Infineon and Bosch create low loss diode to reduce CO2

Infineon Technologies and Robert Bosch have collaborated to develop a low loss diode to reduce CO2 emissions in light vehicle generators.

The Active Rectifying diode enables an increase in generator efficiency of up to eight per cent compared to conventional power conversion methods, says Infineon. Deploying the diode can reduce the COemissions of a car by up to 1.8g/km. It can replace standard devices for use in generators and cars that are already in series production. It is a quick and cost-efficient step for OEMs to reduce fleet emission targets, said Finn Felsberg, vice president and general manager, power integration and supply at Infineon’s automotive division

In a conventional car, the generator produces the electric energy for charging the battery and supplying a growing number of safety and comfort features such as driver assistance systems, air conditioning and infotainment. The Active Rectifying diode allows generators to achieve a power conversion efficiency beyond 80 per cent, compared with typical levels of up to 72 per cent today, said Infineon.

The Active Rectifying diode is based on Infineon’s chip technology which integrates MOSFETs, capacitors and control logic on a single die. The chip is assembled by Bosch into the body of the diode in a pressfit package. The diode is distinguished by a low diode forward voltage of 0.1V at 100A RMS and a low leakage current. It also  features mechanical robustness as well as high reliability and EMC, with a simple assembly process.

The Active Rectifying diode is in production at Bosch.

http://www.infineon.com

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Xtensa processors meet ISO 26262 compliance to ASIL-D

Cadence Tensilica Xtensa processors with FlexLock capability meet the ISO 26262:2018 standard to ASIL-D, the highest level possible under the Automotive Safety Integrity Level rating. The functional safety certification spans from base microcontroller to high-performance DSP, each with a configuration option for FlexLock to provide increased random fault protection. The processor have been developed following a robust safety process to protect against systematic faults. Tensilica Xtensa processors with FlexLock are suitable for the automotive market and tailored for AI, vision, radar, lidar, audio, vehicle-to-everything (V2X), and control applications.

The Cadence Tensilica FlexLock processors optimised for automotive applications are among the first in the industry to achieve full compliance with ASIL-D functional safety standards, said Wolfgang Ruf, head of functional safety for semiconductors at SGS-TÜV Saar. “Certification to . . . . the ISO 26262:2018 standard for ASIL-D systematic and random fault avoidance is a testament to the high functional safety quality of Cadence’s IP. SoC designers are assured that their designs using functional safety-certified Tensilica processor IP can achieve compliance with the automotive industry’s stringent safety-critical requirements,” he added.

Key to ASIL-D compliance is the new FlexLock capability, which adds lockstep support to the flexible and extensible Xtensa processor architecture. Lockstep is a proven method for increasing safety in software execution by providing redundancy of the core logic at the hardware level. In addition to ASIL-D certification, FlexLock also gives design teams the ability to accommodate two cores running independently in ASIL-B solutions and the option of running local memories and caches of two cores in lockstep, achieving even greater levels of protection against memory faults.

“Higher levels of autonomy require more intelligent computing at the edge in automotive applications, which is driving the need for higher levels of functional safety,” said Larry Przywara, senior group director, Tensilica marketing at Cadence. “With the introduction of FlexLock capability, users of Tensilica controllers and DSPs can achieve the highest level of certification, ASIL-D, and the protection it brings against random hardware faults. Designers choosing Tensilica IP to accelerate their ADAS [advanced driver assistance systems], radar, lidar, V2X and vision processing can do so with the confidence that they can meet their customers’ functional safety requirements.”

As with other Xtensa processors, the ASIL-D certified cores can be customised using the Tensilica Instruction Extension (TIE) language. This allows the IP to be optimised for the specific application, combining the right level of performance with the highest levels of safety.

The Tensilica Xtensa processors with FlexLock capability are available now.

http://www.cadence.com

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R-Car Gen3e SoCs have up to 20 per cent higher CPU speed, says Renesas

Six SoCs have been added to the R-Car series by Renesas Electronics. The R-Car Gen3e series is a scalable series of devices for entry- to mid-range automotive applications that require high-quality graphics rendering. They can be used in integrated cockpit domain controllers, in-vehicle infotainment (IVI), digital instrument cluster, driver monitoring systems, and LED matrix lighting.

They have increased CPU performance up to 50k DMIPS and 2GHz speeds. to help vehicle manufacturers navigate demands for continuous user experience, security, and safety improvements.

As applications such as augmented reality navigation and artificial intelligence (AI) -based digital automotive assistants grows, OEMs and Tier 1s need to balance the demand for larger, higher resolution displays and high performance chips with rising bill of material (BoM) costs and longer development times, explained Naoki Yoshida, vice president automotive digital products marketing at Renesas. The R-Car Gen3e devices provide a migration path and full compatibility with Renesas’ current R-Car Gen3 SoCs.

The six models that have been added to the R-Car Gen3e SoCs series are the R-Car D3e, R-Car E3e, R-Car M3Ne, R-Car M3e, R-Car H3Ne, and R-Car H3e.

All have increased CPU, with the R-Car M3Ne, R-Car M3e, and R-Car H3e operating up to 2GHz.

An on-chip real-time Arm Cortex R7 CPU eliminates the need for an external vehicle controller combined with a Renesas PMIC, which reduces BoM costs. Development times are also reduced with reference designs for fast boot, human machine interface (HMI) and functional safety.

Renesas offers board support packages updated with the latest versions of the Linux and Android operating systems.

Pre-integrated software enables higher application integration, for example for 2D/3D cluster HMI, welcome animation, rear-view camera, and surround view applications, explains Renesas.

VirtIO technology allows developers to easily add the reference solutions to existing applications without changing the existing Linux or Android application

The SoCs also supports ASIL-B system safety requirements for applications such as telltale monitoring and camera freeze detection, as well as for true hardware separation in non-hypervisor cockpits

The R-Car Consortium (RCC) partner ecosystem includes system integrators, middleware/application developers, and operating system and tools vendors, providing innovative solutions for the connected car, ADAS, and gateway markets that enable customers to reduce development time and accelerate time to market for new products.

The R-Car Gen3e SoCs are sampling now.

https://www.renesas.com

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Qi1.3 wireless charging reference design accelerates transmitter development

Following swiftly on the heels of the Wireless Power Consortium (WPC)’s Qi 1.3 specification, Microchip has released a compliant reference design. It includes everything needed to quickly develop a Qi 1.3-certified transmitter, says the company.

The Qi 1.3 specification requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet these requirements, Microchip’s wireless charging reference design includes the necessary tools and support for the seamless integration and certification of wireless charging systems in automotive and consumer applications.

The three-coil Qi 1.3 reference design integrates secure storage subsystem software with the wireless power microcontroller and enables custom topologies and foreign object detection (FOD) implementation.

Microchip is a regular member in the Wireless Power Consortium (WPC) and provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5.0W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

The reference design includes a Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. It also includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

The reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

Microchip’s dsPIC33C family of devices run the Qi application software and the company also offers the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority.

The Qi 1.3 wireless charging transmitter reference design is available for demonstrations and evaluations for qualified customers. The company will provide a license agreement to access the reference design software. Evaluation boards for these reference design will be available for purchase for qualified customers through Avnet in August 2021.

https://www.microchip.com   

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