Automotive Archives - Page 45 of 79 - SmartCitiesElectronics.com

Automotive gateway solution based on R-Car S4 SoCs and PMICs

Fri, Oct 08, 2021

An automotive gateway solution with R-Car S4 system on chips (SoCs) and power management ICs (PMICs) for next-generation vehicle computers, communication gateways, domain servers and application has been launched by Renesas. The new solution meets the automotive industry’s requirements for high performance, high-speed networking, high-security and high-functional safety levels that are required as E/E architectures evolve into domains and zones. The solution enables software reusability and includes the new best-in-class PMICs designed to work seamlessly with the R-Car S4.

The Renesas R-Car S4 is one of the first products in Renesas’ 4th-generation R-Car family. It includes multiple Arm Cortex A55, Cortex R52 and the company says it is the first to implement an RH850 MCU for control domain management. R-Car S4 SoCs offer automotive interfaces such as 16x CAN FD, 16x LIN, 8x SENT, 1x FlexRay, 4x PCIe V4.0 and also a high-bandwidth 3 x 2.5Gbit ethernet switch to enable rich communication and connectivity options inside and outside the vehicle.

This automotive solution means designers can re-use up to 88 per cent of software code developed for third generation R-Car SoC and RH850 MCU applications. The software package supports R-Car S4 application development including the real-time cores with various drivers and basic software such as Linux BSP and hypervisors. In addition, a virtual platform is available from a partner company enabling early software development and evaluation to help reduce design time and cost.

The new PMICs provide advanced power modes that support low power operation. The RAA271041 PMIC accepts the vehicle’s 12V supply and supports wide operation for load dump and cold cranking pulses while providing the first-stage regulation. The RAA271005 is a Safe 11-channel PMIC that takes the RAA271041’s output and steps it down further to the various supply voltages needed by R-Car S4 and its peripherals such as LPDDR4x memory. The RAA271041 and RAA271005 PMICs provide a complete power solution from vehicle battery down to system voltage.

For more information go to https://www.renesas.com/products/automotive-products

> Read More

i.MX 8XLite applications processor focus on secure V2X and industrial IoT applications

Fri, Oct 08, 2021

From NXP Semiconductors comes the release of the i.MX 8XLite applications processor focused on secure V2X and industrial Internet of Things (IoT) applications. The SoC features NXP’s integrated EdgeLock security and is targeted at meeting FIPS 140-3 while simultaneously executing complex cryptography and processing telematics data.

FIPS 140-3 is a US government security standard for cryptographic modules used in various applications, including V2X and critical infrastructure applications.

The applications processor offers carmakers the opportunity to expand V2X benefits to entry level vehicles. It enables fleet management for automated vehicles and, says NXP, reduces operational costs via enhanced traffic control, improved traffic flow and optimised path planning. Industrial IoT developers can leverage the SoC in secure wireless, Ethernet and control area networking applications such as industrial vehicle management, building control and safety systems, solar power generation, EV charging stations and access controllers.

The i.MX 8XLite SoC is a member of the i.MX 8 series of applications processors, purpose-built with a V2X accelerator, which can be leveraged as part of NXP’s RoadLink V2X solution or as a standalone accelerator. Its vehicle-to-infrastructure capability helps vehicles communicate with roads, bridges and roadside units to obtain information about road conditions ahead. Its car-to-car communication enables cars to communicate via wireless technologies such as IEEE® 802.11p, 5G and cellular, creating a network of similarly equipped vehicles to “see” further ahead.

“We believe road safety is for everyone, and it should scale across vehicles and devices,” said Dan Loop, general manager, automotive edge processing, NXP. “The i.MX 8XLite SoC offers the security and performance needed to expand the safety benefits of V2X into entry level vehicles and into exciting new realms of unmanned industrial delivery and drone applications.”

NXP Semiconductors is driving innovation in the automotive, industrial and IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 29,000 employees in more than 30 countries and posted revenue of $8.61 billion in 2020.

