Innodisk unveils MIPI over Type-C solution for enhanced AI vision applications

Innodisk, has announced the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable lengths limitations, allowing embedded camera modules to be positioned farther from the system.

This expands the possibilities for visual AI applications, particularly in smart manufacturing and smart cities, enabling the seamless integration of high-quality vision systems into these evolving environments.

The increasing popularity of vision-based applications across industries highlights the critical need for high- quality, reliable camera solutions. As computer vision becomes a cornerstone of AI development, the demand for industrial-grade cameras continues to surge. Innodisk recognises this need and has developed the MIPI over Type-C Solution to address the challenges faced by vision system integrators and developers.

Innodisk’s MIPI over Type-C technology extends the connection distance to 2 meters or more, surpassing the previous 30 cm cable length limitation while maintaining high performance. It enables seamless conversion to a custom USB Type-C interface through a tailor-made adapter board and offers cost- effectiveness compared to SerDes solutions. Additionally, this solution boasts successful deployments on NVIDIA Jetson, Intel x86, and ARM platforms, with Innodisk actively investing in R&D to ensure ongoing compatibility across various platforms, accelerating the deployment of edge AI applications for clients.

Innodisk’s MIPI over Type-C camera module solutions are extensively used in various smart applications. They are revolutionising industries like smart manufacturing, where AMRs and forklifts benefit from high- quality imaging and extended reach. Similarly, shared mobility applications such as shared bikes leverage these modules for enhanced safety and efficiency. By offering a combination of high bandwidth and longer range, Innodisk’s solution removes cable length limitations, unlocking a wave of new possibilities for smart applications.

Innodisk’s MIPI over Type-C solution marks a significant leap forward, building upon its diverse MIPI camera module portfolio and seamless platform integration. This includes compatibility with NVIDIA Jetson, Intel 12th to 13th Gen, Core Ultra processor, AMD Xilinx, and NXP. As the sole Intel-certified MIPI Camera partner in Taiwan, Innodisk collaborates closely with IPC manufacturers, possessing professional integration capabilities to offer comprehensive support and services to customers. The MIPI over Type-C Solution is poised to redefine the future of vision technology, offering performance, flexibility, and affordability.

http://www.innodisk.com

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Insight SiP launches miniature Wi-Fi 6 combo module with integrated antennas

Insight SiP has launched its ISP5261 Wi-Fi 6 module at Embedded World 2024. This module acts as a fully functioning Bluetooth LE and Wi-Fi radio node, capable of a long autonomous operation on battery power. It can form the core of an autonomous IOT device requiring Bluetooth LE and Wi-Fi connectivity.

This device offers integration and miniaturisation of RF technologies, using System in Package technology. The device also benefits from Insight SiP’s proprietary “Antenna-in-Package” techniques.

The module is based on NXP Semiconductors RW612 single-chip Wi-Fi/Bluetooth LE/802.15.4 Wireless MCU System on Chip (SoC). The module integrates a 32-bit ARM Cortex-M33 CPU running at 260 MHz, additional 4 MB of QSPI flash memory, 1.2 MB SRAM as well as analog and digital peripherals. Its powerful processor and ample memory permit this module to be used as the core of a sophisticated IOT application.

Despite the small size of 12 x 12 x 1.8 mm, the module integrates decoupling capacitors, 40 MHz crystal for Wi-Fi and Bluetooth LE and 32.768 kHz crystal for low power timing, DC-DC converters, RF matching circuits and a dual-band (2.4 and 5 GHz) antenna. This module thus offers class leading performance and miniaturisation.

Low power consumption and advanced power management enable battery lifetimes up to several months on AA batteries. Wi-Fi communication is compliant with the Wi-Fi Alliance specifications for Wi-Fi 6 including the following protocols: IEEE 802.11ax/ac/n/a/g/b/e/i/k/v/w.

Bluetooth LE connectivity is compliant with Bluetooth 5.4, enabling Long Range communication. ISP5261 Bluetooth LE section can be used either in peripheral or central roles and can handle up to 16 simultaneous central/peripheral connections. Also supported are the Matter and Thread protocols, allowing easy internet access and support for SmartHome applications.

