Smart sensors tackle transportation of the future

RoboSense has partnered with Horizon Robotics, Cainao Network, Sensible 4 and AutoX to introduce the Smart Sensor System designed for autonomous passenger cars, low-speed autonomous vehicles, high-speed robot taxis, and vehicle to road (V2R) infrastructure. The RoboSense Smart Sensor System combines lidar hardware, artificial intelligence (AI) point cloud algorithms, and an IC design for a smart sensor system that collects and interprets environment information.

At the Shanghai Auto Show, RoboSense announced the RS-Bpearl, a super wide angle blind-spot lidar and the RS-Ruby, a super high-resolution lidar for the sensor system.

The smart sensor system combines the RoboSense RS-Lidar-M1 MEMS -based smart sensor with the RS-Bpearl super wide angle blind-spot lidar, RS-Ruby super high-resolution lidar and RoboSense AI perception algorithms. RoboSense chose MEMS technology because of its high integration levels, high performance, high reliability, easy production, and low cost. It uses 905nm lasers for its solid state lidar system. RoboSense’s RS-Lidar-M1Pre debuted at CES 2018, and the upgraded RS-LiDAR-M1 introduced a wide, 120 degrees, field of view (FoV), a long range of 200m and AI algorithm innovations. The RS-lidar-M1 now meets OEM requirements and delivers safety for L3+ autonomous passenger cars.

Scheduled for mass production in 2021, the RoboSense RS-Lidar-M1 for OEMs will be a smart sensor. RoboSense and Horizon Robotics will build customised chips for the lidar environment perception algorithm, called RS-Lidar-Algorithms. These algorithms will be integrated into the IC and embedded in the lidar hardware. The RS-Lidar-M1 will provide instantaneous 3D point cloud data interpretation and output target level environment perception results in real time to autonomous vehicles.

In another project, RoboSense and Cainiao Network launch a smart sensor system for unmanned, low speed vehicles without blind spots. Previously, these unmanned vehicles used single laser beam lidar, which delivered unsatisfactory environment perception because of blind spots caused by the limitations of vertical FoV.

The RS-Bpearl has a wide FoV of 360 x 90 degrees, within the detection range of 30m (10 per cent) for a 100mm blind spot. The compact size of the sensor makes it easy to be applied to the side of the vehicle body to detect the vehicle’s surroundings, including blind spots. The RS-Bpearl’s modular design also dramatically reduces cost while adding the ability for customisation, says RoboSense.

Robot taxis need lidar with a higher vertical resolution to achieve a longer detection range, leading RoboSense to develop the 128 beam RS-Ruby lidar. It has three times higher 0.1 degree resolution and a three times longer detection range, compared with the previous version, RS-Lidar-32. One RS-Ruby Lidar is the core sensor on top of the vehicle to cover the 360 degree perception and two are located on the vehicle’s sides to detect blind spots.

Vehicle to road (V2R) systems allow vehicles to work with road conditions to co-ordinate and optimise the vehicle’s driving path, improving safety and road efficiency. RoboSense partnered with Sensible 4 to launch the world’s first autonomous driving shuttle bus for all weather conditions, the GACHA. Equipped with RoboSense’s cold-resistant 16-beam mechanical lidar environment perception system works on snow and ice covered roads in harsh winter and other severe weather conditions. RoboSense and Finland-based Sensible 4 will continue to collaborate deeper on future autonomous driving applications.

http://www.robosense.ai

> Read More

IAR Systems updates functional safety editions of Embedded Workbench

Functional safety editions of the IAR Embedded Workbench embedded development toolchain now include the standard EN 50657:2017 Railways Applications – Rolling stock applications – Software on Board Rolling Stock certification as well as a later revision of the Road vehicles – Functional safety standard, or ISO 26262:2018.

Functional safety is one of the most important features in many embedded systems and companies, as proof of compliance for the tools increases cost and time of development. IAR Systems provides certified versions of the complete compiler and debugger toolchain IAR Embedded Workbench for Arm, Renesas RX, Renesas RL78, and Renesas RH850.

The build chains of IAR Embedded Workbench for Arm, RX, RL78 and RH850 have been tested and approved according to the requirements on support tools to functional safety standard IEC 61508, the standard for automotive safety-related systems ISO 26262, and the European railway standard EN 50128 and EN 50657. For Arm, RX and RL78, the certification also covers IEC 62304, defining the life cycle requirements for medical device software. The quality assurance measures allow application developers to use the tools in safety-related software development for each safety integrity level (SIL) according to IEC 61508 and each automotive safety integrity level (ASIL) of ISO 26262. IAR Embedded Workbench is certified by TÜV SÜD.

IAR Embedded Workbench provides a complete integrated development environment (IDE) including the IAR C/C++ Compiler and the C-SPY Debugger. The code analysis tools C-Run and C-Stat add static and runtime analysis for code control through the entire development cycle.

IAR Systems also offers a Functional Safety Support and Update Agreement with guaranteed support for the version for the longevity of the contract. In addition to prioritised technical support, the agreement includes access to validated service packs and regular reports of known deviations and problems.

IAR Systems supplies future-proof software tools and services for embedded development. The company is headquartered in Uppsala, Sweden and has sales and support offices all over the world. Since 2018, Secure Thingz, a provider of advanced security solutions for embedded systems in the IoT, is part of IAR Systems.

http://www.iar.com

> Read More

Four-channel automotive PMIC is compact

Claimed to be the most efficient power supply available today, the MAX20049 is a power management IC (PMIC) for vehicle camera modules that has been released by Maxim Integrated.

It has been introduced to meet the demands of automotive camera modules which are becoming increasingly smaller. The MAX20049 integrates four power supplies into a small footprint. The MAX20049 offers options to support various output voltages while also providing fault mitigation by flagging faults and shifts in output voltages.

The four-channel MAX20049 measures 38mm2 and is almost 30 per cent more compact than competitive solutions, claims Maxim Integrated and offer the highest efficiency among other quad-power power management ICs in its class. It has options to support modules that need various output voltages for different mixes of sensors and serialisers, enabling designers to make changes in layout or to fine-tune the IC to meet specific application requirements. Flexible sequencing and fixed output voltages support various image sensors. The MAX20049 provides fault mitigation to help flag faults and shifts in output voltages to ensure that the cameras are working as needed.

It has over-voltage protection, under-voltage lockout, external power good (PGOOD) signal and cycle-by-cycle current limit. And supports a wide voltage input range from 4.0 to 17V, enabling power-over-coax (POC), typically from 8.0 to 10V. There is also an option of using one of the buck converters as an intermediate supply for generating typical sensor and serialiser rails.

System efficiency at full load is 74 per cent, compared with 69 per cent efficiency for discrete ICs.

Spread spectrum and 2.2MHz switching frequency mitigates electromagnetic interference (EMI) to meet CISPR low-noise specifications.

The MAX20049 is available now and Maxim also offers the MAX20049EVKIT# evaluation kit and EE-Sim models.

This news story is brought to you by softei.com, the specialist site dedicated to delivering information about what’s new in the electronics industry, with daily news updates, new products and industry news.

To stay up-to-date, register to receive our weekly newsletters and keep informed of the latest technology news and new products from around the globe. Simply click this link to register here:  softei.com

http://www.maximintegrated.com/products/MAX20049

> Read More

STMicroelectronics and Virscient partner for vehicle connectivity

Wireless connectivity skills from Virscient are used in STMicroelectronics’  Telemaco3P automotive application processors for connected vehicles.

Virscient offers support to ST customers in the development and delivery of advanced automotive applications based on the ST Modular Telematics Platform (MTP). MTP is a development and demonstration platform incorporating ST’s Telemaco3P telematics and connectivity microprocessor. MTP enables the rapid prototyping and development of smart driving applications, including vehicle connectivity to back-end servers, road infrastructure, and other vehicles, explains ST. Virscient brings wireless connectivity technologies and protocols for architecting connected car systems that rely on technologies such as GNSS (precise positioning), LTE/cellular modems, V2X technologies, Wi‑Fi, Bluetooth, and Bluetooth Low Energy.

The Telemaco3P incorporates dual Arm Cortex-A7 processors with an embedded hardware security module (HSM), an independent Arm Cortex-M3 subsystem, and a set of connectivity interfaces.

Telemaco3P SoC ensures a secure connection between the vehicle and the Cloud, explains ST. Its asymmetric multi-core architecture provides powerful application processors as well as an independent CAN control subsystem with optimised power management. Its ISO 26262 silicon design, its embedded Hardware Security Module, and automotive-grade qualification up to 105 degrees C ambient temperature allow for the implementation of a range of secure telematics applications supporting high-throughput wireless connectivity and over the air (OTA) firmware upgrades.

ST and Virscient will be exhibiting the Modular Telematics Platform within the ST Automotive Telematics Ecosystem at Embedded World. Visit ST in Hall 4A, stand 4A-138.

Semiconductor supplier, ST provides intelligent and energy-efficient products enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and IoT devices.

Virscient helps the world’s leading semiconductor and product companies get to market faster with quality wireless connectivity solutions for automotive, audio, IoT, and industrial markets. With deep expertise in secure wireless and connected systems, Virscient provides engineering services and intellectual property spanning a range of technologies such as Wi‑Fi, Bluetooth, 5G, GNSS, LoRa, Sigfox and IEEE 802.15.4.

http://www.st.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration