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Automotive wireless charging reference design is Qi 1.3-certified

Fri, Oct 22, 2021

Believed to be the first automotive wireless charging reference design to be certified by the Wireless Power Consortium for the new Qi 1.3 standard, NXP has released the Automotive 15W Wireless Charging Transmitter reference design.

It consists of a Qi-certified board with an NXP wireless charging MWCT microcontroller, as well as optional NFC, secure element and CAN / LIN transceiver. It also features a software package with NXP’s wireless charging Qi 1.3 software library and a suite of customisable software design to make it easier for developers to bring a Qi-certified wireless charger to market.

The Wireless Power Consortium’s Qi standard is used by most major smartphone manufacturers, including Apple, Samsung and Xiaomi. The Qi 1.3 standard includes new secure authentication features that verify if a smartphone or other wireless power device is Qi-certified and can reduce the wireless power transfer to lower levels if an uncertified device is detected. This ensures user safety and protects equipment from damage. It does, however, requires the addition of secure storage to the wireless power transmitter, addressed by NXP’s automotive-grade products.

Customers can use customise the wireless charging software library, based on the type of wireless charging application targeted. Design options include scaling designs from 5.0 to 15W and above with proprietary protocols, single or multi-coil chargers and across vehicles fleets.

NXP released pre-production details of the WCT-15WAUTO13 multi-coil transmitter reference platform, the first Qi 1.3-certified 15W reference design for in-vehicle wireless charging applications based on the NXP MWCT2xx3A controller IC family.

The system supports 40W power delivery to meet all customised fast charging requirements. It uses automotive-grade components and other automotive functions including EMC optimisation, safety features and MISRA C compliance software. It complies with the Wireless Power Consortium’s Qi v1.3 specification including authentication and is certified as an MP-A13 transmitter type.

http://www.NXP.com

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Microchip serves ISO 26262 functional safety packages for MCUs

Thu, Oct 21, 2021

To simplify the design of ASIL B and ASIL C safety applications using dsPIC, PIC18 and AVR microcontrollers, Microchip offers certified functional safety packages.

The certified functional safety packages enable automotive engineers to develop products as per the ISO 26262 functional safety standard. Microchip is releasing ISO 26262 functional safety packages for dsPIC33C digital signal controllers (DSCs), PIC18 and AVR microcontrollers (MCUs) to accelerate the development of safety-critical designs targeting ASIL B and ASIL C safety level and certification efforts.

The functional safety ecosystem for dsPIC33C DSCs includes AEC Q100 Grade 0-qualified functional safety ready dsPIC33C DSCs with dedicated hardware safety features. There are also SGS TÜV Saar-certified ASIL B-ready failure modes, an effects and diagnostic analysis (FMEDA) report and functional safety manual (FSM).

Designers can also access TÜV Rheinland-certified functional safety diagnostic libraries for designs targeting up to ASIL C and a functional safety reference application, showing the steps required to develop compliant designs, and the collateral that must be generated for (ASIL B or ASIL C) compliance

There are also various functional safety analysis reports and certification reports to assist compliance and certification.

For PIC18 and AVR MCUs, the functional safety ecosystem includes AEC Q100 Grade 1-qualified functional safety ready PIC18-Q84 MCUs with CAN FD and AVR DA MCUs with LIN interfaces and both with hardware support for capacitive touch sensors.

There is also the SGS TÜV Saar-certified ASIL B ready FMEDA report and FSM. In addition to functional safety diagnostic libraries, there are also ASIL B-ready certificates and certification reports.

Whether an engineer is new to ISO 26262 functional safety or a seasoned expert, Microchip says it is able to help them meet functional safety requirements and certify designs while minimising cost, risk and development time.

The functional safety packages, together with development tools (complete with the safety documents) allow engineers to develop compliant systems.

Microchip is offering three ISO 26262 functional safety packages to help customers with different levels of expertise and in different stages of their evaluation and design cycles.

The first is the functional safety basic package which offers basic resources like the ASIL B-ready certified FMEDA and safety manual to begin the evaluation of target functional safety levels and the design of safety-critical automotive applications.

Next is the functional safety starter package which offers ASIL B-ready certified FMEDA and safety manual, a reference application and ASIL C-compliant diagnostic libraries that help designers understand the ISO 26262-compliant development process and the reports that must be generated for compliance.

Thirdly, the functional safety full package is for beginners and seasoned experts to simplify the design and certification of safety-critical automotive applications. In addition to the offerings of the starter package, it includes certified diagnostic libraries with source code and the associated safety analysis reports for designs targeting up to ASIL C.

