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Harman’s development tool enhances vehicles’ in-cabin experience

Thu, Mar 26, 2020

To support innovation in vehicles’ in-cabin experiences, Harman’s AudioworX is an open-framework unified audio platform that enables rapid design using either Harman’s software or proprietary tools. Using the platform, vehicle manufacturers can differentiate brands yet also quickly adapt to the latest consumer preferences.

It is built on Harman’s acoustic, signal processing to provide personalised in-vehicle audio and entertainment in entry level to luxury vehicles, with Individual Sound Zones (ISZ), virtual venues, Clari-Fi and quantum logic immersion (QLI).

AudioworX has combined with networking, software comms and cloud computing technology company, NTT and collaborated to customise its beam forming, echo cancellation and other communications technologies to create personalised in-cabin communication and noise management solutions.

“NTT brings a level of telecommunications expertise and experience that, when combined with the power and flexibility of the AudioworX platform, helps to unlock an elevated environment for in-car communication,” said Chris Ludwig, vice president, EPIC experience team, Harman Lifestyle Automotive.

Harman AudioworX is available now to OEMs and software developers.

Harman designs and engineers connected products for automotive makers, consumers, and enterprises worldwide including connected car systems, audio and visual products, enterprise automation solutions and services supporting the IoT.

More than 50 million automobiles on the road today are equipped with Harman audio and connected car systems. Its software services power billions of mobile devices and systems that are connected, integrated and secure across all platforms, from work and home to car and mobile. Harman’s workforce extends across the Americas, Europe, and Asia.

http://www.harman.com

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Three-phase SiC MOSFET IPM focuses on e-mobility

Fri, Mar 06, 2020

For e-mobility applications, a three-phase SiC MOSFET intelligent power module (IPM) from Cissoid has been designed to improve time to market for electric vehicle (EV) OEMs.

The IPM technology includes a three-phase water-cooled SiC MOSFET module with built-in gate drivers. For OEMs and electric motor manufacturers willing to adopt SiC-based inverters for more efficient and compact motor drives, the IPM is claimed to optimise the electrical, mechanical and thermal design of the power module and its proximity control for automotive and industrial markets.

The first product in this scalable platform, a three-phase 1200V/450A SiC MOSFET IPM, features low conduction losses, with 3.25mOhms on resistance and low switching losses, with 8.3mJ turn-on and 11.2mJ turn-off energies at 600V/300A. It reduces losses by at least a factor three, says Cissoid, compared with the highest performing IGBT power modules. Cissoid’s module is water-cooled through a lightweight AlSiC pin-fin baseplate for a junction-to-fluid thermal resistance of 0.15°C/W. The power module is rated for junction temperature up to +175 degrees C. The IPM withstands isolation voltages up to 3,600V (50Hz, 60 seconds).

The built-in gate driver includes three on-board isolated power supplies (one per phase) delivering each up to 5W allowing it to easily drive the power module up to 25KHz and at ambient temperatures up to +125 degrees C. Peak gate current up to 10A and immunity to high dV/dt (>50KV/µs) enable fast switching of the power module and low switching losses. Protection functions include under-voltage lockout (UVLO), active Miller clamping (AMC), desaturation detection and soft shutdown (SSD).

Dave Hutton, CEO at Cissoid, believes: “With this new SiC intelligent power modules, which is the outcome of years of experience in the development of power modules and gate drivers for extreme temperature and voltage environments, we are happy to deliver our first IPM samples to early SiC adopters and to support the automotive industry in its transition towards highly efficient e-mobility solutions.”

http://www.cissoid.com

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Embedded safety controller is ‘first to be ASIL-D certified to ISO 26262:2018’

Wed, Feb 26, 2020

Infineon Technologies second generation Aurix (TC3xx) microcontrollers are the first embedded safety controllers worldwide to be certified for the highest automotive safety integrity level (ASIL D), according to the latest version of the ISO 26262 standard.

This standard describes a globally binding procedure for the development and production of safety-critical systems in cars. In December 2018, the current version of the standard replaced the original version from 2011. The certificate was issued by SGS TUEV Saar.

