Renesas introduces industry’s first general-purpose 32-bit RISC-V MCUs with internally developed CPU core

Renesas Electronics Corporation has announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the development of RISC-V products, Renesas has already designed and tested a new RISC-V core independently, which is now implemented in a commercial product and available globally. The new, R9A02G021 group of MCUs provides embedded systems designers a clear path to developing a wide range of power-conscious, cost-sensitive applications based on the open-source instruction set architecture (ISA).

While most of today’s RISC-V solutions target specific applications, the R9A02G021 group MCUs are designed to serve multiple end markets, such as IoT sensors, consumer electronics, medical devices, small appliances and industrial systems. Similar to existing general-purpose MCUs, designers will have access to a full-scale development environment for the R9A02G021, provided by Renesas and its extensive network of toolchain partners. This will allow them to significantly reduce costs, engineering resources and development time.
The R9A02G021 RISC-V group offers ample performance with clock speeds up to 48MHz, while consuming extremely low power in standby at 0.3µA. It provides 128KB of fast flash memory, 16KB of SRAM memory and 4KB of flash memory for data storage. Designed to withstand harsh conditions, the MCUs can operate reliably at ambient temperatures ranging from -40 °C to 125 °C. The MCUs come with standard serial communications interfaces, as well as digital-to-analog converter (DAC) and analog-to-digital converter (ADC) functions to facilitate high-speed and secure connections with sensors, displays and other external modules. The wide 1.6V to 5.5V input voltage range enables low-voltage, low-current operation and allows noise immunity, making the R9A02G021 ideal for battery-powered devices.

The R9A02G021 RISC-V MCUs are fully supported by Renesas’ e² studio Integrated Development Environment (IDE), offered to customers at no cost. The comprehensive toolchain includes a code configurator, the LLVM compiler and a fast prototyping board (FPB). Complete development environments are also available from Renesas’ partners: IAR with its Embedded Workbench IDE and I-jet debug probe, and SEGGER with the Embedded Studio IDE, J-Link debug probes and Flasher production programmers. Supporting documentation includes the FPB user manual, a Getting Started guide, schematics, Bill of Materials (BOM), and Gerber files.

The R9A02G021 RISC-V MCU is available today through global distributors, along with the FPB, software and development tools.

https://www.renesas.com/MCUs

Written by Annie Shinn

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Microchip expands TrustFLEX family with CEC1736 Real-time Platform Root of Trust Devices

As technology and cybersecurity standards continue to evolve, Microchip is helping make embedded security solutions more accessible with its CEC1736 TrustFLEX devices. The CEC1736 Trust Shield family is a microcontroller-based platform root of trust solution enabling cyber resiliency for data centres, telecom, networking, embedded computing and industrial applications. Now, as part of the TrustFLEX platform, the devices are partially configured and provisioned with Microchip-signed Soteria-G3 firmware to reduce the development time needed to integrate platform root of trust. These devices also help fast-track the provisioning of required cryptographic assets and signed firmware images, simplifying the process of secure manufacturing as required by the National Institute of Standards and Technology (NIST) and Open Compute Project (OCP) standards.

Specifically designed to meet NIST 800-193 platform resiliency guidelines, as well as OCP requirements, CEC1736 TrustFLEX devices can support security features necessary to enable hardware root of trust across various markets. The Trust Platform Design Suite tool will allow customers to personalize platform-specific configuration settings, including unique credentials, to support any application, host processor or SoC that boots out of an external SPI Flash device to extend the root of trust in the system.
Modern firmware security features enabled on the CEC1736 TrustFLEX—like SPI bus monitoring, secure boot, component attestation and lifecycle management—can keep both the pre-boot and real-time (time of check and time of use) environments shielded from both in-person and remote threats.
The highly configurable, mixed-signal, advanced I/O CEC1736 controllers integrate a 32-bit 96 MHz Arm® Cortex®-M4 processor core with closely coupled memory to offer optimal code execution and data access.
The CEC1736 TrustFLEX Configurator, part of the Trust Platform Design Suite, provides a visual view of different use cases to select, configure and generate a provisioning package for development, prototyping and production. The CEC1736 development board is equipped with a socket for easier evaluation and development.

https://www.microchip.com

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New Renesas MCUs with high-resolution analog and Over-the-Air update support

Renesas has introduced the RA2A2 microcontroller (MCU) Group based on the Arm Cortex-M23 processor. The new, low-power devices offer a 24-bit Sigma-Delta analog-to-digital converter (SDADC), and an innovative dual-bank code flash and bank swap function that make it easy to implement firmware over-the-air (FOTA) updates for smart energy management, building automation, medical devices, consumer electronics and other IoT applications that can benefit from firmware updates.

