21.5-inch Full HD TFT display features high brightness specification

Review Display Systems (RDS) has announced the introduction of a new 21.5-inch TFT display module from industrial display manufacturer, Chefree Technology Corporation. The C23061500501-215H features Full HD resolution (1920 x 1080 pixels), a 16:9 wide aspect ratio, and vertical alignment (VA) mode display technology which ensures excellent optical performance and wide viewing angles.

The 21.5-inch display features vertical alignment (VA) wide viewing technology which enables viewing angles of 89 degrees in all viewing directions (left, right and up, down). The display module features a white LED backlight with integrated driver, and a 30K hour half-brightness lifetime, which enables a specified brightness rating of 1500cd/m² and ensures that the 21.5-inch TFT module produces display images that are bright, clear and colourful.

The dual channel LVDS data interface supports 8-bit RGB colour data which enables a colour palette of up to 16.7M colours. The 21.5-inch display module features mechanical outline dimensions of 495.6mm (l) x 292.2mm (h) x 10.35mm (d) and an active display area of 476.64mm (l) x 268.11mm (h). An extended operating temperature range of -20°C to +85°C is supported.

The 21.5-inch TFT display module is ideal for many varied applications including industrial process control, factory automation, in-vehicle systems, point-of-sale systems, digital signage, and medical equipment.

 

http://www.review-displays.co.uk

> Read More

Renesas delivers new RA8 MCU group targeting graphic display solutions and voice/vision multi-modal AI applications

Renesas has introduced the RA8D1 microcontroller (MCU) group. The RA8D1 group is the second in Renesas’ RA8 Series, the first MCUs based on the Arm Cortex-M85 processor. RA8D1 MCUs deliver breakthrough performance of over 6.39 CoreMark/MHz EEMBC’s CoreMark benchmark measures performance of MCUs and CPUs used in embedded systems. combined with ample memory, graphics and peripheral functions optimised to address diverse graphics display solutions, and Voice/Vision Multimodal AI requirements for a range of applications in building automation, home appliances, smart home, consumer, and medical market segments.

All RA8 Series MCUs take advantage of the high performance of the Arm Cortex-M85 processor and Arm’s Helium technology with a vector/SIMD instruction set extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations over the Cortex-M7 core. This added performance is ideal for graphics and neural network processing and can eliminate the need for a separate hardware accelerator in some applications. They also offer advanced security including Arm TrustZone technology, Renesas Security IP (RSIP-E51A), Secure Boot with first stage bootloader in immutable storage, Octal SPI interface with Decryption-on-the-fly (DOTF), and Pointer Authentication and Branch Target Identification (PACBTI) security extension.

The new RA8D1 devices include a high-resolution graphics LCD controller with parallel RGB and MIPI-DSI interfaces to LCD display panels, a 2D graphics drawing engine, a 16-bit camera interface (CEU), multiple external memory interfaces for storage of frame buffer and graphics assets, and 176 and 224 pin packages. This feature set is combined with professional quality graphics user interface software solutions from SEGGER emWin and Microsoft GUIX fully integrated into the Renesas Flexible Software Package (FSP). Renesas also provides support for open-source Light and Versatile Graphics Library (LVGL) and a robust network of graphics and AI ecosystem partners. A full-featured graphics evaluation kit with LCD panel and camera module rounds out the solution and provides a robust development platform for graphics applications including. industrial HMI, video doorbells, patient monitors, graphics calculators, security panels, printer display panels, and appliance displays.

“There is growing demand for high-quality displays to improve user experiences. The introduction of the RA8D1 MCUs showcases the design capabilities and market knowledge that have made Renesas the world leader in MCUs,” said Daryl Khoo, Vice President of the IoT Platform Division at Renesas. “These new devices take advantage of the unprecedented performance of the Cortex-M85 core and Helium technology to meet our customers increasing requirements for better display solutions and fast-growing vision AI implementations such as people and object detection, face recognition, image classification, and pose estimation.”

“Plumerai licenses highly accurate AI solutions to customers developing smart home cameras and IoT devices,” said Roeland Nusselder, CEO of Plumerai. “We have ported our Plumerai People Detection AI software to the new RA8D1 MCU that includes the powerful Arm Cortex-M85 CPU with Helium vector extensions. The RA8D1 speeds up our software by 6.5x compared to an Arm Cortex-M7 using Arm’s CMSIS-NN kernels. There’s a big demand for our AI solutions in home security, smart buildings, home appliances and retail. Using the RA8 MCUs from Renesas, we can now fulfil this demand.”

The new RA8D1 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

The RA8D1 Group MCUs are available now, along with the FSP software. Renesas is also shipping the RA8D1 Evaluation Kit that includes example projects targeted at graphics applications. Various Renesas Ready ecosystem partners also provide production-ready solutions for the RA8D1 MCUs. Renesas welcomes other partners who would like to port their software solutions to take advantage of the Cortex-M85 core and Helium. Information on all these offerings is available at renesas.com/RA8D1. Samples and kits can be ordered either on the Renesas website or through distributors.

https://renesas.com/MCUs.

