Components & Connectors Archives - Page 41 of 80

RF mmWave connector is for 5G applications up to 25GHz

Thu, Sep 30, 2021

Greater design freedom is offered with the Flex-to-board RF mmWave connector 5G25 series, says Molex. The compact connector is for demanding 5G mmWave applications up to 25GHz and is robust enough for RF antenna modules, says the company.

The micro connector enables manufacturers of mobile devices and RF antenna modules to optimise high speed 5G components while alleviating space constraints on small, crowded PCBs, says Molex.

“Each new generation of RF antenna modules and smartphones brings us closer to realizing the full potential of 5G performance,” says Stephen Drinan, director of core products, micro solutions, Molex. He says the company has applied decades of experience in RF and antenna design, high-speed connectivity and volume manufacturing to support 5G’s higher frequencies “while raising the bar in signal stability, robust performance and fast assembly”.

In Molex’s recent The Future of Mobile Devices global survey, respondents ranked ultra-fast 5G (e.g., mmWave) as the leading technology to drive disruption in smart, consumer mobile device manufacturing.

The Molex Flex-to-Board RF Connector 5G25 series supports high speed data transmission in a space-saving format that offers extra protection from harsh environmental conditions. Signal pitch is 0.35mm and the mated body height is 0.6mm while the body is 2.5mm wide and 3.6mm; dimensions which printed wiring board (PWB) design flexibility, according to Moles. The 5G25 enables designers of RF antenna modules and mobile devices to combine RF and non-RF signals, which reduces the need for additional connectors to contribute additional space and cost savings.

The 5G25 features full EMI shielding, encompassing both RF terminal and full connector shielding for signal integrity performance. A centre shield-in contact with receptacle and plug allows each row to be isolated to boost overall signal integrity stability. Molex’s fully-shielded design is claimed delivers best-in-class far-field gain performance for connecting 5G antennas to the rest of the transceiver.

The Molex Flex-to-Board RF Connector 5G25 series is designed for fast, trouble-free assembly. The compact connectors have robust peel force to increase reliability and minimise the load on assembly operators or automatic assembly machines.

http://www.molex.com

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MEMS barometric pressure sensors are slim and compact

Tue, Sep 28, 2021

Able to measure a height difference as small as 50mm, the ICP-20100 low noise MEMS barometric pressure sensors have a compact footprint for use in smartphones, tablets, drones, augmented reality / virtual reality (AR / VR) equipment and smart home appliances.

The InvenSense ICP-20100 sensors combine a barometric pressure and a temperature sensor in a 2.0 x 2.0 x 0.8mm package. The low noise pressure sensing capabilities, with a range of 30 to 110 kPa, allows the device to detect altitude changes of less than 50mm.

The performance extends InvenSense’s SmartPressure family and offers multiple input voltage levels of 1.2V, 1.8V and 3.3V. There is also a choice of interfaces, namely I²C, I3CSM and SPI. The ICP-20100 can be configured to achieve low noise or low power performance.

The SmartPressure family uses a capacitive MEMS architecture to deliver lower power consumption and lower noise than competing pressure sensors technologies, explains InvenSense. In addition to operation over a wide temperature range, the ICP-20100 pressure sensor can deliver the measurement accuracies required by applications such as 3D geolocation and emergency location service (E911), mobile indoor / outdoor navigation, sport and fitness activity tracking and altitude-hold in drones. The sensor’s low power consumption assists in extending battery life for always-on applications, for example in the IoT. The pressure sensor temperature co-efficient offset is ±0.5 Pa/ degrees C.

A development kit, the DK-20100, and evaluation platform with software are also available.

The ICP-20100 joins the existing ICP-10125, ICP-10101, and ICP-10111 pressure sensors in the SmartPressure family.

Target applications in addition to smartphones and tablets are sports, and fitness activity monitoring devices, altitude control for drones and aerial toys, gaming equipment, including virtual reality. The ICP-20100 can also be used for indoor / outdoor navigation, for example in detecting, floors in a lift or steps. In smart home appliances, they can be used in robotic vacuum cleaners and other equipment which needs sensing capabilities.

TDK was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. The company’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices. There are also sensors and sensor systems such as temperature and pressure, magnetic, and MEMS sensors, power supplies and energy devices.

