Innodisk unveils camera module and adapter board for Edge AI vision

Innodisk has announced its latest GMSL2TM camera module and adapter board series, designed to deliver long-distance, low-latency, and robust image transmission for demanding edge AI applications. Built for streamlined integration, the solution enables precise real-time analysis across mobility, robotics, and industrial surveillance applications.

The Innodisk GMSL2TM series supports cable lengths up to 15 meters with FAKRA cable, delivering up to 13MP high-resolution imaging. Powered by the Sony ISX031 sensor, featuring integrated ISP with High Dynamic Range (HDR) and LED Flicker Mitigation (LFM), the module captures clear, stable images in challenging lighting conditions from bright sunlight to dark tunnels, and removes visual artefacts caused by pulsed LED lighting. It ensures precise brightness control and consistent imaging performance.

With IP67/IP69K ruggedised housing, the GMSL2TM camera withstands high-pressure washing, dust, water, and vibration, which is ideal for mines, ports, construction vehicles, logistics facilities, and outdoor robotic systems.

To accelerate time-to-market and reduce integration complexity, Innodisk provides customisable adapter boards optimised for the NVIDIA Jetson Orin platform. This approach enables rapid development and validation for system integrators. The solution supports multi-camera, synchronised streaming. Customers can quickly implement multi-view AI perception and sensor fusion capabilities. This enhances AI accuracy and autonomous decision-making in real-world applications.

Innodisk, together with its subsidiary Aetina, offers edge AI heterogeneous platform solutions with comprehensive visual sensing capabilities, and also collaborates with partners including Advantech, ASUS, and ASRock Industrial to deploy GMSL2TM camera modules across multiple platforms, reaching a wider range of vertical markets.

www.innodisk.com

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Rutronik introduces the TMF8829 Time-of-Flight sensors from ams OSRAM

With the TMF8829 from ams OSRAM, Rutronik expands its portfolio with a powerful dToF sensor that sets new standards with a measurement range of up to 11 meters and a wide 80° diagonal field of view (4:3). The compact optical module combines an integrated VCSEL emitter, SPAD array, and on-chip signal processing to deliver performance for modern 3D sensing applications such robotics, depth mapping, or smartphones LDAF (Laser Autofocus).

The TMF8829 supports multiple resolution modes – 8×8, 16×16, 32×32, and 48×32 – enabling flexible and high-accuracy environmental sensing. A combination of SPAD optics and a multi-lens array widens the Field of Illumination (FoI) for reliable coverage of larger scenes. Robust histogram and peak detection processing ensures accurate measurements even with contaminated or partially obstructed covers. The sensor can detect multiple objects along a single line of sight and provides distance values with a fine resolution of 0.25 mm.

For maximum system compatibility, the optical module features an I²C interface and for high-speed data output I3C and SPI interfaces are provided. Raw data including all algorithmic results and histograms can be streamed to the host system, making the sensor ideal for AI-supported processing. With flexible I/O supply options (1.2 V / 1.8 V / 3.0 V), the TMF8829 can be easily integrated into various platform architectures. The sensor operates reliably across a temperature range from –40 °C to +85 °C.

Key benefits at a glance:
Measurement range up to 11 m
Multiple depth resolutions: 8×8 / 16×16 / 32×32 / 48×32
80° diagonal field of view (4:3)
Integrated VCSEL light source
Distance resolution: 0.25 mm
Multi-object detection along the line of sight
Communication interfaces: I3C (I²C-compatible) and SPI
Module size: 5.7 mm × 2.9 mm × 1.5 mm
Operating temperature: −40 °C to +85 °C

Application examples:
Robotics: Obstacle detection, mapping, cliff detection
People counting
Advanced gesture recognition
SLAM (Simultaneous Localization and Mapping)
LDAF – Laser autofocus for smartphones
Bokeh effects in camera systems

www.rutronik24.com

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New low-power flow sensing module from ScioSense enables multi-year battery life

ScioSense has launched its latest ultrasonic flow module, which offers the very low power consumption required in battery-powered applications for flow rate measurement and leak detection.