> Read More

iWave bases SoM on i.MX 91

Designed for secure and reliable Linux edge processing, the solderable NXP i.MX 91-based LGA system on module (SoM) has been added to the iW-RainboW-G50M family by iWave.

The SoM incorporates the newest member of the i.MX 9 applications processor series and is built on the OSM v1.1 solderable SoM standard. The rugged, compact form factor also offers extensive interfaces, said iWave.

Evaluation kits of the SoM will be ready to purchase this month.

The i.MX 91 SoC combines security, performance and scalability. It can operate as a foundation block for cost-optimised Linux edge devices, said iWave. The i.MX 91 family features an Arm Cortex-A55 running at up to 1.4GHz and an integrated EdgeLock Secure Enclave. There are also dual Gigabit Ethernet, dual USB ports interfaces and essential I/O to fit in products used in smart factory, smart home, medical devices and smart metering.

In addition to the NXP i.MX 91 SoC, the SoM integrates 2Gbyte LPDDR4 RAM, 16Gbyte eMMC flash, two 1Gbit per second Ethernet controllers (one with TSN or time sensitive networking), one 4bit SD, one USB 2.0 OTG, four USB 4.0 host Wi-Fi 6 and Bluetooth 5.3 and IEEE802.15.4 connectivity.

The SoM is in a size-L form factor with dimensions of 45 x 45mm. The solderable LGA package is certified to the OSM v1.1 standard with provision for 662 contact, offering high pin to area ration across the SoM, said iWave. It is part of the company’s 10 years’ product longevity programme.

It is possible to directly solder the SoM onto the carrier card to ensure high levels of robustness for products prone to vibrations, including electric vehicle charging stations, industrial gateways and human machine interface (HMI) displays.

The i.MX 9x family of i.MX 91 and i.MX 93 provides customers scalability with reduced development cost and time to market and provides consumers with efficient power management and advanced security features on the edge, added the company.

The i.MX 91-based system on module is integrated on a carrier board, which is positioned as a single board computer (SBC) and also doubles up as an evaluation kit. The production-ready SBC is built on a Pico-ITX form factor and integrates the necessary interfaces for applications such as smart home hubs, metering gateways, and industrial automation solutions.

The SBC is characterised by the NXP i.MX 91 SoC, 2Gbyte LPDDR4 RAM, 16Gbyte eMMC, Wi-Fi 6, Bluetooth 5.3 and IEEE802.15.4 connectivity. There is also a GNSS receiver module (GPS / GLONASS / Galileo / BeiDou), dual 1000/100/10Mbits per second Ethernet, one USB 2.0 OTG (microAB receptacle connector), a dual USB 2.0 host (TypeA) and one each USB header and USB Type-C connector. There is also a micro SD, 3.5mm audio in and out jack through I2S codec, an M.2 connector Key B, expansion connector (UART, CAN, ADC, Tamper, PWM) and one RS232 header.

The SoM and SBC are production ready, with all documentation, necessary software drivers and board support package available for customers. 

http://www.iwavesystems.com 

> Read More

Integrated, low power, single-chip LCOS panel fits into AR/XR/MR glasses

The OP03011 liquid crystal on silicon (LCoS) panel integrates the array and frame buffer into an ultra-compact single-chip solution that is lightweight and low-power for smart glasses

The OP03011 is a single chip, 648p LCoS panel for next generation augmented reality (AR), extended reality (XR) and mixed reality (MR) glasses and head-mounted displays. The LCOS panel features 3.8 micron pixels in what is claimed to be one of the world’s smallest 0.14-inch optical formats. The low power, lightweight design is intended for next-generation glasses that can be worn 24/7, said Omnivision.

The growing interest in AR glasses has led OEMs to design more functionality into slim, fashionable designs that consume very little power and are lightweight, allowing them to be worn for long periods. The OP03011 is designed in a compact format for applications requiring a smaller field of view and lower resolution, making it well suited for some of the sleekest, most innovatively designed AR glasses, said Devang Patel, marketing director for the IoT and emerging segment, Omnivision. “The OP03011 supports applications of next-generation smart glasses, like displaying notifications in the user’s field of view and access to GPS for maps and directions directly from the glasses, so the user never needs to pull out their smartphone,” he said.

The OP03011 features 648 x 648 resolution at 120Hz and comes in a small FPCA package. It supports a single-lane MIPI-DSI interface. 

Samples are available now, and the OP03011 will be in mass production in Q4 of 2023.

Omnivision is a fabless semiconductor company that develops advanced digital imaging, analogue and touch and display solutions for multiple applications and industries, including mobile phones, security and surveillance, automotive, computing, medical, and emerging applications. 

http://www.ovt.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration