Max-M12 connector supports high-speed transmission in harsh environments

Amphenol Industrial Operations has enhanced its Max-M12 product line to include an X coding, high-speed connector with support for 10Gbits per second (1000M Ethernet with CAT6 cable) data transmission and S coding for a safer connection with ‘first mate last break’. The connectors are for use in the rail and mass transit (RMT), heavy equipment vehicles, industrial automation and robotics markets.

When used on RMT door systems, on camera and communication systems, as well as on heating, ventilation, air conditioning (HVAC) systems, the Max-M12 can transmit high speed data in environments where there is high vibration, moisture, salt, dirt and debris. It can also be used for off-road vehicles, ruggedised factory automation and robotics signal applications.

The Max-M12 family of connectors is based on IEC 61076-2-101 and SAE J2839. They are backwards-compatible and can be mated with any standard M12 connector with the same indexing, assures Amphenol. The Max-M12 features several mounting options, including front or back lock/flange and wire termination styles, including solder, crimp and printed circuit tails.

The Max-M12 is rated to 4.0A and can endure extreme temperatures ranging from -55 to +125 degrees C.

All Max-M12 connectors have an IP67 rating making them dust and waterproof. They are resistant to high pressure wash downs and water immersion.  Amphenol has plating designed to endure salt spray testing for up to 240 hours for use in harsh environments.

Amphenol’s Max-M12 connector in-line mated pair can withstand 444N of connector-to-cable retention forces and contact retention forces to 110N. Housed in an HDM 12 EX impact resistant metal or plastic shell, the in-line mated pair is available as a 90 degrees right angle or straight versions. When shielding is required the Max-M12 metal version is available in multiple shell styles for a variety of interconnect requirements.  Both the four- and five-pin configurations are available with A, B and D polarity codes.

Amphenol Industrial Operations is headquartered in Endicott, New York, USA, providing a range of high reliability power/signal connectors and interconnection systems specifically for the industrial markets including rail/mass transit, process control, automotive manufacturing, heavy equipment, wireless base stations and petrochemical/power generation.

Its product range includes ruggedised-for-industry cylindrical, fibre optic, rectangular, and industrialised versions of Amphenol’s MIL-DTL-5015 cylindrical, MIL-DTL-26482 miniature cylindrical and GT reverse bayonet cylindrical connectors. It is ISO9001, TS96949 and MIL-STD-790-certified.

Amphenol Industrial Operations is a division of Amphenol, one of the largest manufacturers of interconnect products in the world.

http://www.amphenol-industrial.com

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Emulator accelerates EV development for international markets

A smart charging station emulator from dSpace allows for the emulation of charging stations with a power of up to 85kW. According to dSpace, the emulator can accelerate the development of electric vehicles (EVs) for international markets.

The Smart Charging Station Emulator allows for the emulation of charging stations with a power of up to 85kW. Manufacturers of EVs and suppliers of battery systems can realistically test new developments with different technical charging standards and protocols, simulate a large number of faults, and develop them quickly and efficiently in line with the requirements of international markets, says dSpace.

It is based on dSpace’s Smart Charging Solution, which is used for testing onboard chargers, charging stations, and communication modules. Other components of the Smart Charging Station Emulator include a Scalexio real-time simulator, a dynamic and expandable model that runs on the simulator. There is also a power supply that enables DC charging and discharging at a maximum of 85kW. This means that vehicle-to-grid (V2G) scenarios can also be simulated, confirms dSpace.

All components are contained in a robust rack, fitted with wheels, to make the system flexible and mobile. It can be used not only in the laboratory but also for tests on prototype vehicles in workshops. There is automatic cable recognition, connecting communication and charge release, insulation monitoring and emergency stop switches, for operator safety.

The system supports international standards for charging communication such as ISO 15118 and DIN SPEC 70121, GB/T 27930, GB/T 18487, and CHAdeMO, and emulates a variety of charging stations and charging scenarios in real time. New charging standards such as CHAdeMO 3.0 or ChaoJi can be implemented.

The Smart Charging Station Emulator supports AC charging up to 63A and DC charging up to a maximum of 200A or 85kW. It is also adaptable to customer-specific charging supply requirements. In addition, the system offers almost unlimited options for manipulating electrical parameters and communication.

dSpace provides simulation and test solutions for developing networked, autonomous, and electrically powered vehicles. Automotive manufacturers and their suppliers use the company’s end-to-end solution range to test the software and hardware components of new vehicles long before a new model is allowed on the road.

