Responsive edge processing, AI and connectivity for industrial, smart home, interactive retail and commercial applications can be delivered by MediaTek’s Genio 700 (MT8390) SoC, which is now available from Rutronik following a recent franchise agreement covering Europe and Israel.
The Genio 700 SoC is an efficient, in-chip AI multiprocessor (APU) which provides 4TOPS (Terra operations per second) performance for deep learning, neural network acceleration and also computer vision applications when used with cameras up to 32Mpixel at 30 frames per second (via in-chip ISP and MIPI-CSI interfaces).
Genio 700 has an octa-core CPU with two Arm Cortex-A78 CPUs and six Arm Cortex-A55 CPUs, an Arm Mali-G57 GPU, up to 8Gbyte of quad channel LPDDR4X memory and fast UFS storage. The SoC supports Yocto and Ubuntu Linux, as well as Android.
The Genio 700 is based on TSMC’s advanced N6 (6nm-class) production process, making it “extremely power efficient”; product developers can use fanless enclosures or battery-powered systems, advised Rutronik.
The company added that its level of integration coupled with a small footprint help minimise bill of materials and development costs and accelerate time-to-market.
The Genio-700 platform can be expanding via PCI-Express and USB, and it supports a wide range of connectivity options, including native Gigabit Ethernet with TSN (time sensitive networking) as well as Wi-Fi 6 and 5G module options.
The dual display support of up to 4K at 60 frames per second and Full HD at 60 frames per second enables increases screen real estate while multimedia encoding/decoding engines, including AV1 decoding, make the Genio 700 suitable for interactive advertising, audio and video streaming services, and video conferencing and other personalised video services.
The Genio-700 is Arm SystemReady and carries Arm PSA certification for security.
MediaTek’s Genio series is a scalable line of four devices that bridges the gap between low-power Arm and high performance Intel / AMD processors.
Rutronik Elektronische Bauelemente was founded in 1973 and is still an independent family-owned company, based in Ispringen, Germany. It has more than 80 offices worldwide and logistics centres in Austin (Texas), Shanghai, Singapore, and Hong Kong, for customer support in Europe, Asia, and North America.
Embedded
Modular industrial PCs combine edge AI built on AMD Ryzen
Israeli company, SolidRun has introduced the Bedrock R7000, a fanless edge AI industrial PC in a compact, rugged housing. It combines eight-core AMD Ryzen 7040 series processors with three Hailo-8 AI accelerators for AI applications. The fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.
The AMD Ryzen 7840HS processor is integrated with a 4nm APU (accelerated processing unit) with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU (graphics processing unit). The 7840HS / 7840U processor features eight cores and 16 threads running at up to 5.1GHz and is based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs at 2700MHz. CPU power can be precisely adjusted in BIOS between 8.0 to 54W. For Edge AI workloads, up to three Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 tera operations per second (TOPS).
The 20 native PCIe Gen4 lanes and up to three Hailo-8 AI accelerators, each with 26 TOPS can be used together with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays, explained SolidRun. The CPU and all devices are passively cooled by the Bedrock R7000’s fanless cooling system in an industrial temperature range of -40 to +85 degrees C.
Edge AI box PCs are used in multiple segments of the embedded market, including industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defence and utilities.
“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC product line manager at SolidRun. The modular design of the Bedrock R7000 allows for customisation, for example around the Hailo-8 AI accelerators.
“An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, product manager at Hailo.
RAM and storage are modular with two SODIMMs supporting 64Gbyte DDR5 ECC/non-ECC, and three NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes four displays comprising HDMI 2.1 + three DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, four USB 3.2 ports and a console port. All I/O is organised on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V
The enclosure is made of heavy-duty machined aluminium with an anodised finish. It is offered in three variants – 1.0 litre enclosure for dissipating up to 30W by convection, 1.6 litre for 60W and an 0.6 litre “Tile” variant for conduction cooling. The enclosure is suitable for DIN-Rail mounting with a specially designed zero-force locking bracket.
Bedrock R7000 fanless design can handle up to 60W, which is over three times the cooling capacity of typical fanless PCs of similar size, said SolidRun. Cooling innovations include liquid metal TIM, 360 degree stacked heat pipes, dual layer chimney effect heat exchanger and thermal coupling of all internal devices. Dimensions are 45 x 160 x 130mm for the 30W, 0.9 litre model, k73 x 160 x 130mm for the 60W, 1.5 litre model and 29 x 160 x 130mm for the Tile (0.6 litre) model.
Renesas develops power management reference design for Versal adaptive SoC
A space-ready reference design for the AMD Versal adaptive SoC, XQRVC1902, has been developed by Renesas in collaboration with AMD.
The ISLVERSALDEMO2Z reference design integrates key radiation-hardened (rad-hard) components for power management in a compact design. It includes four new and recently released Intersil ICs, specifically designed to support a range of power rails for space avionics systems that demand tight voltage tolerances, high current, and efficient power conversion in addition to the capability to withstand the harsh environment of space.
The Versal Adaptive SoC is a space-grade compute platform that delivers full radiation tolerance, accelerated AI inference and high bandwidth signal processing, said Renesas. The ISLVERSALDEMO2Z generates each of the power rails used by the Versal platform, including a low 0.80V core voltage supply that can source up to 140A of current.
As core voltages decrease and currents increase for FPGAs and ASICs, it has become more difficult to meet the stringent power requirements of these devices to ensure that they operate error-free, explained Renesas. This is especially critical in space missions where power availability is limited and systems are exposed to extreme temperatures and radiation for an extended period of time.
The reference design “has been meticulously engineered to meet the rigorous demands of operations in space, while integrating all of the essential components into a very small footprint. It is an ideal turnkey solution for Versal Adaptive SoC power management,” commented Chris Stephens, vice president and general manager of the HiRel business division at Renesas.
The reference design comes with an array of power management devices that have been tested and verified to withstand exposure to high levels of radiation.
It includes the ISL73847SEH rad-hard dual output PWM controller, ISL73041SEH and ISL71441M, believed to be the industry’s first dedicated Gan FET half bridge drivers for space applications and the ISL73007SEH rad-hard PoL regulator.
The devices used are in packages with small footprints resulting in the core power rail components taking up just 104 square cm of board area, or approximately the size of two business cards.
The ISLVERSALDEMO2Z comes with all of the design files that customers need for rapid integration into their systems, including schematics, bill of materials and PCB Gerber files.
All products are available today and the reference design is available upon request in limited quantities.
The reference design and the new products will be demonstrated at the Renesas booth (112/113) at the IEEE Nuclear & Space Radiation Effects Conference (NSREC), July 24-28, in Kansas City, Missouri, USA.
TriCore C library adds functional safety for VX toolset
A new C library introduced by Tasking simplifies development according to ISO 26262. The TriCore Qualified C Library (QClib) for the VX toolset simplifies the development of automotive software with regard to functional safety, said the company.
Software library qualification is required by functional safety standards because the library code is incorporated into the application and installed on the target device. A faulty library can jeopardise the functional safety of the application. Both a qualified compiler and a qualified C library must be used for the development of software that must meet functional safety requirements according to standards such as ISO 26262 or IEC 61508.
The TriCore Qualified C Library is a full-featured ISO C library that provides approximately 600 functions. Of these, about 200 functions are suitable for use in ASIL-D software, the remaining functions are qualified for use in lower level ASIL or QM software. The library can be integrated easily into existing projects, interfacing with third party operating systems, and enables the use of printf-style debugging and logging, explained Tasking.
The QClib comes with a safety manual in both human readable (pdf) and machine readable (ReqIF) formats. The ReqIF format makes it possible to automatically import the guidelines from the safety manual into the user’s requirements management system. The structure of the ReqIF file is such that all safety requirements are uniquely identifiable and allows reuse and sharing of safety analyses performed by different development teams, as well as (partial) reuse of safety analyses performed on different versions of the QClib product.
Using the Qualified C Library reduces the cost and lead time of safety related software and reduces product liability risks, claimed Tasking. The library is specifically designed for use in embedded systems and is highly optimised in terms of code size, execution speed, and accuracy of mathematical functions.
The TriCore Qualified C Library is available immediately.
Tasking provides development tools, safety and security-oriented embedded software development tools for multi-core architectures. The company is headquartered in Munich, Germany.
Its development tools are used by automotive manufacturers and suppliers, as well as in adjacent markets around the world, to realise high-performance applications in safety-critical areas.
The Tasking Embedded Software Development solutions provide an ecosystem for the entire software development process. Each Tasking compiler is designed for a certain architecture and meets the specific requirements of an industry, including automotive, industrial, telecommunications and datacomms.
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