Emulator accelerates EV development for international markets

A smart charging station emulator from dSpace allows for the emulation of charging stations with a power of up to 85kW. According to dSpace, the emulator can accelerate the development of electric vehicles (EVs) for international markets.

The Smart Charging Station Emulator allows for the emulation of charging stations with a power of up to 85kW. Manufacturers of EVs and suppliers of battery systems can realistically test new developments with different technical charging standards and protocols, simulate a large number of faults, and develop them quickly and efficiently in line with the requirements of international markets, says dSpace.

It is based on dSpace’s Smart Charging Solution, which is used for testing onboard chargers, charging stations, and communication modules. Other components of the Smart Charging Station Emulator include a Scalexio real-time simulator, a dynamic and expandable model that runs on the simulator. There is also a power supply that enables DC charging and discharging at a maximum of 85kW. This means that vehicle-to-grid (V2G) scenarios can also be simulated, confirms dSpace.

All components are contained in a robust rack, fitted with wheels, to make the system flexible and mobile. It can be used not only in the laboratory but also for tests on prototype vehicles in workshops. There is automatic cable recognition, connecting communication and charge release, insulation monitoring and emergency stop switches, for operator safety.

The system supports international standards for charging communication such as ISO 15118 and DIN SPEC 70121, GB/T 27930, GB/T 18487, and CHAdeMO, and emulates a variety of charging stations and charging scenarios in real time. New charging standards such as CHAdeMO 3.0 or ChaoJi can be implemented.

The Smart Charging Station Emulator supports AC charging up to 63A and DC charging up to a maximum of 200A or 85kW. It is also adaptable to customer-specific charging supply requirements. In addition, the system offers almost unlimited options for manipulating electrical parameters and communication.

dSpace provides simulation and test solutions for developing networked, autonomous, and electrically powered vehicles. Automotive manufacturers and their suppliers use the company’s end-to-end solution range to test the software and hardware components of new vehicles long before a new model is allowed on the road.

As well as a partner for vehicle development, engineers in aerospace and industrial automation fields also rely on dSpace. The company’s portfolio ranges from end-to-end solutions for simulation and validation to engineering and consulting services as well as training and support.

Headquartered in Paderborn, Germany, dSpace has three project centres in Germany and serves customers through regional dSpace companies in the USA, the UK, France, Japan, China, and Croatia.

http://www.dspace.de

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Lidar camera uses “world’s smallest micro-mirror” for continuous field of view scanning

Continuous laser scanning across the entire field of view is achieved in the Intel RealSense Lidar camera L515, using a MEMS mirror developed by STMicroelectronics.

The lidar camera is 61mm diameter and 26mm high (2.4 inches and 1.02 inches respectively), or the size of an ice hockey puck. The micro-mirror enables continuous laser scanning across the entire field of view. In combination with a custom photodiode sensor, the RealSense Lidar Camera L515 renders a 3D depth map of the entire scene.

The camera provides high resolution scanning for industrial applications such as robotic arms for bin picking, volumetric measurements, logistics and 3D scanning.

The second-generation micro-mirror delivers 30 frames per second and a field of view of 70 degrees by 55 degrees, for 3D scanning and detection applications.

The L515 camera uses the scanning capabilities of ST’s MEMS to deliver high-resolution depth with no interpolated pixels, together with the ability to control the field of view, and provide close to zero pixel blur driven by the low 50nS exposure time, continued ST.

“Intel RealSense technology has been used to develop products and solutions for use in Robotics, Logistics, Scanning and other computer vision applications.  The Intel RealSense LiDAR Camera L515 using ST’s micro-mirrors delivers unparalleled precision and is the world’s smallest high-resolution Lidar depth camera, making it suitable for a variety of use cases,” said Sagi BenMoshe, chief incubation officer, corporate vice president and general manager, Emerging Growth and Incubation Group at Intel.

Intel RealSense technologies are reshaping the future by equipping devices with the ability to see, understand, interact with and learn from their environment, says Intel. RealSense provides a wide variety of vision-based solutions, from the world’s smallest high-resolution lidar camera to low power, platform-agnostic stereo depth cameras, as well as customisable software. Intel RealSense has applications in robotics, 3D scanning, facial authentication, measurement and logistics.

