Tria’s new family of compute modules powered by Qualcomm processors

The new family of embedded compute modules from Tria, an Avnet company specialising in manufacturing embedded compute boards, not only have Qualcomm Dragonwing processors on board—they now support different operating systems. These options include Android, Windows 11 IoT Enterprise, and Yocto Linux. The variety of operating systems supported enable the modules to be used for embedded designs in the industrial, medical, agriculture and construction sectors, as well as any embedded application that can benefit from edge computing, machine learning and AI.

At the heart of these modules are high-performance, low-power Qualcomm Dragonwing processors, providing advanced technology in customised solutions. With advanced edge AI and seamless networking capabilities, Qualcomm Dragonwing targets embedded systems for various industries. These processors have been designed for speed, scalability and reliability, enabling customers to achieve smarter decision making, better efficiencies and to reach the market faster.

This means that Tria’s new lineup offers a powerful CPU and AI combination at lowest power consumption, enabling embedded designs to benefit from higher performance and increased capabilities.

Tria also now provides Microsoft Windows with ARM, allowing a transition from the x86 architecture to ARM with the same OS. This transition was previously not possible, since Windows on ARM was not available.

“Our collaboration with Qualcomm Technologies has enabled us to deliver high performance and low power technology with highest quality they are used to receiving from Tria in our new compute modules,” said Christian Bauer, Product Marketing Manager, Tria Technologies. “This family of modules is the only one available to offer compatibility with multiple operating systems at a competitive price.”

“With multi-OS support across Tria’s new modules powered by Qualcomm Dragonwing and Snapdragon platforms, customers gain the flexibility of Windows, Android and Linux across our different platforms”, said Douglas Benitez, Senior Director, Business Development, Qualcomm Europe, Inc. “Our collaboration with Tria is accelerating industrial innovation—delivering high performance, low power compute and accelerated AI at the edge.”

Qualcomm Dragonwing processors are known for their performance, efficiency and advanced AI capabilities, offering powerful performance in multi-core tasks and great GPU performance, but also more efficient power consumption in mobile and portable systems.

https://www.Tria-technologies.com

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ASRock launches industrial motherboards for AI-driven Edge applications

ASRock Industrial has announced its next generation industrial motherboards powered by Intel Core 200S series processors (Bartlett Lake-S), supporting up to 24 cores and 32 threads. The new series delivers improved single-thread, multi-thread and AI-performance, along with DDR5 5600 MHz memory support up to 192GB, advanced I/O capabilities, PCIe Gen 5/4 expandability, 4K quad-display powered by Intel UHD Graphics 770 with Xe architecture. With BIOS-level update support, the new series enables customers to seamlessly upgrade existing 14th, 13th, and 12th Gen Intel CPU-based motherboards to the latest generation. Available in Mini-ITX, Micro-ATX, and ATX form factors with longevity support, the motherboards are built for intelligent edge applications across smart manufacturing, autonomous robotics, machine vision, retail, kiosks, digital signage, gaming, and security environments.

ASRock industrial’s Intel Core 200S DDR5 supported motherboards are available in Mini-ITX, Micro-ATX, and ATX form factors, built on Intel W680, Q670, and H610 chipsets to meet a broad range of industrial computing demands.

For compact systems, the Mini-ITX models feature two DDR5 4800/5600 MHz memory slots up to 96GB, support quad displays on Q670/W680, triple displays on H610, and offer dual LAN ports—one 2.5G and one 1G. Models with streamlined I/O options include the IMB-1239-WV, IMB-1240-WV, IMB-1244-WV, and IMB-X1240-WV, IMB-X1244-WV, supporting H610, Q670, and W680 chipsets. For applications that require expanded I/O capabilities, additional Mini-ITX options such as the IMB-1237, IMB-1238, and IMB-X1238 are also available with the same chipset support.

In the Micro-ATX lineup, IMB-X1316-10G and IMB-X1316 are powered by the W680 chipset and IMB-1316 with a Q670 chipset support quad-display output, up to 192GB DDR5 4400/5600 MHz memory, multiple PCIe Gen5/Gen4 slots, and advanced networking with 10G (IMB-X1316-10G), 2.5G, and 1G LAN. IMB-1318 and IMB-1315, based on H610, featuring DDR5 4800/5600 MHz memory up to 96GB, triple HDMI (IMB-1318), dual HDMI (IMB-1315) and dual 1G LAN.

For high-performance needs, the ATX models includes IMB-X1714 with W680 chipset, IMB-1714 based on Q670 chipset, and IMB-1713 featuring H610 chipset. These ATX boards offer support up to 192GB DDR5 memory (IMB-1714/IMB-X1714), multiple PCIe Gen5/Gen4 slots, triple displays, and up to triple LAN with 2.5G support (IMB-1714/IMB-X1714). The series is ideal for smart manufacturing, autonomous robotics, AI inference, Retail and advances edge computing.

ASRock Industrial also provides a lineup of DDR4 supported motherboards for Intel Core 200S Series Processors, delivering solutions optimised for AI-enabled industrial environments.

Within the Mini-ITX high-rise I/O category, models such as IMB-1230, IMB-1241, and IMB-1242 are built on the H610 chipset, while IMB-1231 and IMB-X1231 adopt the Q670 and W680 chipsets respectively, supporting up to 64GB DDR4 3200 MHz memory, quad or triple displays outputs, and dual LAN for reliable edge connectivity. For compact thin I/O designs, the Mini-ITX series includes IMB-1232-WV with H610, IMB-1233-WV with Q670, and IMB-X1233-WV with W680, offering wide voltage input, essential I/O, dual LAN and up to quad display support, ideal for space-constrained deployments such as retail automation, kiosks, and edge devices running lightweight AI workloads.

The Micro-ATX models include IMB-1314 with Q670 and IMB-X1314 with W680, providing dual DDR4 3200 MHz memory support up to 128GB, four PCIe Gen4 slots, quad-display output, dual 2.5G LAN (IMB-1314) and triple 2.5G LAN (IMB-X1314), and USB 3.2 Gen2 for smooth data processing and connectivity in AI-assisted manufacturing and system monitoring applications.

In the ATX form factor, IMB-1712 powered by Q670 and IMB-X1712 by W680 offer high expandability with triple 2.5G LAN (IMB-X1712,) and dual 2.5G LAN (IMB-1712), four PCIe Gen4 slots, M.2 and SATA storage interfaces, and triple display output including HDMI, DP and VGA. These platforms are designed for long-life deployment in industrial control, intelligent surveillance, smart retail, and AI-enhanced display centric systems at the edge.

ASRock Industrial’s latest industrial motherboards, now supporting Intel Core 200S series processors (Bartlett Lake-S) through BIOS updates, are engineered to accelerate AI-driven applications at the edge. Offering flexible configuration with DDR5 and DDR4 memory across Mini-ITX, Micro-ATX, and ATX form factors, the series is tailored for smart manufacturing, machine vision, intelligent automation, and industrial AIoT and more.

https://asrockind.com

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u-blox launches first triple-band GNSS module for fast-scaling robotics

u-blox has expanded its ZED form-factor portfolio with the launch of the ZED-F20P, a new L1/L2/L5 triple-band GNSS module designed for high precision applications in ground and air robotics. The ZED-F20P provides OEMs deploying fleets of ground robots, drone light shows, and other dynamic autonomous platforms with centimetre-level RTK and PPP-RTK positioning, fast convergence times, and integrated security features.

It delivers deterministic, centimetre-level RTK and PPP-RTK accuracy tailored to the needs of lightweight and dynamic platforms. Its end-to-end silicon-to-firmware architecture supports 25 Hz update rates, robust security features, and low power consumption in a streamlined design. These capabilities combine to deliver industrial-grade reliability and enable smooth scaling from proof-of-concept to high-volume deployment without increasing system cost, power consumption, or integration complexity.

Compatible with the established ZED footprint and UBX protocol, the ZED-F20P fits directly into existing layouts. The expanded ZED portfolio now covers dual-, triple-, and all-band GNSS options, giving developers the flexibility to select the best fit while reusing the same board layout. This enables both flexible design choices and a straightforward upgrade from earlier products. The ZED-F20P pairs with the u-blox ANN-MB2 all-band high precision antenna to ensure optimal RF performance, offering a one-stop solution for streamlined evaluation and integration.

When combined with u-blox PointPerfect Flex and Live GNSS correction services, the ZED-F20P becomes a complete, production-ready GNSS solution that delivers centimetre-level accuracy in seconds, without the need for a local base station. The triple-band L1/L2/L5 architecture ensures rapid convergence and resilience in challenging environments, while PointPerfect provides reliable corrections across key regions.

https://www.u-blox.com/en/product/zed-f20p-module

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Rutronik introduces the next-gen adapter board RAB7 for Sensorfusion

Rutronik is adding another Adapter Board, the RAB7 – Sensorfusion, into its Rutronik System Solutions series. The new RAB7 offers state-of-the-art sensors and provides all next generation sensors from the suppliers Bosch, Infineon, and Sensirion.

The RAB7 is an Arduino shield adapter for evaluation and prototyping of environmental and inertial sensors from Infineon, Sensirion and Bosch.

To get the most out of a sensorfusion application, it is important to use the best sensors. This is why the next generation sensors from leading sensor suppliers have been added, such as

• Infineon’s XENSIVTM digital barometric pressure sensor DPS368XTSA1,
• Bosch’s digital pressure sensor BMP585,
• Sensirion’s indoor air quality sensor for VOC measurement SGP41-D-R4,
• Bosch’s low-power digital gas, pressure, temperature and humidity sensor with AI BME690,
• Bosch’s 6-axis intelligent low-power inertial measurement unit BMI323,
• Sensirion’s high-precision, low-power relative humidity and temperature sensor SHT41-AD1B-R2, and
• Bosch BMM350 3-axis magnetic sensor for 9-axis absolute orientation for navigation instead of just relative orientation, since the earth’s magnetic field can also be detected.

The Adapter Board RAB7 is powered via Arduino headers with a single 3.3V supply. All sensors are configured to work with the I2C and SPI interface via Arduino compatible ADAM-TECH connectors. Each sensor can be disconnected from the power supply and I2C circuits by unsoldering solder bridges, allowing the use of only the sensors needed for a particular sensorfusion application.

The Adapter Board RAB7 can be easily combined with other Base Boards and Adapter Boards from Rutronik System Solutions. The modular concept allows a variety of approaches to implement development projects quickly, cost-efficient, and simply, yet in a technically sophisticated way. The combination of RDK3 and RAB7 enables local use via Bluetooth Low Energy for wireless sensing applications in the home and outdoors.

This flexibility not only simplifies the development process, but also increases the potential for innovation by allowing different combinations and configurations. Whether working on a simple project or a complex application, the stackable design provides the necessary tools for success by allowing different combinations and configurations.

https://www.rutronik.com/

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