Panasonic shrinks Bluetooth 5.0 Low Energy module for IoT

The low energy PAN1740A Bluetooth 5.0 module is compact and has a fast boot time for IIot and smart home applications as well as remote controls.

The module is the successor of the PAN1740 Bluetooth module. The PAN1740A is an optimised version, offering a quicker boot time and supporting up to eight connections to create more advanced applications. It can be used as a standalone application processor or as a data pump in hosted systems. The device is optimised for remote control units (RCU) requiring support for voice commands and motion/gesture recognition.

The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT) and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG, as well as custom profiles, are supported.

The footprint is only 9.0 x 9.5 x 1.8mm and features a Dialog DA14585 board and an Arm Cortex-M0 microcontroller. The operating temperature range is -40 to +85 degrees C and the supply voltage range is 2.2 up to 3.3V.

The fast boot is a benefit to industrial IoT (IIoT) devices, like connected sensors or human machine interface (HMI) devices, says Panasonic. Smart home and building automation devices like lighting systems, metering applications, remote controls, trackers or smart home nodes will benefit from the PAN1740A’s low power consumption, says Panasonic.

Panasonic develops diverse electronics technologies and solutions for customers in the consumer electronics, housing, automotive, and B2B businesses. The company celebrated its 100th anniversary in 2018 and operates 582 subsidiaries and 87 associated companies worldwide.

Panasonic Industry Europe is part of the global Panasonic Group and provides automotive and industrial products and services in Europe. As a partner for the industrial sector, Panasonic researches, develops, manufactures and supplies key electronic components, devices and modules up to complete solutions and production equipment for manufacturing lines across a broad range of industries. Panasonic Industry Europe is part of the global company Panasonic Industrial Solutions.

http://industry.panasonic.eu

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Ultra-Wideband IC opens doors for hands-free car access

For hands-free smartphone car access, NXP, the BMW Group and Continental are working together to develop new automotive uses, based on NXP’s new automotive ultra wideband (UWB) IC.

The NXP NCJ29D5 is the first of a new generation of UWB ICs designed specifically for the demands of the global automotive industry. Together, with NXP connectivity and security solutions, such as Bluetooth, near field communication (NFC) and Secure Element (SE), it enables true secure hands-free smart access, says NXP, and supports standardisation in vehicle connectivity.

UWB provides precise, secure, real-time localisation capabilities, superior to other wireless technologies such as Wi-Fi, Bluetooth, and GPS, explains NXP. The technology is designed to give spatial awareness to UWB-equipped cars, mobiles and other smart devices, to enable cars to know exactly where the users are, for smartphone-based car access with the same level of convenience as key fobs. Users can open and start cars, while leaving their phones in their pockets or bags, and enjoy secure remote parking via smartphone. The UWB IC maximises protection against car theft through relay attacks.

The three partners and others are jointly working on UWB implementations through the Car Connectivity Consortium (CCC) and IEEE, and combining vehicle, mobile and consumer devices. Efforts for standardisation aim to enable a global standard for hands-free smart access and other automotive localisation, based on UWB.

Commenting on the ubiquity of smartphones, Dr Olaf Müller, head of development digital access functions, BMW Group, said: “We are convinced that the smartphone-based comfort access is just the beginning of a series of innovative vehicle-related UWB use cases.”

For Philippe Fournet-Fayat, director at Continental AG for car access systems: “To deliver new use cases, such as smartphone access and remote parking requires the ultra-precise real-time localisation capabilities of UWB.”

As well as smart access and remote parking, NXP’s automotive UWB targets short range radar, smartphone valet parking, electric vehicle charging, drive through payment and the car-as-a-key for seamlessly access garage door/parking.

http://www.nxp.com/UWB

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Xilinx adds MPSoCs for ADAS and autonomous driving

The Xilinix Automotive (XA) Zynq UltraScale+ MPSoC 7EV and 11EG have been added to the company’s automotive portfolio. According to the company, the programmable capacity, performance and I/O capabilities enable high-speed, data aggregation, pre-processing, and distribution (DAPD) as well as compute acceleration for L2+ to L4 advanced driver assistance systems (ADAS) and autonomous driving applications.