The RA2A2 devices offer multiple power structures and voltage detection hardware to realize energy-efficient, ultra-low power operation as low as 100 µA/MHz in active mode and 0.40µA in software standby mode. An independent power supply real-time clock extends battery life for applications requiring long lifetime management in extreme conditions. The new MCUs also offer AES hardware acceleration, a high-precision (±1.0%), high-speed on-chip oscillator, a temperature sensor, and a wide operating voltage range from 1.6V to 5.5V.

RA2A2 MCUs contribute to the digitalization of conventional systems with key features including high-level analog sensing, FOTA support, 8KHz/4KHz hybrid sampling, and AES hardware accelerator functions. When the end-systems are digitalized, it is possible to analyse individual systems status seamlessly for further energy-efficient, streamlining system operation. For example, next generation smart electricity meters with Non-Intrusive Load Management (NILM) technology enable energy consumption monitoring based on detailed analysis of the current and voltage of the total load. The adoption of smart meters with NILM is the most cost-effective and scalable solution for increasing energy efficiency and lowering energy consumption.

The new RA2A2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA2A2 designs to larger RA devices if customers wish to do so.

https://www.renesas.com/RA2A2

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The new µATX server carrier board offers scalability across the entire Intel Ice Lake D processor range

congatec has expanded its ecosystem for modular edge servers. New products include a server carrier board in µATX form factor and COM-HPC Server-on-Modules based on the latest Intel Xeon D processors (Ice Lake). The new µATX server board for COM-HPC modules was developed for compact real-time servers that are used in edge applications and critical infrastructures. The board can be flexibly scaled with the latest high-end COM-HPC Server modules from congatec. Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for applications with high performance requirements in a space-saving, robust design.

The ecosystem of COM-HPC modules and µATX carrier board offers OEMs a wide range of customisation options at module, board and system level from which developers can freely choose according to their needs. The ecosystem package is tailored to the stringent requirements of edge computing and offers powerful, reliable and ready-to-use building blocks for industrial environments. The modular approach shortens the time to market for new designs and also makes them future-proof.

The new µATX carrier board conga-HPC/uATX server offers maximum I/O and expansion options in a compact standard form factor. This makes the board an ideal solution for numerous applications, such as consolidating servers for virtual machines (VM) or edge servers for energy microgrids, video processing, facial recognition, security applications, smart city infrastructures and many other applications. The conga-HPC/uATX server offers multiple features to drive such applications, including robust communication options with up to 100 GbE and bandwidth, x8 and x16 PCIe expansion for processing AI-intensive workloads via GPGPUs or other compute accelerators, 2x M.2 Key M slots for NVMe SSDs and a M.2 Key B slot for compact AI accelerators or communication modules for WiFi or LTE/5G.

The new conga-HPC/sILL and conga-HPC/sILH Server-on-Modules take advantage of the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, which offers up to 15% more performance at the same TDP compared to the previous D-1700/D-2700 series 8. The improved performance per watt of the COM-HPC modules is ideal for high-performance applications that were previously limited by their thermal budget. They also benefit from Intel Speed Select technology, which makes it easier to balance the computing performance and maximum TDP of the system design. The latest processors have up to 22 cores with higher clock speeds to support next-generation edge applications with more performance per watt for more energy-efficient and therefore more reliable designs. Scalable edge performance and the modular approach increase the flexibility and future-proofing of designs, reduce total cost of ownership and shorten time to market.

The new COM-HPC server modules with their firmware-integrated hypervisor makes the evaluation of consolidating servers with virtual machines particularly easy. Also with full real-time capability, which is provided by TCC, TCN and optional SyncE support. This is particularly ideal for all networked 5G solutions that require very low latencies and strict frequency/clock synchronisation.

For the new COM-HPC Server-on-Modules based µATX solution platform, congatec also offers various cooling solutions, including passive cooling for small chassis. In addition to customising the conga-HPC/uATX server carrier board, the service package also includes customer-specific BIOS/UEFI and real-time hypervisor implementations as well as expansion with additional IIoT functionalities for digitisation purposes.

https://www.congatec.com

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