NXP and MicroEJ collaborate to use software containers to accelerate embedded platform development

NXP Semiconductors has announced the NXP Platform Accelerator, developed in collaboration with MicroEJ. The NXP Platform Accelerator leverages MICROEJ VEE software containers with standard APIs to bring a smartphone-like software design process experience to the industrial and IoT edge. The use of MICROEJ VEE enables software portability across NXP’s broad portfolio of RTOS-based MCUs and Linux-based applications processors, enabling manufacturers to significantly accelerate new product development and reduce costs. Furthermore, the NXP Platform Accelerator provides dedicated APIs to create easy access to advanced functionalities integrated in NXP’s processor portfolio, such as power management and 3D/2D graphics.

Why it matters: Smart devices across industrial and IoT markets are challenging to develop and deploy. Many are designed for a single purpose, with fixed functionality and limited computing capability that may be insufficient to support the evolving needs of an increasingly automated environment. Scaling product capability requires redeveloping and integrating low-level software, RTOS or higher-level OS, and middleware, which can create major development challenges and significantly slow product development.

The NXP Platform Accelerator solves this challenge by utilising software containerisation that enables binary software portability across the breadth of NXP’s processors portfolio, from MCUs to applications processors. Reusability at the binary level enables customers to prototype new products as quickly as possible and create a broad portfolio of complex smart devices that evolve with market needs and trends. Furthermore, the NXP Platform Accelerator enables sandboxed application deployment at the edge, bringing smartphone-like capability to the edge, such as partial or complete over-the-air updates, downloadable apps, and microservices.

More details: “Just like what happened in the smartphone industry, containerisation can be a tremendous tool to drive the rapid development of new smart device platforms,” said Charles Dachs, Senior Vice President and General Manager, Industrial and IoT Edge, NXP. “By integrating MicroEJ’s software container with NXP’s broad portfolio of edge processing solutions, we equip engineers to bring more products to market faster, with reduced costs, and to support the continuous evolution of their smart devices across industrial and IoT markets.”

“Software portability and BoM optimisation are often mutually exclusive,” said Fred Rivard, CEO of MicroEJ. “The NXP Platform Accelerator combines these two objectives, thanks to tiny software containers. This small-footprint innovation allows developers to benefit from both an optimised bill of materials and a modern software design process. This enables engineers to create new products and platforms more quickly, design products that are lower power and lower cost, while still allowing for feature-rich differentiation and innovation by device manufacturers.”

The NXP Platform Accelerator integrates advanced development tools, including simulation, virtual device management and a multi-language framework for combination of C, Java, and JavaScript languages, as well as agile collaboration processes and support for Android Studio, IntelliJ and Eclipse IDEs. In addition, the NXP Platform Accelerator integrates dedicated APIs for power management and graphic functions, making it extremely easy for customers to utilise the complex and powerful hardware IP brought by NXP. For example, a simple call to “low power profile” from the customer application layer will trigger performance optimisation for a given power profile. In addition, NXP-tailored containers support broad scalability and integrate NXP-specific optimisations and libraries that leverage processor hardware innovations.

The NXP Platform Accelerator is currently available for NXP’s processors, including power-efficient i.MX RT595 and high-performance multi-core i.MX RT1170 crossover MCUs.

http://nxp.com/PlatformAccelerator

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Ceva extends its Connect IP Portfolio with Wi-Fi 7 platform for high-end consumer and industrial IoT

Ceva has announced the general release of its next generation RivieraWaves Wi-Fi 7 IP platform, further expanding its widely-licensed portfolio of connectivity IP, targeting high-end consumer and industrial applications including gateways, TVs, set-top-boxes, streaming media devices, AR/VR headsets, personal computing and smartphones. The RivieraWaves Wi-Fi 7 IP leverages all the latest advanced features of the IEEE 802.11be standard to deliver a premium high performance, cost- and power-optimised Wi-Fi solution for integration into the next wave of Wi-Fi Access Point (AP) and Station (STA) products.

