Israeli company, SolidRun has introduced the Bedrock R7000, a fanless edge AI industrial PC in a compact, rugged housing. It combines eight-core AMD Ryzen 7040 series processors with three Hailo-8 AI accelerators for AI applications. The fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.
The AMD Ryzen 7840HS processor is integrated with a 4nm APU (accelerated processing unit) with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU (graphics processing unit). The 7840HS / 7840U processor features eight cores and 16 threads running at up to 5.1GHz and is based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs at 2700MHz. CPU power can be precisely adjusted in BIOS between 8.0 to 54W. For Edge AI workloads, up to three Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 tera operations per second (TOPS).
The 20 native PCIe Gen4 lanes and up to three Hailo-8 AI accelerators, each with 26 TOPS can be used together with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays, explained SolidRun. The CPU and all devices are passively cooled by the Bedrock R7000’s fanless cooling system in an industrial temperature range of -40 to +85 degrees C.
Edge AI box PCs are used in multiple segments of the embedded market, including industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defence and utilities.
“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC product line manager at SolidRun. The modular design of the Bedrock R7000 allows for customisation, for example around the Hailo-8 AI accelerators.
“An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, product manager at Hailo.
RAM and storage are modular with two SODIMMs supporting 64Gbyte DDR5 ECC/non-ECC, and three NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.
I/O includes four displays comprising HDMI 2.1 + three DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, four USB 3.2 ports and a console port. All I/O is organised on a single face to simplify integration.
Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.
Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V
The enclosure is made of heavy-duty machined aluminium with an anodised finish. It is offered in three variants – 1.0 litre enclosure for dissipating up to 30W by convection, 1.6 litre for 60W and an 0.6 litre “Tile” variant for conduction cooling. The enclosure is suitable for DIN-Rail mounting with a specially designed zero-force locking bracket.
Bedrock R7000 fanless design can handle up to 60W, which is over three times the cooling capacity of typical fanless PCs of similar size, said SolidRun. Cooling innovations include liquid metal TIM, 360 degree stacked heat pipes, dual layer chimney effect heat exchanger and thermal coupling of all internal devices. Dimensions are 45 x 160 x 130mm for the 30W, 0.9 litre model, k73 x 160 x 130mm for the 60W, 1.5 litre model and 29 x 160 x 130mm for the Tile (0.6 litre) model.
http://www.solid-run.com
