Rugged Edge AI system from iBASE engineered on Jetson Orin NX/Nano

iBASE has announced the launch of the EC3100, a compact and durable edge AI system powered by NVIDIA Jetson Orin NX and Orin Nano modules. Built to handle real-time AI workloads at the edge, the EC3100 delivers powerful performance with up to an 8-core Arm Cortex-A78AE processor and a 1024-core Ampere GPU with 32 Tensor Cores, making it well-suited for intelligent automation, robotics, and smart surveillance. Its aluminium-steel housing, wide 9V to 36V DC input, and operating temperature range of -20°C to 70°C ensure long-term reliability in tough industrial environments.

The system supports LPDDR5 memory with bandwidths up to 102.4GB/s and runs Ubuntu 22.04, fully optimised for NVIDIA’s JetPack SDK 6.2, which enables Super Mode and fires up more AI performance. It comes with rich I/O options including dual Gigabit Ethernet, HDMI, USB 3.2 and USB 2.0 ports, RS232, CANBus, line-out, mic-in, digital input/output, and a USB Type-C port with OTG and recovery support. Dual SIM sockets and three antenna jacks are also built in to support robust and flexible connectivity in field deployments.

Designed with expansion in mind, the EC3100 features an M.2 2280 M-key slot supporting PCIe NVMe storage, ensuring high-speed data access. Additional M.2 slots enable 4G/5G mobile broadband, out-of-band (OOB) 4G, and wireless communication via WiFi, Bluetooth, or GPS. For AI vision projects, the system includes Summit connectors for optional PoE board and CSI camera integration, enhancing its adaptability across edge AI use cases.

https://www.ibase.com.tw/

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Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

The new devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

The RA0E2 devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

Key Features of the RA0E2 Group MCUs
Core: 32MHz Arm Cortex-M23
Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
Extended Temperature Range: Ta -40°C to 125°C
Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
Security: Unique ID, TRNG, AES libraries, Flash read protection
Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.

https://www.renesas.com/RA0E2

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Mikroe’s Stephano-I Click delivers WiFi and Bluetooth LE connectivity for reliable IoT

Stephano-I Click from MIKROE, is a compact add-on board designed to add WiFi and Bluetooth LE connectivity to any embedded application. A new member of Mikroe’s mikroBUS enabled Click board family, this board features the Stephano-I (2617011025000) radio module from Würth Elektronik.

Comments Nebojsa Matic, CEO of Mikroe: “Stephano-I Click is ideal for IoT, smart home, and industrial applications, enabling low power wireless communication with smart devices and cloud services.”

The Stephano-I module supports IEEE 802.11 b/g/n WiFi in the 2.4GHz band and Bluetooth LE 5 in both peripheral and central roles, offering dual radio support with a simple AT command interface over UART. It features a 1Mbps data rate, WiFi output power up to 13.4dBm, and Bluetooth LE output power up to 4.5dBm. The Click board includes standard UART communication pins, hardware flow control, reset and wake-up options, and additional unpopulated debug and boot control pins for advanced functionality.

Stephano-I Click is fully compatible with the mikroBUS socket and can be used on any host system supporting the mikroBUS standard. It comes with the mikroSDK open-source libraries, offering unparalleled flexibility for evaluation and customisation.

Stephano-I Click also features the ClickID function which simplifies use by enabling the host system to seamlessly and automatically detect and identify this add-on board.

https://www.mikroe.com

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Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

Adlink has announced the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.

Powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is for high-performance battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.

The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).

In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.

The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximises space efficiency without compromising functionality for next-generation edge applications. Adlink offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2nd half of 2025.

https://www.adlinktech.com

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