Harting snaps into Rinspeed concept car for power, data and signals

Swiss automotive manufacturer, Rinspeed is presenting its metroSnap concept vehicle at CES this week, and Harting has designed an interface that supplies the vehicle with power, data and signals.

The module helps the driver use the vehicle for a wide range of tasks. It is divided into the Skateboard, which serves as an optimised electric vehicle (EV), and the Pod, which can be switched to accommodate different tasks. Communication, signal transmission and the power supply must all work smoothly between these two elements. Connectivity is automatically established as soon as the Pod and the Skateboard are securely connected.

The two companies have partnered before, with a fast charger from Harting Automotive, Harting’s subsidiary which reported a sharp increase in demand for e-mobility solutions. The company leverages its decades of experience in the field of connection and transmission technology to develop and produce charging equipment for electric and plug-in hybrid vehicles (PHEVs).

In 2016, Harting’s Mica was integrated into Rinspeed’s Etos vehicle for autonomous emission and condition monitoring. In 2017, Harting its miniMICA to support Rinspeed’s Oasis car. The following year, Harting provided the fast-charging technology for the Snap and in 2019, the microSnap was charged using the fast-charging push.

http://www.harting.com

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Jacinto 7 processors have functional safety features to advance ADAS 

Deep learning capabilities and advanced networking characterise the Jacinto 7 processor platform that Texas Instruments launched at CES. The first two automotive devices in the platform, TDA4VM processors for advanced driver assistance systems (ADAS) and DRA829V processors for gateway systems, include specialised on-chip accelerators to segment and expedite data-intensive tasks, like computer vision and deep learning.

The TDA4VM and DRA829V processors also incorporate a functional safety microcontroller, making it possible for original equipment manufacturers (OEMs) and Tier-1 suppliers to support both ASIL-D safety-critical tasks and convenience features with one chip, points out Texas Instruments. They share a single software platform, to reduce system complexity and cost as developers can reuse their software investment across multiple vehicle domains.

The TDA4VM processor offers on-chip analytics combined with sensor pre-processing, enabling OEMs and Tier-1 suppliers to support front camera applications using high-resolution 8Mpixel cameras to see farther and add enhanced features, such as drive assist. They are also capable of simultaneously operating four to six 3Mpixel cameras while also fusing other sensing modalities such as radar, lidar and ultrasonic on one chip, adds Texas Instruments. This multi-level capability enables TDA4VM to act as the centralised processor for ADAS. It also enables the critical features for automated parking, like surround view and image processing for displays and enhanced vehicle perception.

The DRA829V processor integrates the computing functions required for modern vehicles. It is believed to be the first in the industry to incorporate a PCIe switch on-chip in addition to an eight-port gigabit time sensitive network (TSN) -enabled Ethernet switch for faster computing functions and communications throughout the vehicle.

It also supports ASIL-D safety-critical and non-safety-critical operations and enables  OEMs and Tier-1 suppliers to support mixed-criticality applications on one device. Higher bandwidth on-chip also allows developers to manage software development and validation in vehicles, for more dynamic updates and upgrades.

Pre-production TDA4VM and DRA8329V processors are available now, together with Jacinto 7 processors development kits and TDA4VMXEVM and DRA829VXEVM evaluation modules.

Volume production is expected to be available in the second half of 2020.

http://www.TI.com

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Automotive Ethernet switch is “key component” for high speed networks

At CES, in Las Vegas this week, NXP Semiconductors will introduce an Ethernet switch that it describes as a “key component” of vehicle networks, with high levels of performance, safety and security.

The SJA1110 multi-gigabit Ethernet switch is designed to help vehicle manufacturers deliver the high-speed networks required for connected vehicles. It is believed to be the first automotive Ethernet switch with built in safety capabilities, offering integrated 100BASE-T1 PHYs, hardware-assisted security as well as multi-gigabit interfaces. It is optimised for integration with NXP’s S32G vehicle network processor and is designed to be used with the VR5510 power management IC in vehicle networks.

It has been introduced to support the Ethernet-based web sensors, actuators and processing unit and service-oriented gateways and domain controllers required for over-the-air updates and data-driven applications in connected vehicle networks. These networks are required to be scalable and move data quickly and securely. The car networks must also deliver functional safety in case of failure.

The SJA1110 Ethernet switch is aligned to the latest tine-sensitive network (TSN) standards and offers integrated 100BASE-T1 PHYs, hardware-assisted security and safety capabilities along with multi-gigabit interfaces.

It enables customers to meet ASIL requirements and implement dedicated failure-detection mechanisms for predictive maintenance.

The SJA1110 switch processes every Ethernet frame reaching the engine control unit (ECU) by validating it against hardware-based security rules which collect statistics and can trigger escalations if something does not conform to specification.

It is available in four hardware- and software- compatible variants, with a set of NXP original software and an open integrated controller.

NXP Semiconductors enables secure connections for a smarter world and provides secure connectivity solutions for embedded applications for applications in the automotive, industrial and IoT, mobile, and communication infrastructure markets. The company has approximately 30,000 employees in more than 30 countries.

http://www.nxp.com

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4D lidar chip holds promise of mass scale autonomous vehicles

The Aeries frequency modulated continuous wave (FMCW) lidar-on-chip sensing system provides high range performance and low cost to take autonomous driving to mass scale, claims Aeva.

The Aeries system integrates key elements of a lidar sensor into a miniaturised photonics chip, says Aeva. The company claims that its 4D lidar-on-chip significantly reduces the size and power of the device while achieving full range performance of over 300m for low reflective objects and the ability to measure instant velocity for every point; this is a first for the autonomous vehicle industry, says Aeva. The lidar-on-chip will cost less than $500 at scale, compared with $10,000s for today’s lidar sensors.

“One of the biggest roadblocks to bringing autonomous vehicles to the mainstream has been the lack of a high-performance and low-cost LiDAR that can scale to millions of units per year,” said Soroush Salehian, Aeva’s co-founder. “From the beginning we’ve believed that the only way to truly address this problem was to build a unique LiDAR-on-chip sensing system that can be manufactured at silicon scale.”

A distinguishing approach by Aeva is for the Aeries sensing system to measure the instant velocity of every point on objects beyond 300m. Aeva’s lidar is also free from interference from other sensors or sunlight and it operates at only a fraction of the optical power typically required to achieve long range performance. These factors contribute to increasing the factor of safety and scalability for autonomous driving.

Aeva also differs from other FMCW approaches by being able to provide multiple millions of points per second for each beam, resulting in high fidelity data that has been unprecedented until today, claims the company.

Co-founder, Mina Rezk, explains: “A key differentiator of our approach is breaking the dependency between maximum range and points density, which has been a barrier for time-of-flight and FMCW lidars . . . Our 4D lidar integrates multiple beams on a chip, each . . .capable of measuring more than two million points per second at distances beyond 300m.”

Porsche SE, a majority voting shareholder of the Volkswagen Group, has recently invested in Aeva, expanding the existing partnership between Aeva and Audi’s self-driving unit (Audi is part of the Volkswagen Group). Aeva points out that this is Porsche’s only investment in lidar technology to date.

Alex Hitzinger, senior vice president of Autonomous Driving at VW Group and CEO of VW Autonomy, said: “Together we are looking into using Aeva’s 4D lidar for our VW ID Buzz AV, which is scheduled to launch in 2022/23.”

Aeries meets the final production requirements for autonomous driving robo-taxis and large volume ADAS customers and will be available for use in development vehicles in the first half of 2020.

Aeva will unveil Aeries at CES 2020 (7 to 10 January) at the Las Vegas Convention Center (Booth 7525, Tech East, North Hall).

http://www.Aeva.com

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