Smart mobility computing operates in automotive temperature range

Vehicle computing technology for smart mobility has been introduced by congatec, at Intertraffic Amsterdam (29 March – 01 April).

The rugged vehicle computing platforms are designed to simplify and accelerate digitisation and autonomous driving in harsh environments such as transportation, logistics, construction, and agriculture. The computing platforms target the next generation of real-time 5G connected, unmanned, functionally safe vehicles and systems designed for digitising the mobility kinematics of existing fleets. The goal is to provide accurate orientation data to improve situational awareness and to optimise the movement and operation of autonomous vehicles, said congatec.

Mobility OEMs and their Tier 1 suppliers must tackle a variety of tasks when designing the next generation of smart autonomous mobility controllers, advised congatec. The first is to integrate vision and other sensors for gathering situational raw data, and to implement data pre-processing and AI to improve data analytics. They also need to design controller logic for autonomous vehicle movement and operation. In addition, the systems need 5G network sliced device connectivity for vehicle-to-vehicle (V2V) and vehicle-to-everything (V2X) communication. An added complication is that all of this needs to be implemented with real-time capabilities and functional safety. 

One focus for congatec at Intertraffic Amsterdam, will be the Intel Xeon D processor-based COM-HPC server modules for edge servers in autonomous railway applications and 5G wayside equipment. Another is the 12th Gen Intel Core processor-based COM‑HPC client and COM Express modules for smart vehicle gateways and vehicle network controllers. There is also an application-ready, Intel Atom processor-based, real time kinematic platform by congatec’s partner Etteplan.

This is based on congatec Computer-on-Modules and features an RTK-enabled GNSS unit with accelerometer, gyroscope and magnetometer. It is designed for automotive voltage ranges up to 36V. It supports a wide operating temperature range of -40 to +85 degreesC and provides IP65 / IP67 protection. 

For vehicle communication network connectivity, it offers extensions for real-time Ethernet (TSN), RS232, RS485 and CAN. Further edge connectivity options include Wi-Fi and Bluetooth as well as LTE/5G. There are also ambient pressure, humidity and temperature sensors.

The platform is available as a prototype that can be ordered immediately for engineering purposes. For larger quantities, customisation is possible on a project basis. The standard system platform is scheduled to go into series production in the second half of 2022.

http://www.congatec.com 

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Kioxia samples universal flash storage for automotive designs

Automotive universal flash storage (UFS) version 3.1 embedded flash memory devices have been introduced by Kioxia Europe. The UFS has a serial interface allowing it to support full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

The UFS memory devices are based on the company’s BiCS Flash 3D flash memory and are available in a range of capacities from 64 to 512Gbyte. They are, says the company, designed to support the requirements of evolving automotive applications for driver experiences.

Storage requirements for automotive applications continue to increase as infotainment systems and advanced driver assistance systems (ADAS) become more sophisticated, explained Axel Störmann, vice president Memory Marketing & Engineering, Kioxia Europe.

The latest UFS memories support a wide temperature range of -40 to +105 degrees C and meet AEC-Q100 Grade 2 requirements.

Both the sequential read and sequential write performance of the Automotive UFS Version 3.1 device are improved by approximately 2.2x and 6x, respectively, compared with the previous generation devices. These performance gains contribute to faster system start-up and OTA (over the air) updates, added Kioxia.

Sample shipments of the 256, 128 and 64Gbyte devices will start today, with the 512Gbyte devices to ship in April. 

Read and write speeds are the best values obtained in a specific test environment at Kioxia. Read and write speeds may vary depending on the device used and file size read or written, cautioned the company.

Kioxia Europe (formerly Toshiba Memory Europe) is the European-based subsidiary of Kioxia, a supplier of flash memory and solid-state drives (SSDs). Kioxia can trace its expertise from the invention of flash memory to today’s breakthrough BiCS Flash. The company’s innovative 3D flash memory technology, BiCS Flash, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centres. 

http://www.kioxia.com 

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R-Car V4H SoC achieves deep learning for automated driving

For central processing in advanced driver assistance systems (ADAS) and automated driving systems, the R-Car V4H SoC achieves deep learning up to to 34 tera operations per second (TOPS). This equips it for high speed image recognition and processing surrounding objects using automotive cameras, radar and lidar, said Renesas Electronics.

