Common source dual GaN FET is AEC-qualified for lidar systems

The latest addition to Efficient Power Conversion (EPC)’s family of automotive qualified transistors and ICs is small enough for time-of-flight (ToF) lidar applications including robotics, drones, 3D sensing and autonomous cars.

The EPC2221 is a common source dual GaN FET rated at 100V, 58 mOhm and 20A pulsed current. The FET can be also be used in surveillance systems and vacuum cleaners.

The low inductance and capacitance of the EPC2221 allows fast switching (100MHz) and narrow pulse widths (two nanoseconds) for high resolution and high efficiency.  Additionally, the small size (1.35 x 1.35mm) reduces PCB cost and total solution size, says EPC. 

This latest member of EPC’s family of GaN transistors and ICs designed to meet the performance and reliability standards of demanding automotive applications has completed AEC Q101 qualification testing including humidity testing with bias (H3TRB), high temperature reverse bias (HTRB), high temperature gate bias (HTGB), and temperature cycling (TC). 

In addition to lidar in automotive applications, the EPC2221 is suited to high-frequency DC/DC conversion, wireless power applications and synchronous rectification.

Alex Lidow, CEO and co-founder of EPC, believes this IC “improves the performance while reducing size and cost for time-of-flight lidar systems.”

The EPC2221 is available for immediate delivery from Digi-Key Electronics. 

Designers interested in replacing silicon MOSFETs with a GaN device can use the EPC GaN Power Bench’s cross reference tool to find a suggested replacement based on operating conditions.  

EPC specialises in enhancement mode GaN-based power management. The company says eGaN FETs and ICs provide performance many times greater than the best silicon power MOSFETs in applications such as DC/DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, and drones and low-cost satellites

EPC will be at PCIM Europe (10–12 May 2022) Hall 9 – Stand 113

http://www.epc-co.com

> Read More

Tasking extends the VX-toolset for Arm with Traveo T2G support

Version 6.0r1 of the VX-Toolset compiler toolchain for Arm Cortex-M also supports Infineon’s Traveo T2G microcontroller family. 

The Traveo T2G microcontroller family is based on Arm’s Cortex-M4 / Cortex-M7. Infineon and Tasking have worked on software development tools for TriCore/Aurix (TC2x, TC3x and TC4x) and now with support for the Traveo T2G family, Tasking offers toolchains for Infineon’s entire microcontroller portfolio. Having compilers for both Traveo T2G and Aurix available from a single tool partner simplifies the work of users who use both microcontrollers. 

The VX-Toolset for Arm Cortex-M is qualified according to ISO 26262 up to ASIL D. TÜV certification is planned for this year. 

Tasking supplies a safety manual with the toolchain. As long as users follow the recommendations described there, they can use the toolchain for the development of safety-critical applications up to ASIL D without any further qualification measures, advises the company. This significantly simplifies and accelerates the certification of the system and reduces costs for the customer, says Tasking.

The VX-toolset for Arm Cortex-M v6.0r1 is available immediately. 

Tasking Germany specialises in providing embedded software development tools. The company is headquartered in Munich, Germany. Tasking development tools are used by automotive manufacturers and the world’s largest Tier 1 supplier to realise high-performance applications in safety critical areas. The tools are used to develop the latest applications to optimum reliability, functional safety and performance standards.

http://www.tasking.com

> Read More

Modular LeddarEngine software accelerates ADAS and AD sensor development

LeddarTech has revised its LCA3 SoC and modular software to reduce development time for ADAS (advanced driving assistance system) and autonomous driving sensing technology.

The LeddarEngine software sets a new standard for developing highly integrated and flexible solid state lidar solutions optimised for high-volume production, says LeddarTech. It comprises the LeddarCore LCA3 SoC and LeddarSP signal processing.

It introduces several new integration tiers for the LeddarEngine software and compatibility with new hardware platforms. LeddarTech introduces a separation of the control, signal processing and point-cloud processing, which can be used independently or in combination, for customers to maintain greater control over the final sensing systems.

Lidar developers that have signal processing toolchains implemented for their current products will benefit from using only the control kernel for easier and faster integration of the LeddarCore into products. The software is suitable for Tier 1-2s, system integrators and new lidar makers leveraging LeddarTech’s proprietary signal processing and expertise.

This version of the LeddarEngine is compatible with Xilinx Zynq UltraScale+ MPSoC, in and the Renesas R-Car SoC. The modular architecture improves the separation of hardware and software making it easier to port to other platforms and operating systems.

Founded in 2007, LeddarTech is a comprehensive end-to-end environmental sensing company that enables customers to solve critical sensing, fusion and perception challenges across the entire value chain. LeddarTech provides cost-effective perception solutions scalable from Level 2+ ADAS to Level 5 full autonomy with LeddarVision, a raw-data sensor fusion and perception platform that generates a comprehensive 3D environmental model from a variety of sensor types and configurations. 

LeddarTech also supports lidar manufacturers and Tier 1-2 automotive suppliers with  technology building blocks such as LeddarSteer digital beam steering and the lidar XLRator, a development solution for automotive-grade solid-state lidars based on the LeddarEngine and core components from global semiconductor partners. 

The company is responsible for several innovations in automotive and mobility remote-sensing applications, with over 100 patented technologies (granted or pending) enhancing ADAS and autonomous driving capabilities.

http://www.leddartech.com 

> Read More

Virtual development environment for accelerates automotive development

A virtual development environment announced by Renesas Electronics enables  development and operational evaluation of automotive application software to support the latest requirements of electrical/electronic architecture (E/E architecture). 

The environment includes a virtual turnkey platform, which allows engineers to develop application software before devices or evaluation boards are available. There is also a multi-core debug and trace tool, which enables users to analyse and evaluate software as if running on an actual chip. 

“With the evolution of E/E architecture, there is an increasing demand for software design that can maximise performance at a system level,” explains Hiroshi Kawaguchi, vice president, Automotive Software Development division at Renesas. At the same time, the increasing time and cost associated with software development have become a big challenge. “Our integrated software development environment that can be used across gateway systems, ADAS, and xEV development, enables customers to benefit from the scalability of Renesas products such as R-Car and the RH850 family for both software and hardware development.”

 The virtual turnkey platform application software development environment consists of the R-Car Virtual Platform (R-Car VPF) development environment and a software development kit (R-Car SDK) that includes pre-tested software libraries and sample code. R-Car VPF is based on Virtualizer Development Kits (VDKs) from Synopsys, and integrates virtual models of IP specific to R-Car to customise for R-Car devices. By overlaying the R-Car SDK engineers can immediately start development of application software virtually. The platform accurately recreates the behaviour of the chip and eliminates the need to build up a development environment with a physical evaluation board. Multiple users can also develop software simultaneously on separate PCs or servers.

The next step is to integrate the software and verify that it runs on a single chip. Software components share resources such as the multiple CPUs and IPs on R-Car SoCs. If operational problems are detected after the software components are integrated, it requires a tremendous amount of work to analyse and solve them, explains Renesas. The Multicore Debug and Trace tool analyses and identifies the causes of errors occurring from the interaction of the multiple hardware resources in R-Car SoCs. This enables synchronous and simultaneous debugging of the entire heterogeneous architecture of R-Car without using the actual device.

The development environment is available for the R-Car S4 SoC for automotive gateways. Renesas has plans to support the R-Car V4H as well as future versions of R-Car products and RH850 automotive MCUs.

https://www.renesas.com

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration