Tria’s new family of compute modules powered by Qualcomm processors

The new family of embedded compute modules from Tria, an Avnet company specialising in manufacturing embedded compute boards, not only have Qualcomm Dragonwing processors on board—they now support different operating systems. These options include Android, Windows 11 IoT Enterprise, and Yocto Linux. The variety of operating systems supported enable the modules to be used for embedded designs in the industrial, medical, agriculture and construction sectors, as well as any embedded application that can benefit from edge computing, machine learning and AI.

At the heart of these modules are high-performance, low-power Qualcomm Dragonwing processors, providing advanced technology in customised solutions. With advanced edge AI and seamless networking capabilities, Qualcomm Dragonwing targets embedded systems for various industries. These processors have been designed for speed, scalability and reliability, enabling customers to achieve smarter decision making, better efficiencies and to reach the market faster.

This means that Tria’s new lineup offers a powerful CPU and AI combination at lowest power consumption, enabling embedded designs to benefit from higher performance and increased capabilities.

Tria also now provides Microsoft Windows with ARM, allowing a transition from the x86 architecture to ARM with the same OS. This transition was previously not possible, since Windows on ARM was not available.

“Our collaboration with Qualcomm Technologies has enabled us to deliver high performance and low power technology with highest quality they are used to receiving from Tria in our new compute modules,” said Christian Bauer, Product Marketing Manager, Tria Technologies. “This family of modules is the only one available to offer compatibility with multiple operating systems at a competitive price.”

“With multi-OS support across Tria’s new modules powered by Qualcomm Dragonwing and Snapdragon platforms, customers gain the flexibility of Windows, Android and Linux across our different platforms”, said Douglas Benitez, Senior Director, Business Development, Qualcomm Europe, Inc. “Our collaboration with Tria is accelerating industrial innovation—delivering high performance, low power compute and accelerated AI at the edge.”

Qualcomm Dragonwing processors are known for their performance, efficiency and advanced AI capabilities, offering powerful performance in multi-core tasks and great GPU performance, but also more efficient power consumption in mobile and portable systems.

https://www.Tria-technologies.com

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TDK InvenSense’s ultrasonic ToF range sensor for ultra-long-range applications

Mouser is now stocking the ICU-30201 ultrasonic time-of-flight (ToF) range sensor from TDK InvenSense. The ICU-30201 is a high-performance ToF sensor for ultra-long-range applications, measuring distances from 30 cm to 9.5 m with millimeter accuracy. The sensor enhances contextual awareness and reliability in diverse environments, including smart homes, robotics, and obstacle avoidance.

The TDK InvenSense ICU-30201 ultrasonic ToF range Sensor delivers accurate measurements in any lighting condition, from full sunlight to complete darkness, and can detect optically transparent surfaces such as glass and clear plastics. The ICU-30201 supports multi-object detection with a customisable field-of-view (FOV) up to 180°. The sensor also features a 53 kHz piezoelectric micro machined ultrasonic transducer (PMUT) — a second-generation ultra-low power System-on-Chip (SoC) — and a 40 MHz integrated CPU for on-chip algorithms including range finding, human presence, and wake-on approach.

The ICU-30201 sensor offers a sample rate of 75 samples per second at two meters and 18 samples per second at nine meters. With ultra-low power consumption (22µA to 318µA depending on the number of samples per second), the ICU-30201 helps extend battery life in devices including smart speakers, meeting room devices, and smart door locks. A single bottom port package for receiving and transmitting allows for easy mechanical integration. The ICU-30201 sensor comes in a compact 5.17 × 2.68 × 0.9 mm LGA package and includes an integrated digital signal processor (DSP). The sensor is compatible with standard surface mount device (SMD) reflow and has an operating temperature range of -40°C to +85°C.

https://www.mouser.com

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BeagleBoard Wi-Fi 6 Bluetooth LE wireless modules now at Mouser

Mouser is now shipping the CC33 wireless modules from BeagleBoard. The BM3301 modules are high-performance 2.4GHz Wi-Fi® 6 and Bluetooth Low Energy 5.4 combo wireless modules for industrial IoT, automotive, smart home, consumer electronics, healthcare, and embedded systems applications.

The BeagleBoard CC33 wireless modules, available from Mouser, are powered by TI’s 10th-generation connectivity chip (CC3301), delivering application throughput of up to 50 Mbps and are designed for reliable performance in extreme conditions (-40°C to +85°C), making them ideal for diverse applications requiring robust wireless connectivity. There are two variants to this module: The BeagleMod BM3301-1313 is a 13mm × 13mm BGA module, footprint-compatible with the TI WL18xxMOD series for easy drop-in design upgrades. The BeagleMod BM3301-1216 is a 12mm × 16mm M.2 1216 LGA module that includes an IPEX Gen 4 connector, and a u.FL antenna connector to simplify board layout, with both featuring Wi-Fi 6, Bluetooth LE 5.4, and integrated 2.4 GHz PA for complete wireless solutions with up to +20.5 dBm output power.

Mouser also stocks the BeagleY-AI single-board computer (SBC), a low-cost, open-source, community-supported development platform in a familiar form factor compatible with other popular SBC accessories. It was developed to streamline the process of building smart human-machine interfaces (HMI), incorporating cameras and high-speed connectivity into a reliable embedded system. The BeagleY-AI SBC features a powerful 64-bit, quad-core A53 processor and numerous powerful AI accelerators paired with C7x DSPs capable of 4 TOPS (trillion-operations per second) combined (2 TOPS each), an integrated 50GFLOP GPU supporting up to three concurrent display outputs and modern connectivity with USB 3.1 and PCIe Gen 3. An onboard BeagleMod CC33 module (BM3301- 1313) provides Wi-Fi 6 and BLE 5.4 connectivity.

https://www.mouser.com

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Rutronik offers USB Type-C connectors from Molex for industrial and consumer applications

With USB Type-C connectors from Molex, Rutronik offers future-proof interface solutions for industrial and consumer electronics applications. The connectors support data rates of up to 40 Gbit/s (USB4), currents of up to 5.0 A and power delivery of up to 100 W – ideal for applications with high power requirements and limited space, such as portable medical devices, industrial electronics, AR / VR systems and smart home appliances.

Thanks to their compact design, IPX8-certified variants and high mechanical robustness (up to 10,000 mating cycles), the components are particularly suitable for applications where reliability and continuous operation are key. Various mounting options – including vertical, top and mid-mount versions – offer maximum design flexibility in a small space.

Benefits at a glance:
• USB4-compatible: data transfer rates up to 40 Gbit / s
• Power delivery capable: Up to 100 W charging power (5.0 A / 20 V)
• Metal-reinforced mating area for high mating cycles (up to 10,000 mating cycles)
• Mating force on PCB: 0
• Mating force: 5 to 20 N
• Unmating force: 8 to 20 N (1 to 30 cycles); 6 to 20 N (after 10,000 cycles)
• Sockets with liquid protection according to IPX8, thanks to LSR moulding (liquid silicone rubber) ·
• Variants with 6, 14, 16 or 24 contacts available

Application examples:
• Portable medical devices (e.g. glucose meters, inhalers)
• Smart home and (I)IoT components
• AR/VR end devices and wearables
• Industrial electronics, measuring and testing devices
• Cash register systems and projectors

https://www.rutronik.com/

 

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