For more information go to http://nxp.com/iMX8XLite

> Read More

EasyPack 2B EDT2 power module for traction inverters up to 50 kW

Tue, Oct 05, 2021

Infineon Technologies has launched the automotive qualified EasyPack 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A RMS. The module is optimised for inverter applications in hybrid and electric vehicles.

With the introduction of the EDT2 (electric drive train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters.

The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip helps ensure significantly lower losses than current products on the market, says Infineon, and outperforms Infineon’s previous chip generation by 20 per cent.

Plug-and-play simplifies integration and compared to the classic through-hole discrete packages, as well as the HybridPack 1, there Is no longer a need to solder pins.

Infineon’s PressFIT contact technology enables a reduction in mounting time and the compact package size means three EasyPack 2Bs need 30 per cent less surface area than a HybridPack 1.

The EasyPack 2B EDT2 is fully qualified to the AQG324 standard.

Over the past 10 years, Infineon has sold more than 50 million EasyPack module with various chip sets for a range of industrial and automotive applications.

The new EasyPack 2B EDT2 module FF300R08W2P2_B11A will be available starting in this month.

For more information go to http://www.infineon.com/easyinverter

> Read More

LoRa may hold the key to zero carbon tracking technology

Wed, Sep 29, 2021

Maintenance-free, energy harvesting can be used for zero carbon asset management. Analogue and mixed-signal semiconductor company, Semtech,

Ryoden, a LoRa ecosystem and network provider have used the RE microcontroller family from Renesas to connect directly to the LoRa Cloud using Semtech’s LoRa Edge platform (LR1110).

LoRa Edge allows for geolocation capabilities driven by energy harvesting, the battery-free energy solution. It also has security features, making it suitable for tracking of personal valuables, transportation and logistics, animals, and healthcare equipment and assets.

Dr. Shiro Kamohara, senior principal specialist from Renesas’ low power product department, says: “The energy harvesting RE family represents the evolution of microcontroller products that have the advantages of being maintenance-free while keeping top-class efficiency. Through our collaboration with Semtech, we are able to offer a cost-efficient green energy solution for our customers.”

The energy-efficient RE family microcontroller is based on the Arm Cortex M0+. It has a built-in controller which can make a battery-less, maintenance-free product. It also has security capabilities that are critical to the IoT and can help protect IoT embedded devices from viral infections and eavesdropping.

When integrated with Semtech’s LR1110, the power consumption of the product is reduced, reports Semtech. Semtech’s LoRa device-to-Cloud platform enables the rapid development and deployment of low power, cost-efficient and long range IoT networks, gateways, sensors, module products, and IoT services worldwide. Semtech’s LoRa technology provides the communication layer for the LoRaWAN standard, which is maintained by the LoRa Alliance, an open IoT alliance for low power wide area network (LPWAN) applications that has been used to deploy IoT networks in over 100 countries. Semtech is a founding member of the LoRa Alliance.

“With the low power nature and end-to-end security of the LoRa Edge platform, the embedded LoRa Basics Modem-E native modem software operating on the LoRaWAN standard, and the LoRa Cloud geolocation and device and application services, the Renesas RE Family is one of the most power-efficient MCUs available on the market,” says Sree Durbha, director of product management in Semtech’s wireless and sensing products group.

Target applications for the LoRa Edge platform with Renesas RE include asset management, tracking of goods through the supply chain and several other use cases requiring continuous indoor or outdoor tracking.

Ryoden is a member of the Mitsubishi Electric Group and is a LPWAN (low power wide area network) communication carrier. It provides data communication services that utilise IoT devices. In addition, the company manages and operates network servers as a network service provider for LoRaWAN communications, and provides related applications and support services.

http://www.renesas.com

http://www.semtech.com

> Read More

Automotive gateway solution based on R-Car S4 SoCs and PMICs

i.MX 8XLite applications processor focus on secure V2X and industrial IoT applications

EasyPack 2B EDT2 power module for traction inverters up to 50 kW

LoRa may hold the key to zero carbon tracking technology

About Smart Cities