Like its predecessor, the UFM-01, the new UFM-02 is a complete, fully calibrated flow measurement unit including a spool piece with standard pipe fittings, twin ultrasonic transducers, and a high-precision measurement circuit based on a ScioSense ultrasonic flow converter chip. In the UFM-02, average operating current has been reduced to 50µA, low enough to enable applications to run for years on a standard primary battery.

The module is ideal for many applications for flow measurement and leak detection, including food-grade equipment. It can be used in water purifiers, water dispensers, water boilers, heat pumps, coffee machines, smart toilets, smart faucets (taps), irrigation systems and agricultural equipment, and in swimming pools, spas and cooling systems. In industrial and commercial systems, the UFM-02 can be used to measure the total volume flowing through a filter, to enable replacement based on actual usage rather than at specified intervals of time.

The UFM-02 module is available at launch with a thread size of 0.5” and an inner diameter (ID) of 13.3mm, or with a thread of 1” (23.7mm ID). Additional variants will be added with a thread of 3/8” (11.2 mm ID) and 1.5” (36.3mm ID). The smallest thread size handles a maximum flow rate of 20l per minute, and the largest, up to 450l per minute.

The ultrasonic measurement technology in the UFM-02 contains no turbines or other moving parts. This offers two valuable advantages:
• Reliability and long operating lifetime, with no risk of mechanical failure.
• High sensitivity to weak flows, allowing the sensor to accurately detect leakage. In its smallest, 3/8” thread size, the UFM-02 can measure flows as slow as 0.03l per minute.

The UFM-02 modules are available with a choice of two cable connections:
• A four-wire pulse interface cable providing a simple output signal with up to 450 pulses per liter.
• A 10-wire SPI cable which provides digital data including total volume of liquid flow in cubic meters, filtered flow rate in liters/hour, and a measurement of the liquid’s temperature.

Andreas Blocherer, Senior Product Manager at ScioSense, said: ‘The introduction of a truly low-power implementation of ultrasonic flow sensing makes this fantastic technology accessible to a new range of applications. The UFM-02 can be operated on battery power without an external cable connection, which means that flow sensing or leak detection can be implemented anywhere. This enables equipment makers to easily add intelligence about liquid usage to make the system more efficient, reliable or cost-effective.’

sciosense.com

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Rohm launches diode combining low VF and IR for advanced image sensor protection

Rohm has developed an innovative Schottky barrier diode that overcomes the traditional VF/IR trade-off. This way, it delivers high reliability protection for a wide range of high-resolution image sensor applications, including ADAS cameras.

Modern ADAS cameras and similar systems require higher pixel counts to meet the demand for greater precision. This has created a growing concern – the risk of damage caused by photovoltaic voltage generated under light exposure during power OFF. While low-VF SBDs are effective countermeasures, low IR is also essential during operation to prevent thermal runaway. However, simultaneously achieving both low VF and IR has been a longstanding technical challenge. Rohm has developing an SBD that combines low VF with low IR which is ideal for protection applications.

By adopting a proprietary architecture, Rohm has achieved low IR that is typically difficult to realize with low VF designs. As a result the device meets market requirements by delivering VF of less than 300mV (at IF=7.5mA even at Ta=-40°C), and an IR of less than 20mA (at VR=3V even at Ta=125°C). These characteristics not only prevent circuit damage caused by high photovoltaic voltage generated when powered OFF, but also reduce the risk of thermal runaway and malfunction during operation.

The diode is housed in a compact flat-lead SOD-323HE package (2.5mm × 1.4mm) that offers both space efficiency and mountability. This enables support for space-constrained applications such as automotive cameras, industrial equipment, and security systems. The RBE01VYM6AFH is also AEC-Q101 qualified, ensuring suitability as a protection device for next-generation automotive electronics requiring high reliability and long-term stability.

www.rohm.com

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