Embedded

Innodisk unveils camera module and adapter board for Edge AI vision

Wed, Dec 10, 2025

Innodisk has announced its latest GMSL2TM camera module and adapter board series, designed to deliver long-distance, low-latency, and robust image transmission for demanding edge AI applications. Built for streamlined integration, the solution enables precise real-time analysis across mobility, robotics, and industrial surveillance applications.

The Innodisk GMSL2TM series supports cable lengths up to 15 meters with FAKRA cable, delivering up to 13MP high-resolution imaging. Powered by the Sony ISX031 sensor, featuring integrated ISP with High Dynamic Range (HDR) and LED Flicker Mitigation (LFM), the module captures clear, stable images in challenging lighting conditions from bright sunlight to dark tunnels, and removes visual artefacts caused by pulsed LED lighting. It ensures precise brightness control and consistent imaging performance.

With IP67/IP69K ruggedised housing, the GMSL2TM camera withstands high-pressure washing, dust, water, and vibration, which is ideal for mines, ports, construction vehicles, logistics facilities, and outdoor robotic systems.

To accelerate time-to-market and reduce integration complexity, Innodisk provides customisable adapter boards optimised for the NVIDIA Jetson Orin platform. This approach enables rapid development and validation for system integrators. The solution supports multi-camera, synchronised streaming. Customers can quickly implement multi-view AI perception and sensor fusion capabilities. This enhances AI accuracy and autonomous decision-making in real-world applications.

Innodisk, together with its subsidiary Aetina, offers edge AI heterogeneous platform solutions with comprehensive visual sensing capabilities, and also collaborates with partners including Advantech, ASUS, and ASRock Industrial to deploy GMSL2TM camera modules across multiple platforms, reaching a wider range of vertical markets.

www.innodisk.com

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Advantech and Axelera AI partnership to accelerate Edge AI innovation

Wed, Dec 10, 2025

Advantech has announced a new strategic collaboration with Axelera AI, a pioneering AIPU solution provider, to jointly develop a new generation of Edge AI acceleration modules powered by the Europa AIPU.

These joint solutions will complement Advantech’s existing suite of products that support Metis and target low-power, high-performance edge use cases. The partnership furthers Advantech’s commitment to integrating advanced AI acceleration technology, delivering high-performance solutions to market ahead of the industry curve and supporting customers across industrial automation, robotics, smart cities, and medical imaging to accelerate the adoption of edge AI applications.

“This collaboration with Axelera AI marks an important milestone in Advantech’s AI acceleration roadmap,” said Joey Hsu, Director of Advantech’s Embedded Sector. “By combining Axelera AI’s cutting-edge neural processing technology with Advantech’s system design expertise and global deployment capabilities, we are enabling customers to deploy cutting-edge AI solutions with greater speed and scalability.”

At the core of the partnership is Advantech’s new Edge AI Acceleration Module (EAI-3841 series), featuring the Europa AIPU, which delivers up to 629 TOPS of performance and supports up to 164GB of LPDDR5 memory. With eight AI cores, integrated RAM per compute unit, and a built-in video decoder, the module enables real-time, complex model analysis, including VLM, and VITs. Additionally, it is designed for companies seeking multi-camera analysis—ideal for robotic vision, intelligent surveillance, in-vehicle systems, and precision medical diagnostics.

“We are excited to further our collaboration with Advantech, a recognised leader in industrial edge computing,” said Nicolas Silvestre, Director of Sales, APAC – Axelera AI. “The integration of our Europa AIPU into Advantech’s platforms will empower customers with unprecedented AI performance and efficiency, enabling smarter, faster, and more sustainable edge applications.”

www.advantech.com

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Tria provides performance boost for Qseven COM standard

Wed, Dec 10, 2025

Tria Technologies has launched two new Qseven (Q7) Computer-on-Modules (COMs), ensuring Q7 designs remain viable until at least 2034, with an optional extension to 2039. The new modules, TRIA-Q7-ASL and TRIA-Q7-ALN, are based on the popular Q7 entry-level standard, and provide both a substantial performance boost and a guaranteed product lifetime extension, making Q7 a reliable choice for long-term projects.

Featuring Intel’s innovative “Amston Lake” and “Alder Lake N” platforms, the new TRIA Q7 modules are engineered to keep Q7-based designs feasible, ensuring component continuity well into the next decade.

The TRIA Q7-ASL module integrates the Intel Atom x7000RE/C Series processors, delivering robust and efficient performance. Complementing this, the TRIA Q7-ALN module supports Intel Atom x7000E, Intel Core i3, and N Series, catering to diverse application requirements. Both modules offer up to eight cores and Intel UHD graphics based on Xe architecture for broad application compatibility.

Each new module can support three independent 4K displays for advanced visual solutions and offer high-speed LPDDR5 memory support up to 32GB. There is an extensive set of interfaces including USB 3.1, PCIe Gen3 and eMMC 5.1 on a power saving and cost-efficient Q7 2.1 form factor module. Additionally, the TRIA Q7-ALN and TRIA Q7-ASL modules offer Gigabit Ethernet based on Intel® i226 and support up to 2.5GbE bandwidth.

Available with dual-, quad- and eight-core SoC options, the new Q7 modules are ideal for a wide variety of applications including point-of-sales terminals, digital signage controllers and HMI solutions found in medical equipment, transportation systems, IoT and industrial automation. Furthermore, the Q7-ASL module is ideal for system products that are exposed to more harsh ambient conditions as it is designed for extended temperature range from -40°C to + 85°C, and for 24/7 continuous operation.

Additionally, Tria provides a Q7 2.1 development platform for easy evaluation and design-in of both modules. A complete, ready-to-run Starterkit is available making it as simple as possible for designers to integrate the modules into their systems.

All modules can be used as a plug-and-play solution, combined with carrier boards, or customised depending on the specifics of the application.

www.tria-technologies.com

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Avnet Silica announces new franchise agreement with DEEPX

Tue, Dec 09, 2025

Avnet Silica has announced its new franchise agreement with DEEPX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful artificial intelligence (AI) semiconductor technology.

As engineers look to deploy more sophisticated AI workloads at the Edge, they face the critical challenge of delivering high-performance intelligence within strict power and thermal limits. To solve this dilemma, they require access to scalable hardware solutions that bridge the gap between low-power microcontrollers and energy-intensive GPUs.

This new partnership bolsters Avnet Silica’s AI offering and addresses growing customer demand for high-performance, ultra-low-power AI solutions designed for the Edge. Customers across the EMEA region can now access DEEPX’s innovative solutions, which are created for intensive next-generation embedded applications such as smart city infrastructure, autonomous mobile robotics (AMRs), machine vision, smart factories, and autonomous vehicles.

“We are continually focused on helping our customers bridge the gap between high-performance AI demands and the realities of constrained power budgets at the Edge,” commented Michaël Uyttersprot, Manager System Solutions, AI/ML & Vision System Solutions at Avnet Silica. “DEEPX delivers the essential NPU architecture and efficiency required to deploy sophisticated models in power- and thermal-sensitive environments, significantly enhancing the options across our existing linecard.”

Tim Park, Strategy Marketing Director at DEEPX, added: “DEEPX aims to build ultra-low-power AI infrastructure that enables intelligence anywhere in the world. Our partnership with Avnet Silica will be a significant catalyst in expanding DEEPX’s high-performance, power-efficient AI semiconductors across global markets. Together, our combined supply chain reliability and proven technologies will empower more customers to adopt AI as a practical and scalable infrastructure.”
For additional information on Avnet Silica’s DEEPX offering and accelerating the development and deployment of power-efficient, high-performance AI applications, please visit this link.

my.avnet.com

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