According to global technology intelligence firm ABI Research, annual Wi-Fi enabled chipset shipments will exceed 5.1 billion by 2028, with more than 1.7 billion of these chipsets supporting the Wi-Fi 7 standard. As Wi-Fi enabled device shipments continue to grow, increasing numbers of semiconductor companies and OEMs are choosing to integrate Wi-Fi connectivity into their chip designs, and need access to high quality Wi-Fi IP to reduce the development costs and risks. Spanning Wi-Fi 4/5/6 over the past decade, Ceva has already established a considerable leadership position in Wi-Fi IP licensing, with more than 40 licensees for its RivieraWaves Wi-Fi 6 IP family, serving a wide range of end markets and applications, from end points to access points, across the IoT sphere. Expanding on this leadership position, Ceva’s RivieraWaves Wi-Fi 7 IP provides a unique, comprehensive 802.11be MAC and PHY solution for integration into the next generation of Wi-Fi SoC products.

Andrew Zignani, Senior Research Director, ABI Research, commented: “Ceva’s wireless connectivity IPs play an integral role in the proliferation of connectivity standards in the broad IoT markets, as is evident from their customer’s success in shipping more than 1 billion connectivity chips annually. With the introduction of their RivieraWaves Wi-Fi 7 IP platforms, semiconductor companies and OEMs have a trusted partner to develop differentiated, high-performance Wi-Fi 7 chipsets for their connectivity roadmaps, with lower risk and a lower cost of ownership.”

Tal Shalev, Vice President and General Manager of the Wireless IoT BU at Ceva, stated: “The relentless expansion of Wi-Fi usage has pushed the Wi-Fi 7 standard to offer enhanced data throughput, improved latency and support more spectrum in the face of mounting network congestion. Achieving this requires highly complex, cutting-edge functionalities like 4K QAM modulation, Multi Link Operation and Multi Resource Unit to optimize link efficiency across the available bands. Our RivieraWaves Wi-Fi 7 IP platform incorporates all the features of this latest-generation, wireless standard, dramatically simplifying development and time-to-market for companies looking to add Wi-Fi 7 connectivity to their products.”

Wi-Fi 7’s 4K QAM modulation scheme is a substantial increase on the previous 1K QAM of Wi-Fi 6, while Multi Link Operation (MLO) introduces dynamic channel aggregation, seamlessly combining heterogenous channels from the same or different bands to navigate interference and boost throughput. Similarly, Multi Resource Units (MRU) enables the creation of larger channel bandwidths by intelligently stitching together punctured or disjointed Resource Units within the same band. The outcome is not only a remarkable up to 5 times increase in raw speeds but also significantly reduced latency, thanks to diminished contentions and retries.

visit https://www.ceva-ip.com/product/rivierawaves-wi-fi-platforms/.

 

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Optimising automation with Axiomtek’s new GPU edge system

Axiomtek has unveiled the eBOX671B, a fanless edge computing system that offers optimal data transferring with 2.5GbE LAN ports, cellular 5G module, and Wi-Fi 6 module support for edge computing in industrial automation. With its compatibility with MXM 3.1 Type A GPU cards, the eBOX671B can effectively accommodate up to five display outputs, ensuring optimised performance for various display requirements. Designed to operate reliably in industrial environments, the IP40-rated embedded system features a wide operating temperature of -40°C to +65°C, 3 Grms vibration resistance, and a 9 to 36 VDC power input. The eBOX671B is well-suited for various industrial automation applications such as edge controllers, embedded controllers, machine vision, OT servers, robotics, and more.