As well as a partner for vehicle development, engineers in aerospace and industrial automation fields also rely on dSpace. The company’s portfolio ranges from end-to-end solutions for simulation and validation to engineering and consulting services as well as training and support.

Headquartered in Paderborn, Germany, dSpace has three project centres in Germany and serves customers through regional dSpace companies in the USA, the UK, France, Japan, China, and Croatia.

http://www.dspace.de

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Lidar camera uses “world’s smallest micro-mirror” for continuous field of view scanning

Continuous laser scanning across the entire field of view is achieved in the Intel RealSense Lidar camera L515, using a MEMS mirror developed by STMicroelectronics.

The lidar camera is 61mm diameter and 26mm high (2.4 inches and 1.02 inches respectively), or the size of an ice hockey puck. The micro-mirror enables continuous laser scanning across the entire field of view. In combination with a custom photodiode sensor, the RealSense Lidar Camera L515 renders a 3D depth map of the entire scene.

The camera provides high resolution scanning for industrial applications such as robotic arms for bin picking, volumetric measurements, logistics and 3D scanning.

The second-generation micro-mirror delivers 30 frames per second and a field of view of 70 degrees by 55 degrees, for 3D scanning and detection applications.

The L515 camera uses the scanning capabilities of ST’s MEMS to deliver high-resolution depth with no interpolated pixels, together with the ability to control the field of view, and provide close to zero pixel blur driven by the low 50nS exposure time, continued ST.

“Intel RealSense technology has been used to develop products and solutions for use in Robotics, Logistics, Scanning and other computer vision applications.  The Intel RealSense LiDAR Camera L515 using ST’s micro-mirrors delivers unparalleled precision and is the world’s smallest high-resolution Lidar depth camera, making it suitable for a variety of use cases,” said Sagi BenMoshe, chief incubation officer, corporate vice president and general manager, Emerging Growth and Incubation Group at Intel.

Intel RealSense technologies are reshaping the future by equipping devices with the ability to see, understand, interact with and learn from their environment, says Intel. RealSense provides a wide variety of vision-based solutions, from the world’s smallest high-resolution lidar camera to low power, platform-agnostic stereo depth cameras, as well as customisable software. Intel RealSense has applications in robotics, 3D scanning, facial authentication, measurement and logistics.

ST Microelectronics is an independent device manufacturer, working with more than 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems that enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the IoT and 5G technology.

http://www.st.com

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SiPM array is qualified for automotive lidar use

Lidar capabilities have been added to ON Semiconductor’s intelligent sensing portfolio, with the addition of the RDM-series silicon photo-multiplier (SiPM) array. The ArrayRDM-0112A20-QFN is the first automotive-qualified SiPM product in the market, claims ON Semiconductor.

The monolithic (1 X 12) array of SiPM pixels, enables high sensitivity to near-infra red (NIR) light to achieve 18.5 per cent photon detection efficiency (PDE) at 905nm. The high internal gain of the SiPM allows sensitivity down to the single photon level, which, combined with the high PDE, detects the faintest return signals for a longer distance range, even with low reflective targets, says ON Semiconductor.

SiPM technology has become the sensor of choice for depth sensing applications. They can deliver the highest signal-to-noise performance for long distance ranging in bright sunlight conditions. They also have low supply biases and low sensitivity to temperature changes, making them suitable upgrades for systems that use legacy avalanche photodiodes (APDs). The high volume CMOS process production contributes to the low detector cost, adds ON Semiconductor.

Lidar is used in vehicles to improve safety and advanced driver assistance systems (ADAS), as well as for fully autonomous driving use cases, such as robotic transportation, to safely navigate the environment in real time.

The ArrayRDM-0112A20-QFN’s high PDE allows lidar systems supporting these functions demonstrated a distance range of over 300 meters. The greater distance gives vehicles more time to respond.

The ArrayRDM-0112A20-QFN is AEC-Q102 qualified and developed in accordance with IATF 16949.

ON Semiconductor supplies semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products are used by engineers in automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.

ON Semiconductor operates a responsive supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centres in key markets throughout North America, Europe and the Asia Pacific regions.

http://www.onsemi.com

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