Security Features are prominent in the module, with an ARM TrustZone processor, and NXP Edgelock hardware security module, supporting Root of Trust, secure communication and update verification.

https://www.insightsip.com

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Ceva launches multi-protocol wireless platform IP family to accelerate enhanced connectivity

Ceva has launched Ceva-Waves Links, a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IEEE 802.15.4 (for Thread / Zigbee / Matter), to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimised co-existence schemes and adapted to various radios and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 / Bluetooth 5.4 / 802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer.

The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip. ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028.

The first member of the Ceva-Waves Links family, the Links100, is an integrated, low power, Wi-Fi / Bluetooth / 15.4 communications subsystem IP for IoT applications, with the following key features:
• Wi-Fi 6 optimised for cost-sensitive IoT applications,
• Bluetooth 5.4 Dual Mode, supporting advanced Bluetooth Audio with Auracast, and with a comprehensive suite of Bluetooth profiles
• IEEE 802.15.4 (for Thread, ZigBee, Matter) for smart home applications
• Optimised co-existence scheme for efficient concurrent communications
• Pre-integrated with a low power multi-protocol radio at TSMC 22nm process

With its modular architecture, the Ceva-Waves Links family is highly versatile to meet customers’ needs, leveraging the latest Ceva-Waves wireless IPs. Upcoming Links platforms may include:
• Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming
• Next generation Bluetooth for Channel Sounding and High Data Throughout
• UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features
• Optimised co-existence schemes for each specific configuration
• Pre-integrated radio solutions, including partner and customer’s own technology, to address a wide range of configurations and foundry process nodes

For more information, visit https://www.ceva-ip.com

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Microchip brings enhanced code protection and up to 15W of power delivery to its USB microcontroller portfolio

The well-known advantages of a Universal Serial Bus (USB) interface for embedded designs include its compatibility with various devices, streamlined communication protocol, in-field updatability and power delivery capabilities. To help easily incorporate this functionality into embedded systems, Microchip has launched the AVR DU family of microcontrollers (MCUs). As the next generation of Microchip 8-bit MCUs to integrate USB connectivity, the AVR DU family is designed to provide enhanced security features and higher power delivery than previous iterations.

“USB is the standard communication protocol and power delivery method for electronic devices,” said Greg Robinson, corporate vice president of Microchip’s 8-bit MCU business unit. “Microchip’s AVR DU family combines the flexibility of our most advanced 8-bit MCUs with the versatility of enhanced power delivery to bring the benefits of USB to a wider range of embedded systems.”

AVR DU MCUs support power delivery of up to 15W from the USB interface, a capability not commonly found in other USB microcontrollers within its class. This feature enables USB-C® charging with currents up to 3A at 5V, making these MCUs an excellent choice for devices like portable power banks and rechargeable toys.

To strengthen its defence against malicious attacks, the AVR DU family incorporates Microchip’s Program and Debug Interface Disable (PDID) feature. When enabled, the enhanced code protection is designed to lock out access to the programming/debugging interface and block unauthorised attempts to read, modify or erase firmware. To enable secure firmware updates, the AVR DU family employs Read-While-Write (RWW) Flash and, when combined with a secure bootloader, designers can use the USB interface for patching bugs, addressing security concerns and adding new features without disrupting product operation. This updated functionality in the AVR DU MCUs is designed to allow for uninterrupted, in-field updates to help extend the lifetime value of products.

Additionally, the AVR DU family helps reduce overall design and Bill of Material (BOM) costs through a USB clock recovery feature, which eliminates the need for a costly external crystal. Core Independent Peripherals (CIPs) enable designers to incorporate main device functions and system management tasks onto a compact, single-chip solution, saving board space and reducing design effort.

Developers of a wide range of embedded designs, from fitness wearables and home appliances to agricultural and industrial applications, can benefit from incorporating the highly efficient AVR DU MCUs into their designs.

https://www.microchip.com

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