Imec develops 120Gbaud SiGe BiCMOS to advance optical interconnects

To enable a “significant increase” in baud rate combined with at least 80GHz analogue output bandwidth, a scalable SiGe BiCMOS technology developed by Imec, can be produced in volume, “paving the way to cost-effective, high-speed optical transceivers for the Tbit era,” said the research group.

It has been designed for data-intensive applications, such as cloud services, video streaming, high-performance computing and 5G, which place demands on optical communication networks within data centres. The most performant optical links operate at speeds up to 400Gbits per second, using for example four 100Gbit per second channels. Data centre operators believe that Terabit per second optical transceivers will be needed within a few years. At the same time as the increasing demands on data centres’ optical networks, co-packaged paradigms are emerging to help optical switches manage the massive bandwidth density at input. These are also expected to reach 100Terabits per second. In these co-packaged optics, Si photonics transceivers are tightly integrated with the high-speed electronic circuits.

Increasing the capacity of the optical links despite the smaller footprints of transceivers will impact the design of photonic high-speed ICs used in transceivers, said Imec. One solutions is to increase signalling rates beyond 100Gbaud. Such rates may be beyond the capabilities of advanced CMOS nodes (for example FinFETs), leaving greater than 100Gbaud speeds to be handled by InP technologies, where their smaller wafer sizes and reduced capability to integrate more complex functionality makes scaling up these processes challenging. Imec is looking at III-V on CMOS processes, initially with the integration of novel circuit architectures in SiGe BiCMOS to achieve beyond 100Gbaud operation.

Scientists from imec-IDLab have developed a novel transmitter architecture that has key building blocks fabricated in a mainstream SiGe BiCMOS process. Imec’s Peter Ossieur, explained: “The resulting IC decodes four 30Gbaud PAM-4 (or four 60Gbits per second NRZ) streams, and simultaneously multiplexes and equalises these streams into a 120Gbaud PAM-4 signal with more than 80GHz bandwidth, 1.2Vpp voltage swing and 2200mW power consumption. Since the four-level pulse amplitude PAM-4 modulation format involves two bits per symbol (denoted as 00, 01, 10 and 11), this is the equivalent of a 240Gbit per second (single lane) transmitter, he told Electronic Design.

Within the transmitter IC, a multiplexer (MUX) combines multiple low-speed input signals from a CPU or GPU within the data centre, into a single full-rate data stream. This stream is then equalised to compensate for any bandwidth losses in the modulator and the channel. The high-speed equalised signal is then used as an input signal for the driver that subsequently feeds the optical modulator.

Rather than performing equalisation in the digital domain using a DSP, before conversion into an analogue signal, Imec has developed a transmitter IC architecture which implements an analogue signal processing variant of the DSP filter, with the integrated MUX, FFE and driver fabricated in mainstream 55nm SiGe BiCMOS.

“The work shows a doubling of the operating rate compared to FinFET solutions and closely matches the speed and power obtained in InP-based solutions”, reported Peter Ossieur.

“These building blocks will also be crucial for developing novel coherent transceiver concepts, which exploit the phase and polarisation of the optical field to further increase the bit rate,” said Ossieur.

http://www.imec-int.com

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1700V SiC Schottky barrier diodes protect data centres and building automation

Silicon carbide (SiC) diodes from Littelfuse have been increased to include 1,700V models. The LSIC2SD170Bxx series SiC Schottky diodes are available in the TO-247-2L package and with a choice of 10, 25 or 50A current ratings.

The SiC diodes offer power electronics system designers performance advantages, including close-to-zero reverse recovery current, high surge capability, and a maximum operating junction temperature of 175 degrees C, said Littelfuse.

They can be used where enhanced efficiency, reliability, and simplified thermal management are required and the fast and low loss switching makes them suitable for data centres, building automation and other high power electronics applications, said the company.

SiC Schottky barrier diodes are suitable for a wide range of AC/DC and DC/DC power converters used in industry, energy generation, and energy distribution / storage. Typical examples include industrial switch mode power supplies, uninterruptable power supplies, battery chargers, solar inverters, industrial motor drives and high speed rectifiers.

“SiC diodes in power designs instead of diodes based on legacy silicon-based technology . . . enable the design of faster switching power electronics in the converters which can then be made more compact at the same output power or pack more power in the same volume,” said Francois Perraud, product marketing manager, SiC Products at Littelfuse.

The LSIC2SD170Bxx SiC Schottky diodes offer positive temperature co-efficient of the forward voltage for safe operation and ease of paralleling, fast, temperature-independent switching and dramatically reduced switching losses compared to silicon bipolar diodes, summarised Littelfuse.

The LSIC2SD170Bxx SiC Schottky diodes are available in the TO-247-2L package. Sample requests can be placed through authorised Littelfuse distributors worldwide.

http://www.Littelfuse.com

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AcceleRate arrays support PICMG COM-HPC interconnect data rates

Artificial intelligence (AI) accelerators, ASIC emulators and next-gen edge computing benefit from the PICMG COM-HPC Interconnect, says Samtec, at the release of its AcceleRate HP high performance arrays. AcceleRate HP supports 112Gbits per second PAM4 extreme performance in a micro footprint.

Samtec’s AcceleRate HP high performance arrays feature an open pin field array which maximises grounding and routing flexibility. System architects can route high performance differential pairs, single ended signals and high current voltage rails via the same interconnect.

The 2.2, 2.4 and 2.2mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and with more ground vias around the differential signals.

The arrays include dense 0.635mm pitch, a low profile 5.0 and up to 10mm stack heights. Up to 400 pins are available. Samtec has also published a roadmap to develop arrays with 1,000 or more pins.

The AcceleRate HP high performance arrays are data rate compatible with PCIe 5.0 and 100 GbE. The array has a BGA termination for easy assembly and self-alignment.

Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high speed board-to-board, high speed cables, mid-board and panel optics, precision RF, flexible stacking and micro / rugged components and cables.

http://www.samtec.com

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Hands-free ECU detection assists autonomous driving

To support autonomous driving systems by distinguishing between variations in a driver’s grip on the steering wheel, an electronic control unit (ECU) developed by Alps Alpine will contribute to safe, comfortable mobility, says the company.

In the field of autonomous driving, there is growing deployment of systems that enable a vehicle, under certain conditions, to automatically follow the car in front while keeping to the lane, reports Alps Alpine.

Such vehicles need to be able to detect and assess a driver’s driving status to allow safe and smooth switching between automated and manual driving. One aspect is to determine the driver’s grip on the steering wheel to enable safe switching between driver-controlled and system-controlled modes. Determining the right time to switch between autonomous driving assistance and manual driving requires constant monitoring of the vehicle’s drive status and the driver’s driving posture to ensure safety. If autonomous driving assistance is not appropriate, the driver needs to be quickly warned that the assistance is to be disengaged and will need to immediately revert to manual driving.

Capacitive sensing is the dominant technology used for steering wheel touch detection due to its cost and functional performance. The ECU uses data obtained via a special-purpose capacitive sensor, wrapped around the steering wheel, to determine if the driver is touching it and conveys the assessment to an advanced driver assistance system (ADAS). Existing hands-off detection systems are mono-zone set ups, with a single electrode, Alps Alpine has developed a multi-zone configuration with four electrodes. Dividing the steering wheel and grip patterns into smaller sections enables efficient system switching and enhanced touch assessment reliability, says the company. This allows a more detailed assessment of driving status than a basic touching/not touching determination reached using an existing single-electrode sensor, Alps explains.

The ECU has been designed for use with a special-purpose steering wheel capacitive sensor to maintain resistance to environmental factors such as temperature, humidity and electromagnetic noise.

Alps Alpine has also developed an original capacitive control ASIC with improved durability and versatility for conformance to strict automotive standards.

Varying conditions may lead to a variance in the data obtained via the capacitive sensor. To accommodate the separate circumstances, Alps Alpine can supply an originally developed algorithm to accommodate the parameter changes.

Reliability is enhanced by an original failure determination feature and the ECU sensor conforms to ISO 26262, the international standard on the functional safety of electrical and electronic systems in automobiles.

Alps Alpine will also put forward product proposals, representing examples of applied capacitive technology, for a wide range of human-machine interfaces (HMI) both inside and outside the vehicle cabin, not just hands-off detection.

The ECU is in mass production. It measures 40 x 45 x 12mm and uses a LIN 2.1 or LIN 2.2 interface. It operates at 8.0 to 16V and up to 100mA.

http://www.alpsalpine.com

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