In addition to the functional safety packages, Microchip offers a TÜV SÜD-certified design tool package for its MPLAB development tools ecosystem. This includes a TÜV SÜD-certified MPLAB XC functional safety compiler with the TÜV SÜD certificate, a functional safety manual for the compiler along with safety plans and complete tools classification and qualification reports for the compiler, MPLAB X integrated development environment (IDE), MPLAB Code Coverage and all MPLAB development ecosystem programs. Microchip also offers functional safety-ready CAN FD and LIN transceivers and other companion devices, including voltage supervisor devices, which can be used with the functional safety ready DSCs and MCUs in a range of automotive applications.

The ISO 26262 functional safety ready dsPIC33C DSCs, and PIC18 and AVR MCUs are supported by the TÜV SÜD-certified MPLAB XC16 and MPLAB XC8 functional safety compilers (SW006022-FS and SW006021-FS), the MPLAB Code Coverage tool (SW006026-COV), MPLAB X IDE, MPLAB development ecosystem debugger/programmers and the safety documentation package to make the tool qualification effort easier.

http://www.microchip.com

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Vector releases tool to test ADAS sensor functions

Mon, Oct 18, 2021

Version 6 of DYNA4, the tool for virtual test driving has been released by Vector. DYNA4 R6 expands the possibilities for testing ADAS functions with improvements in the environment sensor models and the visualisation of scenarios. There are also new functions of the simulation standards ASAM OSI for sensor data communication and the road network ASAM OpenDrive.

The release’s DYNA4, the simulation environment for virtual test driving, has enhanced 3D visualisation and camera image generation to address real-time, close-to-reality modelling of the environment. The simulation facilitates the consistent use of physical lighting parameters in driving scenarios. This enables developers to test camera-based control systems in challenging lighting situations such as backlighting or strongly varying light intensities. Camera images are generated with a high dynamic range (HDR) and can then be arranged as Bayer matrix. DYNA4 additionally provides ASAM OSI ground truth information. The object information detected through image processing can be directly validated based on this information. The same applies to other sensor technologies, such as lidar, ultrasound or radar.

DYNA4 is based on simulation standards and includes a variety of interfaces to maximise the possibilities when using the virtual test drives in an existing tool infrastructure. Based on the use of the ASAM OSI standard in DYNA4, object-based sensors can transmit information as OSI messages. Other applications receive these data to process them. For example, CANoe, where the data is used for remaining bus simulation in HIL mode and displayed in the scene window. ASAM OSI considerably reduces the effort required to set up and maintain the interfaces between the simulation and the sensors or engine control units (ECU) functions

Through optimisation of the model structure, version 6 is more user-friendly in the consistent use from MIL, SIL to HIL, says Vector. The company has also worked to make it easier to integrate controller components into the virtual test vehicle. Different variants and development versions of a controller component can be exchanged with each other while the model interface remains constant, without the need for any further model changes. Furthermore, flexible access to signal and control variables in the model has been simplified allowing the user to manipulate them dynamically during a test run.

http://www.vector.com

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CC stepper motor driver IC does not need external sense resistor

Fri, Oct 15, 2021

Stepping motor driver ICs from Toshiba Electronics Europe now include the B67S539FTG. Housed in a 5.0 x 5.0mm QFN32 package, it operates without an external sense resistor and is integrated in the Stepper 17 Click board from Mikroe.

The TB67S539FTG is intended for a range of constant current (CC) control stepper motor applications including those found in office automation, commercial and industrial equipment. It can also be used in surveillance cameras and projectors.

The IC is based on Toshiba’s latest BiCD process and can drive bipolar stepping motors up to 40V and up to 2.0A. The integrated H-bridge circuit for motor control uses an Nch/Nch configuration and has a built-in charge pump circuit for output stage control.

The current detector is integrated within the QFN32 package, removing the need for an external current sense resistor. A capacitor for the charge pump is also integrated. The level of integration reduces the required PCB space significantly, says Toshiba.

The output stage (covering the upper and lower transistor) has an RDS(on) of just 0.8 Ohm. This ensures efficient operation and reduces heat generation during use. In sleep mode, the device draws a maximum current of 1.0 microA.

The IC is in mass production and shipping now. The compact Stepper 17 Click add-on board, created in partnership with Mikroe, is supported by a mikroSDK-compliant library.

Toshiba Electronics Europe is the European electronic components business of Toshiba Electronic Devices and Storage. TEE offers European consumers and businesses a variety of innovative hard disk drive (HDD) products and semiconductors for automotive, industrial, IoT, motion control, telecomms, networking, consumer and white goods applications. The company’s portfolio encompasses power semiconductors and other discrete devices ranging from diodes to logic ICs, optical semiconductors as well as microcontrollers and application specific standard products (ASSPs).

TEE has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom providing marketing, sales and logistics services.

http://www.toshiba.semicon-storage.com

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Automotive wireless charging reference design is Qi 1.3-certified

Microchip serves ISO 26262 functional safety packages for MCUs

Vector releases tool to test ADAS sensor functions

CC stepper motor driver IC does not need external sense resistor

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