Multi-mode cellular and satellite IoT module has embedded positioning 

Developed to ensure seamless connectivity even when no terrestrial cellular network is available, the u-blox SARA-S520M10L is the company’s cellular and satellite IoT module with accurate, low power positioning and “ubiquitous connectivity” said u-blox. 

The module’s communication and tracking capability makes it suitable for asset tracking, fleet management, maritime transportation, mining, utilities and smart agriculture applications. It also serves market segments such as anti-theft systems, industrial monitoring and control, and applications that require communication in safety-critical scenarios, advised u-blox. 

At approximately 400mm2, the u-blox SARA-S520M10L is claimed to be the smallest multi-mode cellular and satellite IoT module on the market. It provides LTE-M/NB-IoT, L-band satellite connectivity, and embedded navigation capability for connectivity through terrestrial cellular networks and geostationary (GEO) satellites. It can provide location fixes using up to four satellite constellations and is pin-compatible with other u-blox cellular-only modules in the SARA form factor.  

This is the first u-blox module designed with the 2nd generation of the u-blox UBX-R5 chip, the UBX-R52/S52. The S52 variant was developed to support satellite IoT communication alongside LTE-M/NB-IoT cellular standards. 

“Comparable solutions on the market require two distinct subsystems, one for cellular and another for satellite connectivity,” said Alessandro Bonetti, senior product manager, product centre cellular at u-blox. Building the module around a single, highly integrated, multi-mode modem SoC reduces size and complexity, Bonetti added. He said the versatile SoC, combined with the company’s GNSS capability serves mobile and stationary IoT applications in “challenging environments such as isolated places, mountains, or in the middle of the ocean”. 

The first samples will be available by Q1 2024.

u-blox specialises in positioning and wireless communication in automotive, industrial and consumer markets. The company’s services, and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules, and secure data services and connectivity to develop solutions for the IoT quickly and cost-effectively. With headquarters in Thalwil, Switzerland, the company has offices in Europe, Asia, and the USA. 

http://www.u-blox.com

> Read More

MRigidCSP package is claimed to increase MOSFET’s mechanical strength  

Robust package technology, MRigidCSP, by Alpha and Omega Semiconductor (AOS), is initially offered on its AOCR33105E, 12V, common drain, dual N-channel MOSFET. The packaging technology is designed to decrease on resistance while increasing mechanical strength, and is particularly suited to battery applications in smartphones, tablets and ultra-thin notebooks.
AOS explained that fast charging, which requires lower power loss in the battery management circuit, is now widely adopted for portable devices. As the charging currents increase, ultra-low electrical resistance is needed for improved performance. In standard wafer-level chip scale packages (WL-CSPs), the substrate can be a significant portion of the total resistance when back-to-back MOSFETs are employed in battery management applications.  A thinner substrate reduces the overall resistance but drastically reduces the package’s mechanical strength. This reduction of mechanical strength can lead to more stress during the PCB assembly reflow process, potentially causing warping or cracking in the die and, ultimately, failure in the application. The AOCR33105E is designed with trench-power MOSFET technology in a common drain configuration for design simplicity. It features low on resistance with ESD protection to improve performance and safety in battery management, such as protection switches and mobile battery charging and discharging circuits.
“Incorporating the AOS MRigidCSP packaging technology with our new dual N-channel MOSFET combines electrical performance improvements with the benefit of high robustness,” said Peter H. Wilson, senior MOSFET product line marketing director at AOS.
AOS designed the MRigidCSP package technology to be used with high aspect ratio CSP die sizes. The CSP construction delivers “a significantly strengthened battery MOSFET that won’t warp or break during the board manufacturing process,” added Wilson.
The AOCR33105E is available in a 2.08 x 1.45mm package, with RDS(on) of 3mOhm at 4.5V / 4.2mOhm at 3.1V.
The AOCR33105E in the MRigidCSP package is immediately available in production quantities with a lead time of 14 to 16 weeks. It is RoHS 2.0 compliant and is halogen-free.

http://www.aosmd.com

> Read More

Headset increases productivity with hands-free operation

The next generation of RealWear’s hands-free, wearable computers for frontline workers is the Navigator Z1 Intrinsically Safe (IS) headset, which accesses AI and 5G connectivity.

Built for productivity and safety in industries such as oil and gas, pharmaceuticals, and mining, the hands-free IS wearable solution frees a worker’s hands to make operations smarter, safer, and more efficient.