ST Microelectronics is an independent device manufacturer, working with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the IoT and 5G technology.

http://www.st.com

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SiPM array is qualified for automotive lidar use

Lidar capabilities have been added to ON Semiconductor’s intelligent sensing portfolio, with the addition of the RDM-series silicon photo-multiplier (SiPM) array. The ArrayRDM-0112A20-QFN is the first automotive-qualified SiPM product in the market, claims ON Semiconductor.

The monolithic (1 X 12) array of SiPM pixels, enables high sensitivity to near-infra red (NIR) light to achieve 18.5 per cent photon detection efficiency (PDE) at 905nm. The high internal gain of the SiPM allows sensitivity down to the single photon level, which, combined with the high PDE, detects the faintest return signals for a longer distance range, even with low reflective targets, says ON Semiconductor.

SiPM technology has become the sensor of choice for depth sensing applications. They can deliver the highest signal-to-noise performance for long distance ranging in bright sunlight conditions. They also have low supply biases and low sensitivity to temperature changes, making them suitable upgrades for systems that use legacy avalanche photodiodes (APDs). The high volume CMOS process production contributes to the low detector cost, adds ON Semiconductor.

Lidar is used in vehicles to improve safety and advanced driver assistance systems (ADAS), as well as for fully autonomous driving use cases, such as robotic transportation, to safely navigate the environment in real time.

The ArrayRDM-0112A20-QFN’s high PDE allows lidar systems supporting these functions demonstrated a distance range of over 300 meters. The greater distance gives vehicles more time to respond.

The ArrayRDM-0112A20-QFN is AEC-Q102 qualified and developed in accordance with IATF 16949.

ON Semiconductor supplies semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products are used by engineers in automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.

ON Semiconductor operates a responsive supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centres in key markets throughout North America, Europe and the Asia Pacific regions.

http://www.onsemi.com

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Renesas and LUPA develop open automotive smart camera

Partners in the development of the EagleCAM module, Renesas Electronics and LUPA-Electronics, describe it as an open turnkey solution, delivering flexible, high-performance perception.

The open front camera solution features Renesas’ R-Car V3H and R-Car V3M SoCs and supports low- to high-end front camera applications with extensions for surround view, driver monitoring, and augmented reality. It also includes Renesas’ automotive power management ICs (PMICs). The update of the R-Car V3H microcontroller means that new turnkey solutions will benefit from the improved CNN performance of up to 3.7 trillion operations per second, ASIL-C capability of the real-time domain and camera support of up to 8Mpixels. EagleCAM features a pre-validated hardware design, shortening the time required to reach mass production. Customers can access best-in-class perception stacks that offer shorter turnaround time or stacks based on emerging technologies, allowing them to achieve the best fit for their application needs.

The scalable camera platform targets the latest Euro NCAP and C-NCAP safety requirements, such as automatic emergency braking, forward collision warning, lane keeping assist, and traffic sign recognition. EagleCan enables OEMs and Tier 1s to differentiate and extend their offering by integrating their proprietary or third-party software to add driving features, explains Renesas.

Instead of the conventional ‘black box’ approach, Renesas and LUPA say the EagleCAM delivers flexible, high-performance perception while shortening time to market and reducing the bill of materials (BOM) costs.

“The combination of LUPA’s EagleCAM and Renesas R-Car SoCs delivers scalable and functional safety-compliant, open advanced driver assistance systems (ADAS) solutions that enables flexible feature integration, allowing customers to achieve quicker time to production,” said Naoki Yoshida, vice president, Automotive Digital Products Marketing Division, Automotive Solution Business Unit, at Renesas. “We are excited that our collaboration will make it easier for our joint customers to develop smart camera applications and bring NCAP and L2+ functionality to their vehicles more quickly and confidently,” he added.

The EagleCAM camera featuring R-Car SoCs are available now from LUPA.

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https://www.renesas.com

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