The eBOX671B is powered by the 13th/12th gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (codename: Alder Lake S). The reliable eBOX671B comes with two 262-pin DDR5-4800 SO-DIMM slots with up to 64GB of system memory. Two 2.5” SATA HDD/SSD (RAID 0,1 supported) drive bays, one NVMe through M.2 Key M 2280 slot, and one mSATA are available for extensive storage needs. Up to five display outputs are enabled via two HDMI 1.4b, one DisplayPort 1.4a, and two DisplayPort 1.4a via an optional MXM module kit. The eBOX671B also offers great expansion interfaces with one full-size PCI Express Mini Card slot, one M.2 Key M 2280 socket for storage, one M.2 Key E 2230 socket for Wi-Fi 6E, and one M.2 Key B 3052 socket for 5G connectivity. Plus, one front-access SIM slot with cover (through M.2 Key B) and one internal SIM slot for PCIe Mini Card slot are available.

To achieve higher graphics performance, customers can install the MXM GPU onto the eBOX671B within the existing system footprint without increasing the system size, saving time, effort, and money. To optimise system performance and speed up deployment, the rugged eBOX671B can easily enhance its overall efficiency and effectiveness through an optional fan kit and a flexible I/O window supported by mPCIe modules. It is also equipped to facilitate high-speed NVMe storage, leading to a decrease in latency,” said Jason Kao, product manager of AIoT Division at Axiomtek. “Axiomtek’s eBOX671B continues the system design of the series so customers can easily upgrade. In addition, the eBOX671B utilises the Trusted Platform Module 2.0 (TPM 2.0) function onboard to ensure data and network security.”

The edge computing system is equipped with rich I/O interfaces, including two RS-232, two RS-232/422/485 with autoflow, four USB 3.2 Gen2 ports, two USB 3.2 Gen1 ports, three 2.5GbE LAN ports, and one GbE LAN port. Other interfaces include one remote power switch, one grounding screw, and five antenna openings. Besides, this powerful computing embedded system supports Windows 11 IoT, Windows 10 IoT, and Linux.

https://www.axiomtek.com

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ST eases bare-metal development on single-core MPUs with extensions to familiar STM32Cube environment

STMicroelectronics is helping engineers raise the performance of embedded-system designs to the next level with new software for migrating STM32 microcontroller code to more powerful STM32MP1 microprocessors.

As end-users constantly demand more features and faster response from the technology that powers their daily lives and work, brands need effective solutions to boost product performance. Industrial real-time applications are typical. Increasingly, the latest process equipment, factory-automation systems, logistics and retail technology, IoT devices, and digital signage demand greater host-system performance than microcontrollers (MCUs) typically provide.

ST’s STM32MP1 microprocessors (MPUs) address these trends, bringing a powerful Arm Cortex-A7 application-class architecture with more processing power and memory. Users can now take advantage of the new software pack, STM32CubeMP13, to migrate code originally designed for smaller, simpler MCUs and unleash the higher-performance MPU’s extra capabilities in their next-generation products.

STM32CubeMP13 enables an embedded bare-metal application or RTOS on STM32MP13 SoCs, giving an alternative to OpenSTLinux that ensures faster execution times compared to typical microcontrollers. Users can also ensure ported code continues to meet the original implementation’s hard real-time specifications, such as interrupt times and latency. Moreover, an RTOS can leverage the MPU’s larger memory while preserving low power consumption.

Fully integrated in the STM32Cube ecosystem, STM32CubeMP13 lets designers already using ST’s STM32 embedded microcontrollers move up to higher-performance MPU-based projects within the same, familiar development environment. This includes the STM32CubeMX device configurator, STM32CubeIDE development tools, and STM32CubeProgrammer.

STM32CubeMP13 comes with all necessary components needed to run embedded code on STM32MP13 Arm Cortex-A7 MPUs, including the board support package (BSP) and hardware abstraction layer (HAL). Azure RTOS (moving to Eclipse ThreadX) comes pre-integrated as an example real-time operating system. Also, code samples are provided that help embedded developers handle the extra complexity of MPU-based systems, including booting from external memory and power management including DDR-RAM self-refresh control.

Entry-level applications leveraging STM32MP13, targeted at industrial, smart city, smart home, retail, medical, health, and wellness markets, can still be developed using the established ecosystem and OpenSTLinux distribution.

The software is available free of charge and ready to download now from https://www.st.com/en/embedded-software/stm32cubemp13.html

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