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u-blox launches first triple-band GNSS module for fast-scaling robotics

Tue, May 20, 2025

u-blox has expanded its ZED form-factor portfolio with the launch of the ZED-F20P, a new L1/L2/L5 triple-band GNSS module designed for high precision applications in ground and air robotics. The ZED-F20P provides OEMs deploying fleets of ground robots, drone light shows, and other dynamic autonomous platforms with centimetre-level RTK and PPP-RTK positioning, fast convergence times, and integrated security features.

It delivers deterministic, centimetre-level RTK and PPP-RTK accuracy tailored to the needs of lightweight and dynamic platforms. Its end-to-end silicon-to-firmware architecture supports 25 Hz update rates, robust security features, and low power consumption in a streamlined design. These capabilities combine to deliver industrial-grade reliability and enable smooth scaling from proof-of-concept to high-volume deployment without increasing system cost, power consumption, or integration complexity.

Compatible with the established ZED footprint and UBX protocol, the ZED-F20P fits directly into existing layouts. The expanded ZED portfolio now covers dual-, triple-, and all-band GNSS options, giving developers the flexibility to select the best fit while reusing the same board layout. This enables both flexible design choices and a straightforward upgrade from earlier products. The ZED-F20P pairs with the u-blox ANN-MB2 all-band high precision antenna to ensure optimal RF performance, offering a one-stop solution for streamlined evaluation and integration.

When combined with u-blox PointPerfect Flex and Live GNSS correction services, the ZED-F20P becomes a complete, production-ready GNSS solution that delivers centimetre-level accuracy in seconds, without the need for a local base station. The triple-band L1/L2/L5 architecture ensures rapid convergence and resilience in challenging environments, while PointPerfect provides reliable corrections across key regions.

https://www.u-blox.com/en/product/zed-f20p-module

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Rutronik introduces the next-gen adapter board RAB7 for Sensorfusion

Tue, May 13, 2025

Rutronik is adding another Adapter Board, the RAB7 – Sensorfusion, into its Rutronik System Solutions series. The new RAB7 offers state-of-the-art sensors and provides all next generation sensors from the suppliers Bosch, Infineon, and Sensirion.

The RAB7 is an Arduino shield adapter for evaluation and prototyping of environmental and inertial sensors from Infineon, Sensirion and Bosch.

To get the most out of a sensorfusion application, it is important to use the best sensors. This is why the next generation sensors from leading sensor suppliers have been added, such as

• Infineon’s XENSIVTM digital barometric pressure sensor DPS368XTSA1,
• Bosch’s digital pressure sensor BMP585,
• Sensirion’s indoor air quality sensor for VOC measurement SGP41-D-R4,
• Bosch’s low-power digital gas, pressure, temperature and humidity sensor with AI BME690,
• Bosch’s 6-axis intelligent low-power inertial measurement unit BMI323,
• Sensirion’s high-precision, low-power relative humidity and temperature sensor SHT41-AD1B-R2, and
• Bosch BMM350 3-axis magnetic sensor for 9-axis absolute orientation for navigation instead of just relative orientation, since the earth’s magnetic field can also be detected.

The Adapter Board RAB7 is powered via Arduino headers with a single 3.3V supply. All sensors are configured to work with the I2C and SPI interface via Arduino compatible ADAM-TECH connectors. Each sensor can be disconnected from the power supply and I2C circuits by unsoldering solder bridges, allowing the use of only the sensors needed for a particular sensorfusion application.

The Adapter Board RAB7 can be easily combined with other Base Boards and Adapter Boards from Rutronik System Solutions. The modular concept allows a variety of approaches to implement development projects quickly, cost-efficient, and simply, yet in a technically sophisticated way. The combination of RDK3 and RAB7 enables local use via Bluetooth Low Energy for wireless sensing applications in the home and outdoors.

This flexibility not only simplifies the development process, but also increases the potential for innovation by allowing different combinations and configurations. Whether working on a simple project or a complex application, the stackable design provides the necessary tools for success by allowing different combinations and configurations.

https://www.rutronik.com/

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Rugged Edge AI system from iBASE engineered on Jetson Orin NX/Nano

Thu, Apr 24, 2025

iBASE has announced the launch of the EC3100, a compact and durable edge AI system powered by NVIDIA Jetson Orin NX and Orin Nano modules. Built to handle real-time AI workloads at the edge, the EC3100 delivers powerful performance with up to an 8-core Arm Cortex-A78AE processor and a 1024-core Ampere GPU with 32 Tensor Cores, making it well-suited for intelligent automation, robotics, and smart surveillance. Its aluminium-steel housing, wide 9V to 36V DC input, and operating temperature range of -20°C to 70°C ensure long-term reliability in tough industrial environments.

The system supports LPDDR5 memory with bandwidths up to 102.4GB/s and runs Ubuntu 22.04, fully optimised for NVIDIA’s JetPack SDK 6.2, which enables Super Mode and fires up more AI performance. It comes with rich I/O options including dual Gigabit Ethernet, HDMI, USB 3.2 and USB 2.0 ports, RS232, CANBus, line-out, mic-in, digital input/output, and a USB Type-C port with OTG and recovery support. Dual SIM sockets and three antenna jacks are also built in to support robust and flexible connectivity in field deployments.

Designed with expansion in mind, the EC3100 features an M.2 2280 M-key slot supporting PCIe NVMe storage, ensuring high-speed data access. Additional M.2 slots enable 4G/5G mobile broadband, out-of-band (OOB) 4G, and wireless communication via WiFi, Bluetooth, or GPS. For AI vision projects, the system includes Summit connectors for optional PoE board and CSI camera integration, enhancing its adaptability across edge AI use cases.

https://www.ibase.com.tw/

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Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

Tue, Apr 22, 2025

The new devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

The RA0E2 devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

Key Features of the RA0E2 Group MCUs
Core: 32MHz Arm Cortex-M23
Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
Extended Temperature Range: Ta -40°C to 125°C
Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
Security: Unique ID, TRNG, AES libraries, Flash read protection
Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.

https://www.renesas.com/RA0E2

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u-blox launches first triple-band GNSS module for fast-scaling robotics

Rutronik introduces the next-gen adapter board RAB7 for Sensorfusion

Rugged Edge AI system from iBASE engineered on Jetson Orin NX/Nano

Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

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