The XA Zynq UltraScale+ MPSoC 7EV and 11EG offer over 650,000 programmable logic cells and nearly 3,000 DSP slices, representing a 2.5-fold increase compared with the previous largest device.

The XA 7EV contains a video codec unit for h.264/h.265 encode and decode; the XA 11EG includes 32 12.5Gbits per second transceivers and provides four PCIe Gen3x16 blocks. At the launch, Xilinx said the devices provide the performance required by carmakers, robotaxi developers and Tier-1 suppliers to perform power-efficient DAPD and compute acceleration that allows for scalable production deployments for autonomous driving vehicles.

The XA Zynq UltraScale+ MPSoC portfolio is qualified to AEC-Q100 and integrates both Xilinx programmable logic and a feature-rich 64-bit quad-core Arm Cortex-A53 and dual-core Arm Cortex-R5-based processing system that is certified to ASIL-C level in the low power domain. These characteristics and the high data throughput capability of the XA 7EV and XA 11EG accelerate the deployment of autonomous.

The XA 7EV and XA 11EG are available for order today.  Both are supported by Vitis and Vitis AI software.

Xilinx develops adaptive processing platforms that enable rapid innovation from the endpoint to the edge to the cloud. Xilinx invented the FPGA, hardware programmable SoCs, and the ACAP.

http://www.xilinx.com

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Automotive-certified level shifters assist ADAS development

Two high-speed, automotive-compliant voltage translators for use in environments with ambient temperatures up to 125 degrees C are available from Diodes. The PI4ULS5V108Q and PI4ULS5V202Q are designed for use in advanced driver-assistance systems (ADAS), infotainment, and telematics equipment.

Both shifters are compatible with either push-pull or open-drain connections. They have bi-directional flexibility with automatic direction sensing simplifies level shifting between bus interfaces, such as SMBus, PMBus, or I2C devices, by eliminating any requirement for a direction-control signal.

The eight-channel PI4ULS5V108Q performs up-translation at up to 100MHz and down-translation at over 100MHz. This performance makes it suitable for use in high data-rate interfaces, says the Diodes. Designers can ensure fast exchanges across SPI or other interfaces, with no limitation due to level shifting. This enables data transfers between system-on-chip (SoC) and peripheral components to be executed with optimum efficiency.

The PI4ULS5V202Q is a two-channel translator with internal 10kOhm pull-up resistors, allowing direct connection to interfaces with open-drain topology, such as I2C ports. The large maximum voltage-translation range of 1.2 to 5.5V enables the device to work with a variety of I2C chips and circuit designs. The PI4ULS5V202Q’s high-speed, one-shot detectors at the IC inputs result in fast rise and fall times. The PI4ULS5V202Q is able to support data rates of up to 20Mbits per second.

Both devices are AEC-Q100 grade 1 qualified, for automotive use and PPAP (production part approval process) -capable. They are in production at IATF 16949 certified sites.

The PI4ULS5V108Q is available now in the TSSOP-20 package and the PI4ULS5V202Q is offered in the MSOP-8 package.

Diodes manufactures and supplies application specific standard products within the broad discrete, logic, analogue, and mixed-signal semiconductor markets. Diodes serves the consumer electronics, computing, communications, industrial, and automotive markets. Products include diodes, rectifiers, transistors, MOSFETs, protection devices, function-specific arrays, single gate logic, amplifiers and comparators, Hall-effect and temperature sensors, power management devices, including LED drivers, AC/DC converters and controllers, DC/DC switching and linear voltage regulators, and voltage references along with special function devices, such as USB power switches, load switches, voltage supervisors, and motor controllers. Diodes also has timing, connectivity, switching, and signal integrity solutions for high-speed signals.

http://www.diodes.com

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