Infineon adds sound to ADAS systems

Adding the sense of hearing to advanced driver assistance systems (ADAS), Infineon Technologies has partnered with Reality AI to integrate its Xensiv MEMS microphones to vehicles’ sensor systems. It enables cars to “see” around the corner and to warn about moving objects hidden in the blind spot or approaching emergency vehicles that are still too distant to see. Typically ADAS is based on cameras, radar or lidar so target objects have to be within the line of sight to be recognised by the system, which has proved a weakness for emergency vehicles as these can be heard much earlier than they can be seen and are therefore “invisible” to ADAS for a period of time.

Infineon’s Xensiv MEMS microphones are combined with Aurix microcontrollers and Reality AI’s automotive see-with-sound (SWS) system. Using machine learning-based algorithms, the system is able to detect emergency vehicles, cars and other road vehicles, even if they cannot be seen by drivers or detected by the sensors incorporated in the vehicles’ ADAS. Machine learning also ensures that the country-specific sirens of emergency vehicles are recognised around the world.

The automotive-qualified Xensiv MEMS microphone IM67D130A has an increased operating temperature range from -40 to +105 degrees C for use in harsh automotive environments. The low distortions (THD) and the high acoustic overload point (AOP) of 130dB SPL enable the microphone to capture distortion-free audio signals in loud environments for a reliable classification, even if the siren sound is hidden in high background or wind noise, says Infineon. This sound-base sensing technology can also enable other applications in vehicles such as road condition monitoring, damage detection or even predictive maintenance.

For processing the audio signal, the Reality AI software uses  Infineon’s Aurix TC3x family of microcontrollers. The scalable microcontroller family offers a range from one to six cores and up to 16Mbyte of flash with functional safety up to ASIL-D according to the ISO26262 2018 standard and EVITA full cybersecurity.

The Xensiv MEMS microphone IM67D130A can be ordered now in a PG-LLGA-5-4 package.

http://www.infineon.com

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Magnetic position sensor meets ASIL-D for ADAS applications

The latest addition to the 3DMAG family of rotary and linear magnetic position sensor ICs for automotive and industrial applications has been announced by Allegro Microsystems. The A31315 sensor delivers the accuracy and performance needed to meet stringent ASIL-D requirements of safety-critical automotive applications, says the company.

Allegro’s 3DMAG sensors combine its planar and vertical Hall-effect technologies to measure magnetic field components along three axes (X, Y, Z). This enables true 3D sensing capabilities with a wide magnetic dynamic range without saturation, says Allegro.

The A31315 sensor is claimed to address the functional safety challenges posed by advances in advanced driver assistance systems (ADAS) and autonomous driving systems, by delivering the measurement accuracy necessary to meet the stringent requirements of safety-critical steering, braking, transmission and throttle systems.

The sensors’ flexible 3D Hall-effect front end and configurable signal processing architecture enable highly accurate, absolute linear position and rotary position measurements up to 360 degree. Existing Allegro 3DMAG devices, such as the ALS31300 and ALS31313 sensors, also support 3D magnetometer applications in which all three magnetic components (BX, BY, BZ) are required to track complex magnetic movements.

The A31315 is a highly accurate A31315 position sensor, says Allegro. It contains advanced on-chip diagnostic features to ensure reliable, safe operation and supports both rotary and linear position sensing with native angle error over temperature in any plane (less than 1.2 degrees over the operating temperature range). Following Safety Element out of Context (SEooC) functional safety guidelines, the A31315 supports ASIL-B (single die) and ASIL-D (dual die) system level integration in accordance with ISO 26262. It is also automotive-qualified to AEC-Q100 Grade 0.

The A31315 sensor is available as a single die in a compact SOIC-8 package, and as a fully redundant stacked dual die in a TSSOP-14 package for applications requiring redundancy or higher levels of measurement. Allegro says its stacked die construction closely aligns the sensing elements of both die, ensuring the measurement of nearly identical magnetic fields. This design enables the dual-die A31315 sensor to offer superior channel matching performance and tighter channel comparison thresholds common in fully redundant safety systems.

The 3DMAG sensors have a wide range of programmable channel trim and linearisation options which can be adjusted to the magnetic circuitry to optimise the sensors for accuracy and manufacturing efficiency in end-of-line programming times for specific applications. The sensors also offer low power consumption and flexible power management options, enabling battery life optimisation in portable applications, says Allegro.