The Navigator Z1 is certified for use in areas where nearly all electronics are strictly prohibited due to the potential risk of explosion or combustion. It can be used on sites including oil and gas production areas, for rig inspections at sea or for repair in mission-critical production equipment in processing mills, chemical facilities, and mines.

It is “the smartest and lightest IS wearable with integrated battery available to frontline workers who work in some of the most challenging sites on earth,” said Dr. Chris Parkinson, co-founder and CEO of RealWear.  “We’re especially keen to introduce AI Core and 5G IS connectivity to create a new frontier of smart, connected wearable solutions for frontline workers,” he added.

Technical improvements in this version of the headset includes the introduction of RealWear’s new AI Core, especially designed for on-device enhanced AI experiences. The headset is also lighter than earlier models but retains the ruggedness and durability levels, said RealWear. There is also improved screen visibility with an HD 720p display and a high resolution front-facing camera (48 Mpixel) for better remote collaboration and low-light image capture for inspections and auditing.

The headset has a wide temperature range for use in more climates and environments, enhanced noise cancellation for improved voice-responsiveness and accuracy and improved connectivity with faster Wi-Fi 6 and an optional 5G IS solution for private and secure enterprise connectivity.

There is also a thermal camera module to spot invisible issues before they become critical and a removable integrated snag-free battery for enhanced safety and for extended use. The headset operates with Enterprise Secure Android 12.

RealWear Navigator Z1 capabilities include purpose-built software for remote expert guidance and training. Remote experts can conduct in-the-moment maintenance and repair, potentially reducing costly travel and downtime via apps like Microsoft Teams and Zoom.

Using just simple voice commands, workers can connect to FSM (field service management) enterprise AI systems to handle work orders safely and quickly, and conduct asset maintenance at reduced operational costs.

Inspectors can inspect a job site, take high quality photos and dictate notes using the field data collection component of an inspection data management system (IDMS) such as hands-free solutions from RealWear and HUVR. Captured data is instantly uploaded and geocoded for integrity verification, auditing and compliance purposes.

Device administrators can access RealWear’s enterprise-grade RealWear Cloud web portal to add approved apps to the headset, adjust a variety of settings, and even remotely connect to the headset to offer remote device troubleshooting.

To take full advantage of the powerful Qualcomm 6490 chipset, RealWear has begun to offer early access of the new headset to its global developer community.  

“We’re thrilled that RealWear is utilising the Qualcomm 6490 platform in RealWear Navigator Z1 that will help frontline workers in extremely hazardous zones where rugged equipment and safety is essential,” said Jeff Henckels, director of XR Product Management, Qualcomm Technologies. “The Qualcomm 6490 is a perfect fit for RealWear’s next generation headsets as it enables powerful connections and reduced latency, an advanced ISP and advanced Edge-AI computing to deliver astonishing performance at lower power.”

The headset will launch with certifications for ATEX Zone 1, CSA C1/D1 and IECEx.

http://www.realwear.com

> Read More

Omnivision and iCatch ring the changes with edge AI video doorbell

Enhancing video doorbell technology, Omnivision and iCatch Technology have partnered to introduce a colour pre-roll feature into home security cameras. The partners have integrated Omnivision’s OA07600 low power, always-on video co-processor with a pre-roll recording buffer and iCatch Technology’s Vi57 AI imaging SoC to introduced colour pre-roll capability to wireless home security products. This features enables users to save up to four seconds of video footage prior to the camera’s motion detector triggering.

David Ho, technical director of product management at Omnivision said: “The OA07600 is the industry’s first ultra-low power, always-on video co-processor with pre-roll”. He said the co-processor’s low power design “makes it possible for the first time to bring high-quality pre-roll video into battery-powered systems”. 

Continuous storage of pre-event colour video footage in the integrated chipset bring “exceptional traceability and visibility” during any trigger event, said Omnivision.

iCatch Technology’s Vi57 imaging SoC has fast capture and edge AI capability to improve the general usability of video doorbells. Taking the pre-roll footage from Omnivision’s OA07600 co-processor, the Vi57 SoC can seamlessly combine it with post-event footage into one video with minimal data loss. The image processing capability means that the SoC is capable of providing high quality video in full colour, even under extreme low light conditions, said the company. The introduction of colour information can be used to provide users with a better understanding and enhanced traceability of the incident.

Weber Hsu, CEO of iCatch technology said that the collaboration means the partners are “closing the gap of the user experience between wired and wireless home security cameras, offering both ease of installation and incident traceability at the same time”.

The colour pre-roll video doorbell solution jointly developed by iCatch Technology and Omnivision is in mass production now and available for customer engagement. 

http://www.ovt.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration