Farnell allies with Würth Elektronik in home appliances campaign

Farnell has joined forces with Würth Elektronik to help design engineers further improve the connectivity and advanced feature sets of ordinary home appliances, without losing sight of the fundamental expectations for reliability, quiet operation and efficiency.

The “Home Appliances meet WE Components” campaign championed by Farnell has introduced a range of meticulously crafted products tailored for design engineers’ needs. Everything from switches and film caps to fast connectors, wireless solutions, sensors, common mode chokes, and snap ferrites have been optimised for every facet of modern appliance design.

Farnell Product Segment Leader for Würth Elektronik, Josh Ahern, said, “We rely on home appliances to keep our lives running smoothly. So much so that we often take them for granted, when in fact brewing our morning coffee and keeping our refrigerators chilled perform vital roles in our lives. However, as they become ever-more sophisticated, it is imperative that the components used to ensure their reliability as well as their expanding feature sets are developed with equally top-quality components. That’s why we are delighted to support WE’s campaign to inform and engage with the developers who are migrating our reliable household electronics to the next generation of usability and longevity.”

Simon Baumann, Coordinator international Engineering, White Goods at Würth Elektronik, concurs, “Most home appliances today contain a large number of electronic circuits. For example, motor control components, heating and cooling elements or user interfaces all have to work efficiently, reliably and be EMC compliant”.

As home appliances get smarter, they still need to be dependable, quiet and affordable to run. That means that developers have a lot more to consider when they are working on new appliance designs, and features that not only offer more benefits, but remain in compliance with regulatory requirements. The partnership between Farnell and WE facilitates the transition to exciting new home appliance designs and features.

https://www.farnell.com

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New EnOcean bluetooth module with doubled radio transmission power

With the new EnOcean PTM 216B module, customers can now address even more applications thanks to the use of the latest generation kinetic harvester ECO 260. The combination of the new harvester with the latest generation system design, allows for more than double the radio transmission power compared to its highly successful predecessor, the PTM 215B. This significantly increases the usable communication distance. This enhancement enables control of high-bay lighting, expanding the application areas to include warehouses and architectural projects with high ceilings. PTM 216B brings great flexibility in terms of installation locations and repositioning capabilities. In modern offices with adaptable layouts and flexible walls, the elimination of wiring significantly streamlines the installation process.

EnOcean devices such as PTM 216B can be quickly configured using Near Field Communication (NFC) technology. NFC is a short-range wireless technology that enables communication between devices in close proximity, typically within a few centimetres. It allows two devices equipped with NFC capabilities to establish a connection by bringing them close together, triggering the exchange of data. A common use is for making contactless payments.

The integration of EnOcean devices into networks via NFC provides a simple, quick and reliable way of setting up lighting installations.

Energy-harvesting switches based on the PTM 216B and other EnOcean switch modules are available in a wide range of designs from multiple switch manufacturers around the world, all of which blend well into any environment. The unique combination of these features makes PTM 216B an ideal for lighting control and building automation use cases. Official switch OEM partners make use of the “Battery-free by EnOcean” brand to make sure it contains genuine technology from EnOcean for real maintenance-free operation in the field.

This new module will be featured at the EnOcean booth at Light + Building in Frankfurt from March 3-8, 2024. At the show, EnOcean will focus on sustainable IoT for green and healthy buildings. New energy harvesting products as well as IoT solutions and smart servers that help analyse the collected data and make informed decisions to optimise building performance will be at the heart of the EnOcean show presence.

https://www.enocean.com

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New MOSFET relays from Omron extend capacity and operating temperature

Omron has further expanded its MOSFET relay line-up to offer higher operating temperature and enhanced capacity in a high-current six-pin DIP format. Omron’s new G3VM-63BR and G3VM-63ER extend the company’s 60V DIP6 MOSFET relay range up to 0.7A continuous load current, whilst providing high operating temperatures to 110degC.

Operating from -40 to 110 deg C, the company’s latest MOSFET relays contribute to much smaller and denser equipment than equivalent mechanical devices. Power consumption on the input is exceptionally low compared to all electromechanical relays, but especially reed relays, further contributing to energy-saving equipment.

Maximum resistance with output on is typically 0.3Ω (0.1Ω. with connection C), whilst typical capacitance between output terminals is specified as 520pF. Their maximum trigger LED forward current is 2mA, whilst turn ON time and OFF times are 2ms and 3ms respectively.

For factory automation applications, the new models have NC contacts allowing status output to linked devices including power off status. The new relays can also be used alongside the no contact type, enabling switching control of multiple loads with just one input control. The beneficiaries in factory automation include PLCs machine tools, inverters, robot controllers, temperature control together with fire, gas or smoke alarm systems. Further uses for the G3VM-63ER extend to sensor signal transfer and output signal switching – for example with gas detection and similar alarm applications.

The new relays are available now as stick packaging:50 pcs, or tape: 500 pcs packaging (only for SMT type) with a lineup that includes PCB and surface-mount terminals.

https://components.omron.com/eu-en

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SemiQ unveils high-performance QSiC power modules in half-bridge packages

SemiQ has expanded its QSiC power modules portfolio with the introduction of a new series of 1200V silicon-carbide (SiC) power MOSFETs in half-bridge packages.

Engineered and tested to operate reliably in demanding environments, these new compact, high-performance modules enable high-power-density implementations while minimising dynamic and static losses. Featuring high breakdown voltage (>1400V), the new QSiC modules support high-temperature operation (Tj = 175°C) with low Rds(On) shift over the full temperature range. In addition, the modules exhibit industry-leading gate oxide stability and long gate oxide lifetime, avalanche unclamped inductive switching (UIS) ruggedness and long short-circuit withstand time.

With a solid foundation of high-performance ceramics, the new SiC modules are suitable for EV charging, on-board chargers (OBCs), DC-DC converters, E-compressors, fuel cell converters, medical power supplies, photovoltaic inverters, energy storage systems, solar and wind energy systems, data centre power supplies, UPS/PFC circuits, Vienna rectifiers, and other automotive and industrial applications.

To ensure that each module has a stable gate threshold voltage and high-quality gate oxide, SemiQ’s modules undergo gate burn-in testing at the wafer level. Besides the burn-in test, which helps to stabilise the extrinsic failure rate, stress tests such as gate stress, high-temperature reverse bias (HTRB) drain stress, and high humidity, high voltage, high temperature (H3TRB) allow achieving the required automotive and industrial grade quality levels. The devices also have extended short-circuit ratings. All modules have undergone testing exceeding 1350V.

https://semiq.com/

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