The 3DMAG sensors support flexible low-voltage programming through sensor outputs regardless of the interface (e.g. analogue, SAE J2716 SENT, PWM, I2C), allowing direct programming by a microcontroller in embedded designs and simplifying the interface for end-of-line system calibration. This low-voltage programming option also opens up new system architectures with remote field-replaceable sensor module designs that can be programmed by the electronic control unit (ECU).

 http://www.allegromicro.com

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STi2GAN is STMicroelectronics’ automotive family

Meeting the needs of on-board chargers, lidar for autonomous driving, bi-directional DC/DC converters, Class-D amplifiers, and power conversion systems, STi2GaN is a family of GaN devices from STMicroelectronics.

According to ST, the family combines power and intelligence in compact, high-performance solutions required by the automotive industry as it transitions to electrified platforms.

The family combines a monolithic power stage along with drivers and protection in GaN technology as well as system-in-package (SiP) models for application-specific ICs with additional processing and control circuitry. The STi2GaN devices use ST’s novel bond-wire-free packaging technology to provide high robustness, reliability, and performance.

“STi2GaN continues ST’s long success story in compound materials and smart power product innovation, targeting mainly automotive applications and the needs of high-density, high-reliability and high-power, commented Alfio Russo, group vice president and general manager for low voltage and STI2GaN solutions, macro division, STMicroelectronics. “The new product family aims to leverage the high-power density and efficiency of GaN to offer an industry-unique range of devices in 100V and 650V clusters that ensure scalability, compactness, and outstanding performance,” he added.

STMicroelectronics develops semiconductor technologies and is an independent device manufacturer. It works with over 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems, with technologies for smarter mobility, more efficient power and energy management, and the wide-scale deployment of the IoT and 5G technology.

http://www.st.com

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OmniVision introduces ASIC ISP to support autonomous driving cameras

At AutoSens Detroit 2021, OmniVision will demonstrate its OAX4000 ASIC. This companion image signal processor (ISP) can be used for next-generation automotive single- and multicamera architectures, enabling OEMs to future-proof designs, says the company.

It can be used for automotive applications such as surround-view systems, e-mirrors, interior and autonomous driving cameras. The ASIC is capable of processing data streams from up to four cameras at 3MP or one at 8MP. It supports multiple colour filter array (CFA) patterns and provides the option to output stream for both machine vision and human viewing pipelines independently. The imaging pipeline has been upgraded to provide superior image quality, including a tone-mapping algorithm.

The OAX4000 ISP is compact to fit into a variety of camera architectures and has the processing capacity for a wide variety of camera use cases, said Andy Hanvey, director of automotive marketing at OmniVision.

“The mid- and long-term automotive vision processing market is expected to grow at double digits well into the next decade, however the market for vision processing in automotive is not a one-size-fits all,” observed Tom Hackenberg, principal analyst for Computing and Software in the Semiconductor, Memory and Computing division at Yole Développement (Yole). “The strategies for developing vision processing for advanced driver assistance serving the mass consumer market, shipping and transit, mobility-as-a-service or tomorrow’s autonomous vehicles are all on diverse paths. It can range from smart camera modules to a multitude of basic cameras attached to a single domain controller. It may require integrating other sensors to imaging. What is clear is that there are many paths to vision processing and image processing will need to be rich in features and adaptable to all of these scenarios.”

The OAX4000 is a companion ISP for the OmniVision HDR sensors, designed to provide a complete multi-camera viewing application with fully processed YUV output. It is capable of processing up to four camera modules with 140dB HDR, and is claimed to have leading LED flicker mitigation (LFM) performance as well as high 8Mpixel resolution. It supports multiple CFA patterns, including Bayer, RCCB, RGB-IR and RYYCy. Power consumption is 30 per cent lower than the previous generation.

The OAX4000 reduces the number of electronic control modules required from two to one, reducing design complexity and space, and improving overall reliability.

The OAX4000 complies with ASIL B advanced safety standards. It is available now for sampling and mass production.

OmniVision will present the OAX4000 ISP at AutoSens Detroit, a virtual conference (12 to 13 May, 2021).

OmniVision Technologies develops digital imaging solutions. Its award-winning CMOS imaging technology is used in many of today’s consumer and commercial applications, including mobile phones, security and surveillance, automotive, tablets, notebooks, webcams and entertainment devices, medical and AR, VR, drones and robotics imaging systems.

http://www.ovt.com

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