Products are marketed under the product brands TDK, Epcos, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America.

https://invensense.tdk.com

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Skyworks releases switches for automotive and comms

Thu, Sep 23, 2021

Automotive switches and low-noise amplifier front-end modules from Skyworks are designed for automotive, cellular compensator and cellular telematics applications.

The company has released four devices, the SKYA21038, SKYA21039, SKYA210140 and SKYA21041.

The SKYA21038 is a single pole, double throw (SPDT) switch intended for mode switching in WLAN applications. Switching technologies enable the SKYA21038 to maintain a low insertion loss and high isolation for all switching paths, says Skyworks. The high-linearity performance and low insertion loss mean that the switch is suitable for low power transmit / receive applications.

The switch is manufactured in a compact, 1.0 x 1.0 x 0.5mm, six-pin exposed pad plastic micro leadframe package dual (MLPD) package.

The SKYA21039 is a single pole, triple throw (SP3T) antenna switch that operates in the 2.4 to 2.5GHz frequency range. Switching between the antenna (RFC signal) and the RF1, RF2, and RF3 ports is accomplished with two control voltages (V1 and V2). Characteristics of low loss, high isolation, high linearity, small size, and low cost make the switch suitable for all WLAN and Bluetooth systems operating in the 2.4 to 2.5GHz band. The SKYA21039 is manufactured in a compact, 1.1 x 1.1 x 0.5mm, eight-pin Micro Leadframe (MLP) package.

The SKYA21040 integrates a single pole, triple throw (SP3T) switch and low noise amplifier (LNA) with a bypass mode in a compact package. The device is capable of switching between WLAN receive, WLAN transmit, and Bluetooth and is provided in a small dual flat no-lead (DFN) eight-pin, 1.5 x 1.5mm package.

The fourth switch is the SKYA21041 which integrates a single pole, double throw (SPDT) switch and low noise amplifier (LNA) with a bypass mode in a six-pin, 1.2 x 1.4mm DFN package. It is capable of switching between WLAN receive and WLAN transmit.

[Picture credit: Metamorworks]

http://www.skyworksinc.com

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Single axis MEMS capacitive accelerometers measure on three axes

Fri, Sep 10, 2021

Low noise, low cost MEMS capacitive accelerometer modules from Silicon Designs offer measurements on up to three orthogonal axes.

The Model 2210 series modules offer repeatable measurements across a variety of lower frequency vibration testing applications, including those common to vibration analysis, machinery control, modal analysis, robotics, and crash event detection, said Silicon Designs.

The modules are offered in standard ranges from ±2g to ±400g and incorporate a MEMS capacitive accelerometer chip together with high drive, low impedance buffering. They can be used in a Silicon Designs-recommended mounting block accessory, such as the Model 2330-BLK, to measure vibration and acceleration on either one, two, or three orthogonal axes with equal accuracy and repeatability. This degree of versatility in measurement allows customers to specify just one part number for multiple measurement requirements, reducing in-house costs and inventory counts.

All Silicon Designs’ Model 2210 series MEMS capacitive accelerometer modules generate two analogue voltage outputs which vary in response to applied acceleration. Customers can utilise either a single-ended or differential output. Using the latter doubles accelerometer sensitivity. The sensitive axis of the Model 2210 module is perpendicular to the package bottom, with positive acceleration defined as a force pushing on the bottom of that package. Output scale factor is independent from the supply voltage of +8.0 to +32V. At zero acceleration, differential output voltage is nominally 0V DC. At full scale, differential output is ±4V DC.

A simple, but robust, four-wire connection and internal voltage regulator minimise supply voltage variation effects. The MEMS capacitive sense element of each Model 2210 series accelerometer module is packaged within a lightweight, epoxy sealed and anodized aluminium housing which occupies a total footprint of one square inch (25mm), said Silicon Designs.

All Model 2210 series MEMS capacitive accelerometer modules are relatively insensitive to temperature changes and can self-calibrate.

Modules are designed, developed and manufactured at the company’s headquarters and ISO9001:2015 certified R&D centre, just outside of Seattle, Washington, USA. Each accelerometer also undergoes rigorous quality testing prior to shipment.

http://www.SiliconDesigns.com

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RF mmWave connector is for 5G applications up to 25GHz

MEMS barometric pressure sensors are slim and compact

Skyworks releases switches for automotive and comms

Single axis MEMS capacitive accelerometers measure on three axes

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