“This certification underpins our leadership in automotive safety,” said Peter Schaefer, vice-president and general manager automotive microcontrollers at Infineon. “We defined the safety architecture of our second generation Aurix microcontrollers before the new version of ISO 26262 was even available, and yet it fulfills all requirements for an ASIL D safety controller. We have achieved this through a holistic approach to safety that resulted in a sophisticated and robust architecture. Second generation Aurix microcontrollers thus provide the safety and trust necessary to make automated driving happen.”

AURIX TC3xx devices have up to six processor cores with 300 MHz clock frequency each. Up to four of them have an additional Lockstep core. With around 3,000 DMIPS, Aurix allows for functionally safe computing power supporting ASIL D among safety microcontrollers. Other features include safe internal communication buses and a distributed memory protection system.

Aurix allows the integration of software with different safety levels from different sources. This allows multiple operating systems and applications, such as steering, braking, airbag and driver assistance systems, to be hosted on a common platform.

As well as computing platforms for automated driving using Aurix as their safety host controller, the microcontrollers are used in radar systems for processing sensor data, in engine and transmission control, brake, airbag and steering systems, central gateways, domain control units, hybrid and electric cars, among other applications.

http://www.infineon.com

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Maxim speeds in with tiny LiDAR ICs with higher bandwidth for faster self-driving cars

Wed, Feb 26, 2020

Designers of automotive self-driving systems can now enable higher-speed autonomous driving through what is described as the industry’s fastest and smallest Light Detection and Ranging (LiDAR) ICs from Maxim Integrated Products.

The MAX40026 TDFN’s package size measures 4 sq mm and the MAX40660/1 TDFN package size is 9 sq mm. Maxim’s TIAs support 128 channels with an industry high bandwidth of 490MHz for MAX40660 and 2.1pA/√Hz input-referred noise density to support higher accuracy distance measurement in LiDAR applications. In addition, low propagation delay dispersion of the MAX40026 (10 picoseconds) contributes to accurate detection of fixed and moving objects.

And Maxim says that the MAX40660/1 reduces current consumption by more than 80 per cent in low power mode.

Maxim states that compared to the closest competitive solution, the MAX40026 high-speed comparator and the MAX40660/MAX40661 high-bandwidth transimpedance amplifiers enable 10mph (15km per hour) faster autonomous driving at highway speeds by providing more than 2x higher bandwidth and accommodating 32 additional channels (128 v 96) to a LiDAR module within the same module size.

With automotive self-driving systems evolving from 35mph to 65mph and beyond, LiDAR sensors are playing an increasing role in the fusion of vehicle sensors for their ability to provide accurate distance measurement of objects.

According to Maxim, with more than twice the bandwidth and the ability to accommodate 33 per cent more channels within the same LiDAR module size compared to the closest competitor, the MAX40660/MAX40661 transimpedance amplifiers (TIAs) provide optical receiver designers with higher-resolution images that enable faster autonomous driving systems.

The system size of the MAX40026 high-speed comparator plus the MAX40660/1 TIAs is 5 sq mm smaller than the closest competitive solution, says Maxim, which allows developers to fit more channels into space-constrained vehicle platforms.

The ICs meet the automotive industry’s stringent safety requirements with AEC-Q100 qualification, enhanced electrostatic discharge performance and failure modes, effects and diagnostic analysis to support ISO 26262 certification at the system level.

“Automotive engineers need elements that support greater precision, lower power and smaller solution size to add next-generation LiDAR capabilities to cars rolling off the assembly line,” said Veronique Rozan, executive director of business management, Core Automotive and Special Projects at Maxim Integrated. “Advancements in LiDAR-based solutions will support greater driver awareness and safety from next-generation automotive navigation systems.”

http://www.maximintegrated.com

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Harman’s development tool enhances vehicles’ in-cabin experience

Three-phase SiC MOSFET IPM focuses on e-mobility

Embedded safety controller is ‘first to be ASIL-D certified to ISO 26262:2018’

Maxim speeds in with tiny LiDAR ICs with higher bandwidth for faster self-driving cars

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