Clock generators, buffers and PCIe clocks and buffers are AEC-Q100-qualified

To meet the demanding clocking needs of in-vehicle systems, Silicon Labs believes it now offers the industry’s broadest portfolio of automotive grade timing solutions, as it introduces AEC-Q100-qualified timing devices, the Si5332 any-frequency programmable clock generators, Si5225x PCIe Gen1/2/3/4/5 clocks, Si5325x PCIe buffers and Si5335x fanout clock buffers.

These timing devices help automotive OEMs and Tier 1 suppliers simplify clock tree design, reduce system points of failure, increase system reliability and optimise the performance of high-speed serial data transfer. The timing devices target automotive camera sub-systems, radar and lidar sensors, advanced driver assistance systems (ADAS), autonomous driving control units, driver monitoring cameras, infotainment systems, Ethernet switches, and GPS and 5G connectivity.

Rather than using more quartz-based components to satisfy a growing list of timing requirements, developers now have the option to simplify their clock tree designs and increase system reliability using the company’s automotive-grade low-jitter, any-frequency clock generators and buffers.

Quartz crystal and oscillator timing devices can be prone to shock and vibration failure as well as start-up issues, explains Silicon Labs. Clocking requirements increase in demand as automotive infotainment platforms continue to adopt new features and ADAS systems increase complexity and data acquisition rates.

Automotive in-vehicle applications require a higher operating temperature range (Automotive Grade 2, -40 to +105 degrees C) and qualification to AEC-Q100 automotive standards.

The Si5332 clock leverages Silicon Labs’ MultiSynth technology to provide any-frequency, any-output clock synthesis with more than 60 per cent lower jitter than competing automotive clocks, says the company. Supporting up to eight clock outputs, selectable signal formats per output clock (LVDS, LVPECL, HCSL, LVCMOS) and independent 1.8-3.3V VDDO, the Si5332 clock interfaces to a range of FPGAs, ASICs, Ethernet switches/PHYs, processors, GPUs, SoCs, and PCIe Gen1/2/3/4/5 and NVLink SerDes. Clock synthesis, clock distribution and format/level translation are consolidated on-chip, enabling optimised single-IC clock tree solutions for automotive designs.

The Si5332 clock generators and Si5335x clock buffers are configurable and customisable using Silicon Labs’ flexible ClockBuilder Pro software, enabling developers to create optimised solutions that exactly match specific clock tree requirements, with samples shipping in less than two weeks.

Samples and production quantities of automotive grade Si5332 clock generators, Si5225x PCIe clocks, Si5325x PCIe buffers and Si5335x clock buffers are available now in 32-QFN and 40-QFN package options.

Evaluation boards (EVBs) for automotive grade timing devices are also available. The EVBs work seamlessly with ClockBuilder Pro, enabling developers to quickly customize a device and evaluate performance.

http://www.silabs.com

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Secure flash memory enhances secure data storage in self-driving cars

Macronix’s secure flash memory has been integrated in Nvidia’s next-generation autonomous driving platforms.

The automotive-grade ArmorFlash memory is being used on the Nvidia Drive AGX Xavier and Drive AGX Pegasus autonomous vehicle computing platforms.

The ArmorFlash memory is secure for data storage in the artificial intelligence (AI)-based Level 2+ advanced driver assistance systems (ADAS) through to Level 5 autonomous driving.   

“Our efforts in conjunction with NVIDIA are singularly focused on elevating the security of data in AI-based autonomous driving applications and ultimately, to enhance the safety of drivers,” said Anthony Le, vice president of marketing, Macronix America.

The ArmorFlash memory on the Drive AGX Xavier and Pegasus platforms can provide trusted identification, authentication and encryption features for autonomous driving security requirements.

ArmorFlash offers a combination of mature security technologies, including unique ID, authentication and encryption features. This blend of features enables superior levels of security in a high-density memory device to prevent data from being compromised, claims Macronix.

The ArmorFlash device provides trusted NVM storage of encrypted and integrity-protected assets. The ArmorFlash supports secure communication channel and protocol with the Nvidia Xavier system on a chip (SoC) via cryptographic operations, integrity checks and additional measures against certain security protocol attacks.

The global ADAS market is expected to exceed $67 billion by 2025, fuelled by a compounded annual growth rate of 19 per cent, according to Grand View Research. The research company attributes the growth to increasing government initiatives mandating driver assistance system to lower road accidents and cites expanding adoption of ADAS in small cars as a factor boosting market demand.

http://www.macronix.com

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Skyline RFID inlays and tags can be used on metal

Rain radio frequency identification (RFID) inlays can be used on metal surfaces for and have a reading range of 6m.

The Skyline Rain RFID inlays and tags have an optimised antenna and spacer-based design. A customised ultra high frequency (UHF) inlay is based on NXP’s UCODE 7xm IC with 448-bit EPC memory and extended user memory of 2kbits. The resulting transponder is then folded and applied around a synthetic spacer developed and provided by identytag of Bad Berleburg, Germany.

The advanced antenna design, the IC’s long read range and reliable operation in dense reader and noisy environments through high interference rejection, as well as  optimised spacer material result in an on-metal read range in a compact tag, with a die-cut size of 54 x 25 x 1.8mm.

The inlay is permanently attached to the spacer and a layer of strong and resilient RA-33 adhesive is applied. According to Smartrac, this provides “excellent adhesion” to a range of surfaces. As a finished tag, Skyline’s surface is printable with thermal transfer printers.

The RFID tag can be used for tracking metallic assets, items and components in industrial environments such as automotive, mechanical engineering and aviation. Smartrac’s Skyline inlays and tags comply with VDA recommendations for the automotive industry and supported by the leading automation companies globally.

Smartrac and identytag completed initial product volumes and will be ramping up production in the second half of the year 2019.

Smartrac provides both ready-made and customised products. It makes products smart and enables businesses to digitise, identify, authenticate, track and complement products. Products are used in a wide array of applications such as animal identification, automation, automotive, brand protection, customer experience, industry, library and media management, logistics, retail and supply chain management.

Based in Amsterdam, the Netherlands, Smartac has research and development centres, production and a sales network, complemented by the IoT platform, Smart Cosmos. Smartrac embeds intelligence into physical products for an ecosystem of connected things. The company has also received ARC Quality Certification from Auburn University’s RFID Lab for the design and manufacturing of its RFID inlays.

http://www.smartrac-group.com

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Automotive-grade MOSFETs lead way for small ADAS cameras

The new RV4xxx series enables greater miniaturisation in automotive devices such as ADAS camera modules, says Rohm Semiconductor.

The compact 1.6 x 1.6mm MOSFETs are AEC-Q101-qualified. The MOSFETs are claimed to be the first in the industry to ensure the electrode height on the side of the package (130 micron) required for vehicle applications by using original wettable flank formation technology. The result is a consistent solder quality, says Rohm – even for bottom electrode type products – enabling automatic inspection machines to easily verify solder conditions after mounting. Automotive optical inspection is performed during the assembly process, but the height of bottom electrode components solder cannot be verified after mounting. The RV4xxx series uses a proprietary wettable flank technology that guarantees an electrode height on the side of the package of 130 micron. This is achieved by making a cut into the lead frame on the side of the package before plating. However, burrs resulting from cutting into the lead frame can occur more frequently as the height of the cut increases. Rohm’s method introduces a barrier layer on the entire surface of the lead frame to minimise the occurrence of burrs. This not only prevents component rise and solder defects during mounting, but is the first on the market to ensure a 130 micron electrode height on the side of DFN1616 (1.6 x 1.6mm) packages.

Schottky barrier diodes (SBDs) are commonly used in the reverse connection protection circuits of ADAS camera modules, but the larger currents required by high resolution cameras in advanced vehicle systems, call for the use of compact MOSFETs instead that provide low on resistance and less heat generation.

For example, at a current and power consumption of 2.0A and 0.6W, respectively, conventional automotive MOSFETs can reduce mounting area by 30 per cent compared with SBDs, says Rohm. In addition, adopting bottom electrode MOSFETs for their heat dissipation characteristics, while still supporting large currents in an even smaller form factor makes it possible to decrease mounting area by as much as 78 per cent compared with conventional SBDs and by as much as 68 per cent compared with conventional MOSFETs.

Samples are available now, with OEM qualities expected in September 2019.

http://www.rohm.com/eu

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