such as big data analytics, HPC and ML inference requires specialised compute solutions that achieve greater performance and efficiency,” said Eddie Ramirez, vice president of go-to-market, infrastructure line of business at Arm. “Through this latest collaboration, customers can leverage Cadence’s comprehensive digital and verification flows to validate their solutions and bring the power of their Neoverse V2-based products to market faster. Furthermore, silicon partners will get the benefits of these advanced design flows when running their EDA workloads on Arm-enabled servers and cloud instances.”
Embedded
EPIC-ADN9 single board computer supports three displays
Aaeon has based the EPIC-ADN9 SBC (single board computer) on Intel’s Atom x7000E series processors. The SBC supports quadruple 2.5GbE LAN, three simultaneous displays for flexible graphic applications.
The 4.53 x 6.50 inch (115 x 165mm) SBC has a range of embedded CPUs, including the Intel Core i3-N305, Intel Atom x7425E, Intel Processor N50 and Intel Processor N97. According to Aaeon, this processor selection provides support for Intel UHD Graphics, enhancing the on-board display interface configuration which includes HDMI 1.4, DP 1.2, VGA, and 24/48-bit dual-channel LVDS.
The EPIC-ADN9 also supports up to four RJ-45 ports for Intel I226-V Ethernet running at 2.5GbE (depending on the model). The board is designed to be passively cooled, and additionally has multiple options for image acquisition and high-resolution display, making it suitable for entry level gateway devices and digital signage applications.
As is the case with earlier generations of the EPIC board series, the EPIC-ADN9 supports a wide input range of 9.0 to 24V, making it suitable for industrial deployment. There are two physical serial ports for RS-232 / RS-422 /RS-485, in addition to four internal pin headers that support RS-232.
Other features are 16-bit general purpose I/O and flexible storage options such as SATA III, full-size mPCIe, mSATA, and M.2 2242 B-Key slots, making the EPIC-ADN9 suitable for smart manufacturing and industrial automation.
The EPIC-ADN9 is now in mass production.
Established in 1992, Aaeon designs and manufactures industrial IoT and AI Edge solutions. The company provides industrial motherboards and systems, rugged tablets, embedded AI edge systems, uCPE network appliances, and LoRaWAN / WWAN solutions. Aaeon works closely with cities and governments to develop and deploy smart city ecosystems.
Rutronik offers MediaTek’s AI-powered SoC, Genio 700
Responsive edge processing, AI and connectivity for industrial, smart home, interactive retail and commercial applications can be delivered by MediaTek’s Genio 700 (MT8390) SoC, which is now available from Rutronik following a recent franchise agreement covering Europe and Israel.
The Genio 700 SoC is an efficient, in-chip AI multiprocessor (APU) which provides 4TOPS (Terra operations per second) performance for deep learning, neural network acceleration and also computer vision applications when used with cameras up to 32Mpixel at 30 frames per second (via in-chip ISP and MIPI-CSI interfaces).
Genio 700 has an octa-core CPU with two Arm Cortex-A78 CPUs and six Arm Cortex-A55 CPUs, an Arm Mali-G57 GPU, up to 8Gbyte of quad channel LPDDR4X memory and fast UFS storage. The SoC supports Yocto and Ubuntu Linux, as well as Android.
The Genio 700 is based on TSMC’s advanced N6 (6nm-class) production process, making it “extremely power efficient”; product developers can use fanless enclosures or battery-powered systems, advised Rutronik.
The company added that its level of integration coupled with a small footprint help minimise bill of materials and development costs and accelerate time-to-market.
The Genio-700 platform can be expanding via PCI-Express and USB, and it supports a wide range of connectivity options, including native Gigabit Ethernet with TSN (time sensitive networking) as well as Wi-Fi 6 and 5G module options.
The dual display support of up to 4K at 60 frames per second and Full HD at 60 frames per second enables increases screen real estate while multimedia encoding/decoding engines, including AV1 decoding, make the Genio 700 suitable for interactive advertising, audio and video streaming services, and video conferencing and other personalised video services.
The Genio-700 is Arm SystemReady and carries Arm PSA certification for security.
MediaTek’s Genio series is a scalable line of four devices that bridges the gap between low-power Arm and high performance Intel / AMD processors.
Rutronik Elektronische Bauelemente was founded in 1973 and is still an independent family-owned company, based in Ispringen, Germany. It has more than 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, for customer support in Europe, Asia, and North America.
Modular industrial PCs combine edge AI built on AMD Ryzen
Israeli company, SolidRun has introduced the Bedrock R7000, a fanless edge AI industrial PC in a compact, rugged housing. It combines eight-core AMD Ryzen 7040 series processors with three Hailo-8 AI accelerators for AI applications. The fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.
The AMD Ryzen 7840HS processor is integrated with a 4nm APU (accelerated processing unit) with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU (graphics processing unit). The 7840HS / 7840U processor features eight cores and 16 threads running at up to 5.1GHz and is based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs at 2700MHz. CPU power can be precisely adjusted in BIOS between 8.0 to 54W. For Edge AI workloads, up to three Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 tera operations per second (TOPS).
The 20 native PCIe Gen4 lanes and up to three Hailo-8 AI accelerators, each with 26 TOPS can be used together with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays, explained SolidRun. The CPU and all devices are passively cooled by the Bedrock R7000’s fanless cooling system in an industrial temperature range of -40 to +85 degrees C.
Edge AI box PCs are used in multiple segments of the embedded market, including industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defence and utilities.
“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC product line manager at SolidRun. The modular design of the Bedrock R7000 allows for customisation, for example around the Hailo-8 AI accelerators.
“An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, product manager at Hailo.
RAM and storage are modular with two SODIMMs supporting 64Gbyte DDR5 ECC/non-ECC, and three NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes four displays comprising HDMI 2.1 + three DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, four USB 3.2 ports and a console port. All I/O is organised on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V
The enclosure is made of heavy-duty machined aluminium with an anodised finish. It is offered in three variants – 1.0 litre enclosure for dissipating up to 30W by convection, 1.6 litre for 60W and an 0.6 litre “Tile” variant for conduction cooling. The enclosure is suitable for DIN-Rail mounting with a specially designed zero-force locking bracket.
Bedrock R7000 fanless design can handle up to 60W, which is over three times the cooling capacity of typical fanless PCs of similar size, said SolidRun. Cooling innovations include liquid metal TIM, 360 degree stacked heat pipes, dual layer chimney effect heat exchanger and thermal coupling of all internal devices. Dimensions are 45 x 160 x 130mm for the 30W, 0.9 litre model, k73 x 160 x 130mm for the 60W, 1.5 litre model and 29 x 160 x 130mm for the Tile (0.6 litre) model.
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