Embedded

Mikroe’s Stephano-I Click delivers WiFi and Bluetooth LE connectivity for reliable IoT

Tue, Apr 15, 2025

Stephano-I Click from MIKROE, is a compact add-on board designed to add WiFi and Bluetooth LE connectivity to any embedded application. A new member of Mikroe’s mikroBUS enabled Click board family, this board features the Stephano-I (2617011025000) radio module from Würth Elektronik.

Comments Nebojsa Matic, CEO of Mikroe: “Stephano-I Click is ideal for IoT, smart home, and industrial applications, enabling low power wireless communication with smart devices and cloud services.”

The Stephano-I module supports IEEE 802.11 b/g/n WiFi in the 2.4GHz band and Bluetooth LE 5 in both peripheral and central roles, offering dual radio support with a simple AT command interface over UART. It features a 1Mbps data rate, WiFi output power up to 13.4dBm, and Bluetooth LE output power up to 4.5dBm. The Click board includes standard UART communication pins, hardware flow control, reset and wake-up options, and additional unpopulated debug and boot control pins for advanced functionality.

Stephano-I Click is fully compatible with the mikroBUS socket and can be used on any host system supporting the mikroBUS standard. It comes with the mikroSDK open-source libraries, offering unparalleled flexibility for evaluation and customisation.

Stephano-I Click also features the ClickID function which simplifies use by enabling the host system to seamlessly and automatically detect and identify this add-on board.

https://www.mikroe.com

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Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

Tue, Apr 08, 2025

Adlink has announced the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.

Powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is for high-performance battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.

The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).

In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.

The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximises space efficiency without compromising functionality for next-generation edge applications. Adlink offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2nd half of 2025.

https://www.adlinktech.com

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The smart evolution of Bluetooth module from Panasonic

Tue, Apr 01, 2025

Panasonic has announced the release of PAN1783, a Bluetooth 5.4 Low Energy (LE) module that follows the PAN1780. Building upon the success of its predecessor, the PAN1780, the PAN1783 sets new standards in performance, versatility, and efficiency.

According to Tomislav Tipura, Product Manager at Panasonic Industry Europe’s IoT Department, “the PAN1783 represents a significant leap forward in Bluetooth technology, offering unparalleled features and capabilities to meet the evolving needs of our customers.”

Being as compact as 15.6 x 8.7 mm, the PAN1783 is one of the smallest nRF5340 module currently available in the market. It is powered by the Nordic nRF5340 single-chip controller, boasting isochronous channels for LE audio support. This module is available with both an on-board chip antenna and an RF-bottom pad, providing flexibility to suit various design requirements – CE RED, FCC, UKCA und ISED certificates included!

Featuring Bluetooth 5.4 enhancements, including isochronous channels, LE audio, and support for high-throughput of 2 Mbps, advertising extensions, and long range, the PAN1783 delivers exceptional performance, according to Panasonic. Its all-in-one System-on-Chip (SoC) design combines the best features of the nRF52 Series with increased performance and memory, all while minimising power consumption. The improved sensitivity of the nRF5340, coupled with the LE coded PHY, makes the PAN1783 an attractive choice for a wide range of applications, including advanced computer peripherals, I/O devices, wearables, and wireless audio devices. Moreover, its ultra-low current consumption makes it ideal for battery-powered devices, extending operational lifespans.

Equipped with two Cortex-M33 processors – one as an application processor and the other as a network processor – the PAN1783 offers seamless integration and standalone operation. This eliminates the need for an external processor, simplifying design, reducing space requirements, and ultimately helps lowering costs for manufacturers.

In addition to its Bluetooth capabilities, the PAN1783 supports angle of arrival (AoA) and angle of departure (AoD) direction finding, enhancing location-based services and applications. Furthermore, it also supports Type 2 Near Field Communication (NFC-A), facilitating simplified pairing and payment solutions when used with an external antenna.

https://industry.panasonic.eu

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New Silicon Labs Wi-Fi 6 plus Bluetooth modules for embedded IoT applications

Mon, Mar 24, 2025

Mouser is now shipping the new SiWx917Y wireless modules from Silicon Labs. The SiWx917Y wireless modules provide ultra-low-power Wi-Fi 6, Bluetooth® Low Energy (LE) 5.4, and Matter connectivity for a host of embedded, battery-powered IoT devices in smart homes, consumer, industrial, and healthcare applications.

The Silicon Labs SiWx917Y series are fully integrated, shielded modules with a dedicated wireless processing subsystem, an application processing subsystem (MCU), and an advanced security engine. They have a rich set of peripherals framed by an intelligent power management subsystem that includes an antenna (or RF-pin) and worldwide RF regulatory certifications, simplifying development and certification processes.

The SiWx917Y modules’ processing subsystem consists of a network wireless processor (160MHz), baseband digital signal processing, an analog front end, a 2.4 GHz RF transceiver, and a power amplifier. The application processing subsystem features an ARM Cortex-M4 with FPU at 180 MHz, a large, embedded SRAM, Flash, PSRAM, and an option for external Flash/PSRAM. The modules come with modular radio-type approvals for various countries, including the US (FCC), Canada (IC/ISED) and Japan (MIC), and follow the relevant EN standards (including EN 300 328 v2.2.2) for conformity with directives and regulations in EU and UK.

https://eu.mouser.com

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