Infineon announces advanced MEMS-based ultrasound transducer

Infineon has made significant progress in developing the technology for capacitive micromechanical ultrasonic transducers (CMUT). The technology enables the company to manufacture the first integrated one-chip solution for MEMS-based ultrasonic transducer that offers a smaller footprint, improved performance, and higher functionality. Such integration makes the new device ideal for developing new ultrasonic applications and improving existing applications in consumer electronics, the automotive industry, and medical technology.

Unlike conventional piezoelectric bulk materials, which rely on the deformation of the material itself, CMUT transmit and detect ultrasonic waves via the deflection of a micro-machined, semiconductor diaphragm. This principle, along with their compact size, low-power consumption, and high performance, enable the devices to enhance various ultrasound applications. Compared to a discrete solution, Infineon’s monolithic integration of MEMS and ASIC reduces the noise floor by 20 times and improve the absolute signal by 1000 times compared to conventional piezoelectric ceramics of a similar size. Leveraging its expertise in semiconductor design and manufacturing, Infineon can apply its advanced technology across a wide range of industries, from consumer electronics to medical devices.

Infineon’s CMUT technology enables solid-state touch buttons under any solid material, such as glass and even metal, without deforming the surface. This allows a more durable and reliable alternative to conventional mechanical buttons to be implemented, reducing the risk of wear and tear, and increasing the overall lifespan of devices. Compared to capacitive touch buttons, which can be affected by environmental factors such as humidity and temperature, CMUT-based touch buttons offer full water compatibility as well as high EMC robustness. Since the technology reduces the size of the buttons, they can be integrated into various devices, from smartphones to industrial control panels. Examples include touch buttons below the metal frame of a mobile phone or replacing car door handles for a neat design.

Several home appliance devices can profit from Infineon’s CMUT as soon as they require liquid level sensing. CMUT offer several advantages, including continuous fill level measurement, low power consumption, and easy, non-invasive mounting below the bottom of the tank. The latter is important to measure, e.g., chemicals in washing machines or dish washers, where contact electrodes are at risk to corrode.

The CMUT technology can also be used to develop innovative medical devices that utilise ultrasound technology, such as wearable devices for vital signs monitoring, health tracking, and non-invasive medical diagnostics. Leveraging CMUT technology, the devices provide continuous monitoring and feedback rather than a single measurement, which can detect potential health issues earlier and improve patient outcome. With their compact size and low-power requirements, they are ideal for wearable and point-of-care applications.

https://www.infineon.com/

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Rohm develops a 1kW class high power infrared laser diode

Rohm has developed a high output laser diode – RLD8BQAB3 – for use in ADAS (Advanced Driver Assistance Systems) equipped with LiDAR for distance measurement and spatial recognition. Rohm will initially start supplying samples targeting consumer and industrial applications such as drones, robot vacuum cleaners, AGVs (Automated Guided Vehicles), and service robots.

LiDAR is seeing growing adoption in recent years across a variety of applications that require automation such as automotive ADAS, AGVs, drones, and robot vacuums, facilitating precise distance measurement and spatial recognition. To detect information at greater distances with more accuracy, there is a need for laser diodes that serve as light sources to achieve high kW-level output while allowing multiple light sources to emit light at close intervals.

Rohm has established proprietary patented technology that achieves the narrow emission width of lasers, enhancing the long-distance, high accuracy LiDAR, beginning with the commercialisation of the 25W output RLD90QZW5 in 2019 and high-power 120W RLD90QZW8 in 2023. Building on these successes they have developed a new 125W 8ch (1kW class) array-type product that meets the demand for a high output, high performance laser diode.

The RLD8BQAB3 is an ultra-compact surface mount high-output 125W × 8ch infrared laser diode for LiDAR applications that utilise 3D ToF systems to carry out distance measurement and spatial recognition. The optimised design features 8 emission areas (each 300µm wide) per element, installed on a submount affixed to a high heat dissipation substrate.

The package’s emitting surface incorporates a clear glass cap – an industry first for a surface mount laser diode – eliminating the risk of light scattering caused by scratches during dicing that tends to occur with resin-encapsulated products, ensuring high beam quality. Each emission area is wired with a common cathode, enabling the selection of the irradiation method based on application needs – ranging from individual emission that increases the number of light-emitting points to industry-leading* simultaneous emission at ultra-high outputs of 1kW class.

The new product retains the key features of Rohm’s conventional laser diodes, including uniform emission intensity across the emission width along with a low wavelength temperature dependence of 0.1nm/°C (vs 0.26 to 0.28nm/°C for standard products). On top, the array configuration narrows the regions of reduced emission intensity between channels, while the bandpass filter minimises the effects of ambient light noise from the sun and other sources, contributing to long-distance detection and high-definition LiDAR.

https://www.rohm.com

 

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New edge AI-enabled radar sensor and automotive audio processors from TI

Texas Instruments has introduced new integrated automotive chips to enable safer, more immersive driving experiences at any vehicle price point. TI’s AWRL6844 60GHz mmWave radar sensor supports occupancy monitoring for seat belt reminder systems, child presence detection and intrusion detection with a single chip running edge AI algorithms, enabling a safer driving environment. With TI’s next-generation audio DSP core, the AM275x-Q1 MCUs and AM62D-Q1 processors make premium audio features more affordable. Paired with TI’s latest analog products, including the TAS6754-Q1 Class-D audio amplifier, engineers can take advantage of a complete audio amplifier system offering.

Original equipment manufacturers (OEMs) are gradually designing in more sensors to enhance the in-vehicle experience and meet evolving safety standards. TI’s edge AI-enabled AWRL6844 60GHz mmWave radar sensor enables engineers to incorporate three in-cabin sensing features to replace multiple sensor technologies, such as in-seat weight mats and ultrasonic sensors, lowering total implementation costs by an average of US$20 per vehicle.

The AWRL6844 integrates four transmitters and four receivers, enabling high-resolution sensing data at an optimised cost for OEMs. This data feeds into application-specific AI-driven algorithms on a customisable on-chip hardware accelerator and DSP, improving decision-making accuracy and reducing processing time. The edge intelligence capabilities of the AWRL6844 sensor that help improve the driving experience include these examples:

• While driving, it supports occupant detection and localisation with 98% accuracy to enable seat belt reminders.
• After parking, it monitors for unattended children in the vehicle, using neural networks that detect micro-movements in real time with over 90% classification accuracy. This direct sensing capability enables OEMs to meet 2025 European New Car Assessment Program (Euro NCAP) design requirements.
• When parked, it adapts to different environments through intelligent scanning, reducing false intrusion detection alerts caused by car shaking and external movement.

As driver expectations grow for elevated in-cabin experiences across vehicle models, OEMs aim to offer premium audio while minimising design complexity and system cost. AM275x-Q1 MCUs and AM62D-Q1 processors reduce the number of components required for an automotive audio amplifier system by integrating TI’s vector-based C7x DSP core, Arm cores, memory, audio networking and a hardware security module into a single, functional safety-capable SoC. The C7x core, coupled with a matrix multiply accelerator, together form a neural processing unit that processes both traditional and edge AI-based audio algorithms. These automotive audio SoCs are scalable, allowing designers to meet memory and performance needs, from entry-level to high-end systems, with minimal redesign and investment.

TI’s next-generation C7x DSP core achieves more than four times the processing performance of other audio DSPs, allowing audio engineers to manage multiple features within a single core. AM275x-Q1 MCUs and AM62D-Q1 processors enable immersive audio inside the cabin with features such as spatial audio, active noise cancellation, sound synthesis and advanced vehicle networking, including Audio Video Bridging over Ethernet.

To further optimise their automotive audio designs, engineers can use TI’s TAS6754-Q1 audio amplifier with innovative 1L modulation technology to deliver class-leading audio performance and power consumption, with half the number of inductors compared to existing Class-D amplifiers. The TAS67xx-Q1 family of devices, which integrates real-time load diagnostics required by OEMs, helps engineers simplify designs, decrease costs, and increase efficiency without sacrificing audio quality.

https://www.TI.com

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Integrated and Compact CAN FD system basis chip solution from Microchip

The increase in connected applications in the automotive and industrial markets is driving demand for wired connectivity solutions with higher bandwidth, lower latency and enhanced security. Reliable and secure communication networking solutions are vital for transmitting and processing data as intended. Microchip has announced the new family of ATA650x CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5V Low-Drop Voltage Regulator (LDO) available in compact 8-, 10- and 14-pin space-saving packages.

The ATA650x CAN FD SBCs offer a tiny footprint of 2 mm × 3 mm for the VDFN8 package, 3 mm × 3 mm for the VDFN10 package and 3 mm × 4.5 mm for the VDFN14 package. With a built-in high-speed CAN FD transceiver, the SBCs support data transmit and receive rates of up to 5 Mbps.

A solution for space and power-constrained applications, these SBCs exhibit very low power consumption, with a typical sleep current of just 15 μA. The ATA650x SBCs enable control of the VCC supply voltage by the bus signals, which reduces the current consumption of automotive Electronic Control Units (ECUs). To further reduce power consumption, the SBCs can disable the microcontroller supply by switching off LDOs during sleep mode.

The safety features available in the ATA650x device include fail safe, protection and diagnostic functions to provide reliable bus communication in advanced networks. Designed to withstand Electrostatic Discharge (ESD) and equipped with Electromagnetic Compatibility (EMC) performance, the ATA650x devices are robust solutions for applications operating in harsh environments.

The integrated SBC solution is Functional Safety ready to help customers achieve an ISO 26262 safety certification or the desired ASIL level. Additionally, the SBCs are AEC-Q100 qualified with a Grade 0 rating and are designed to operate in temperatures ranging from −40°C to +150°C.

https://www.microchip.com

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