The R-Car V4H allows customers to develop cost-competitive, single-chip, ADAS electric control units (ECUs), said Renesas. It combines IP and hardware optimisation, to support driving systems appropriate for automated driving levels 2+ and 3, which are responsible for managing the highest volume of processing, including full NCAP 2025 support. The R-Car V4H also supports surround view and automatic parking functions with 3D visualisation effects such as realistic rendering.

The SoC development process targets ASIL D systematic capability for all safety relevant IP for ISO 26262 functional safety. The signal processing portion of the R-Car V4H is expected to achieve ASIL B and D metrics for the real time domain.

Renesas provides a dedicated power management for the R-Car V4H based around the RAA271041 pre-regulator and the RAA271005 power management IC (PMIC). This enables a power supply for the R-Car V4H and peripheral memories from the 12V supply of the vehicle battery at low power operation while targeting ASIL D compliance for systematic and random hardware faults with a low bill of materials cost, confirmed Renesas.

An R-Car V4H software development kit (SDK) is available for initial device evaluation, and software development including deep learning. The SDK offers full functionality for machine learning development, and optimisation of embedded systems for performance, power efficiency, and functional safety. Complete simulation models are available. The software is operating system-agnostic, pointed out Renesas. When developing from scratch, Fixstars’ Genesis platform enables engineers to evaluate R-Car from anywhere via their cloud solution and can provide CNN benchmark results.

The SoC has four Arm Cortex-A76 cores operating at 1.8Ghz for a total of 49kDMIPS of general compute, three lockstep Arm Cortex-R52 cores at 1.4Ghz, for a total of 9kDMIPS to support ASIL D real time operation and eliminate the need for external microcontrollers. There is also dedicated deep learning and computer vision IP, and image signal processor (ISP) with parallel processing for machine and human vision, image renderer (IMR) for fisheye distortion correction or other mathematical operation and an AXM-8-256 GPU operating at 600MHz, for a total of over 150 GFLOPS. There are also dedicated automotive interfaces (CAN, Ethernet AVB, TSN and FlexRay) and two fourth generation PCIe interfaces.

Samples of the R-Car V4H SoC are available now, with mass production scheduled for the second quarter of 2024.

http://www.renesas.com

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Automotive 750V EDT2 IGBTs are in a TO247PLUS package

IGBTs optimised for automotive discrete traction inverters have been added to Infineon’s portfolio of discrete high voltage devices for automotive applications. The EDT2 IGBTs are supplied in a TO247Plus package.

The AIKQ120N75CP2 and the AIKQ200N75CP2 IGBTs meet and exceed the industry standard AECQ101 for automotive components. As a result, the devices can significantly increase the performance and reliability of inverter systems, said Infineon. They use the automotive micro-pattern trench field stop cell design technology that has already been used in other inverter modules from the company, such as the EasyPack 2B EDT2 and the HybridPack.

EDT2 technology has a breakdown voltage of 750V, supporting battery voltages up to 470V DC. The rated currents of the discrete EDT2 IGBTs are 120 and 200A at 100 degrees C, each with a very low forward voltage, reducing conduction losses by up to 13 per cent compared to the previous generation. With a rated current of 200A, the AIKQ200N75CP2 is claimed to be the best-in-class discrete IGBT in a TO247Plus package. Thus, for a defined target power class, fewer devices are needed in parallel.

The EDT2 IGBTs also feature an extremely narrow parameter distribution. The collector-emitter saturation voltage (V ce(sat)) difference between typical and maximum values is less than 200mV and the gate threshold voltage (V GEth) difference is less than 750mV. The thermal coefficient is positive. These characteristics combine to enable easy parallel operation and power scalability for final designs. Moreover, the IGBTs offer smooth switching performance, low gate charge (Q G) and a high junction temperature (T vjop) of 175 degrees C.

The AIKQ120N75CP2 and the AIKQ200N75CP2 are available now.

https://www.infineon.com

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