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Two automotive processors from NXP deliver GHz speeds

Wed, Jun 22, 2022

NXP Semiconductors has launched two processor families that extend its S32 automotive platform with high-performance real-time processing.

The S32Z processors can be used for safety processing and domain and zonal control, while the S32E processors are for electric vehicle (xEV) control and smart actuation. The software-compatible S32Z and S32E processors help enable software-defined vehicles, reduce software integration complexity and enhance security and safety, said the company.

These processors feature the critical deterministic behaviour of safe MCUs, but combine gigahertz speed, multi-application isolation and memory expansion. They are suitable for the safe integration of cross domain vehicle functions for software-defined vehicles and are scalable, 16nm S32Z and S32E processor families with a roadmap to 5nm solutions.

Domain and zonal architectures enable carmakers to optimise wiring harnesses, reduce cost and weight, and implement a more scalable and cost-effective, software-centric approach for developing and updating intelligent vehicles. This transformation requires processors that offer higher performance, application isolation and memory expansion.

Robert Bosch GmbH was a key partner in the collaborative design process.

“We collaborated closely with NXP on the two new processor families,” said Axel Aue, vice president of engineering at Bosch. “The S32Z and S32E processors offer a performance increase of a factor of two compared to embedded NVM MCUs, key integration platform features and scalable memory with LPDDR4 DRAM and flash. It’s also ideal for embedded integration and allows the consolidation and isolation of vehicle functions with very high performance that previously required multiple MCUs.”

NXP’s S32Z and S32E processors offer eight Arm Cortex-R52 processor cores with split-lock support that operate at up to 1GHz to address safely integrating deterministic, high-performance real-time applications. The processors isolate independent real-time applications with “core-to-pin” hardware virtualisation and resource firewalls for freedom of interference.

The processors come with up to 64Mbyte of integrated flash memory for large, zero-downtime over-the-air (OTA) updates and support LPDDR4 DRAM and flash expansion memory with execute-in-place (XiP) mode for large applications and Autosar adaptive applications. A communications accelerator (FlexLLCE) supporting 24 CAN interfaces, along with a Gigabit Ethernet switch supporting time sensitive networking (TSN), provides vehicle data to “virtual ECUs” to improve efficiency and streamline software development, said the company.

A hardware security engine (HSE) supports secure boot, accelerated security services and key management. The S32Z and S32E processors are certified to ISO/SAE 21434 for cybersecurity and ISO 26262 for Asil D functional safety.

The S32E processors add smart actuation capabilities, specifically in the form of advanced timers and high resolution ADC and 5V analogue and I/Os, for xEV integration applications with direct-drive motor control.

The S32Z and S32E processors enable OEMs and tier ones to develop a wide range of new vehicle architectures with diverse real-time processing needs.

NXP offers system support for S32Z and S32E processors to accelerate customer designs, including the co-developed FS86 Asil D safety system basis chip (SBC) and PF5030 power management IC (PMIC) with enhanced safety features and in-vehicle networking support with Ethernet switches and PHYs and CAN transceivers, along with other analogue companion chips, such as the GD3160 IGBT/SiC high-voltage inverter gate driver and MC3377x battery cell controllers.

Silicon evaluation, software development and rapid prototyping can be accelerated using the GreenVIP vehicle integration platform software with the GreenBox 3 development platform, supported by software and tools, claimed NXP. NXP will present a technical paper on “Key Technologies for Enablement of Multi-Core, Real-Time Domain Controllers” and showcase the S32E processor in action with a “Safe Multi-ECU Integration” demonstration focused on multi-core performance and fault-tolerance at Embedded World (21-23 June) in Nuremberg, Germany, at Hall 4A-222.

http://www.nxp.com

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3D image sensor is ISO26262-compliant

Fri, Jun 10, 2022

3D image sensors can differentiate a vehicle’s dashboard, and monitoring systems, said Infineon, as it introduced the ISO26262-compliant, high resolution 3D image sensor. It has developed in collaboration with 3D time-of-flight system specialist pmdtechnologies and is the second generation of the REAL3 automotive image sensor, the IRS2877A.

“We are now offering high resolution with a tiny image circle to the automotive world,” said Christian Herzum, vice president 3D Sensing at Infineon. “This enables cars with functions from the consumer world, while maintaining automotive standards and even improving passive safety,” he added. It can be used to integrate secure facial authentication for seamless connectivity for any type of service that requires authentication such as payment, battery charging or accessing private data.

In addition, the same camera meets all requirements for driver monitoring to detect driver distraction and fatigue. This enables a driver monitoring system with secure 3D facial recognition using only one time of flight (ToF) camera.

“From the start we were focussed on improving the robustness of the underlying pmd-based ToF technology against external influences such as sunlight or other disturbing light sources. For this reason, the new imager shows excellent and cutting edge performance even under harsh conditions”, said Bernd Buxbaum, CEO pmdtechnologies.

The REAL3 sensor is in a 9.0 x 9.0mm² plastic BGA package and offers a VGA system resolution of 640 x 480 pixels with an image circle of 4.0mm. This allows lens sizes similar to those on smartphones to be used for automotive applications.

The high resolution of the REAL3 sensor also makes it suitable for camera applications with a wide field of view, such as complete front-row occupant monitoring systems. The 3D body models enable accurate estimates of occupant size and weight, as well as precise passenger and seat position data. These figures are required for intelligent airbag deployment and restraint systems.

The latest REAL3 sensor is qualified to AEC-Q100 Grade 2 and is the first of its kind being developed according to the ISO26262 (ASIL-B) standard, claimed Infineon.

3D data also allows for comfort features such as gesture control or intuitive interior lighting that follows passengers’ movements. The imager may also be used in environmental perception scenarios as a flash-lidar.

In addition to automotive designs, it may also find applications in mobile robotics, drones and other autonomous use cases for operator safety.

Development samples of the new 3D image sensor chip (IRS2877A) are available now and series production has begun. The ISO26262 compliant variant IRS2877AS will be available for series production by the end of 2022.

http://www.infineon.com

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Microchip offers ISO 26262-compliant, AUTOSAR-ready DSCs

Tue, Jun 07, 2022

Digital signal controllers (DSCs) from Microchip Technology support AUTOSAR, OS, MCAL drivers and functional safety for automotive designs.

The addition to Microchip’s dsPIC33C DSCs portfolio, is the ISO 26262-compliant dsPIC33CK1024MP7xx family. The latest DSCs cover the large memory segment with 1Mbyte flash to enable applications running automotive software like AUTOSAR, OS, MCAL drivers, ISO 26262 functional safety diagnostics and security libraries. The dsPIC33 DSCs also includes a central processing unit (CPU) with deterministic response and specialised peripherals for general automotive, advanced sensing and control, digital power and motor control applications.

The dsPIC33C DSCs enable accelerated development and a high level of system optimisation while reducing total system cost, claimed Microchip. They have been developed in response to OEMs experiencing increasing application complexity and the need for AUTOSAR, ISO 26262 functional safety-compliant and secure solutions for electric and autonomous vehicles.

“The AUTOSAR-ready dsPIC33C DSCs enable designers to achieve a high level of system optimisation by implementing AUTOSAR-based applications, functional safety goals and security use cases in a single microcontroller while meeting robust automotive application requirements,” said Joe Thomsen, vice president of the MCU16 business unit at Microchip Technology.

By adopting AUTOSAR-ready devices, designers can improve risk and complexity management while decreasing development time through reusability. Customers who have previously designed bare metal or non-AUTOSAR automotive applications and are now adopting AUTOSAR can scale up by staying within the dsPIC33C DSC ecosystem, pointed out the company. The AUTOSAR ecosystem for the dsPIC33C DSCs includes MICROSAR Classic from Vector, KSAR OS from KPIT Technologies and ASPICE- and ASIL B-compliant MCAL drivers from Microchip.

Microchip has expanded its functional safety packages that include FMEDA reports, safety manuals and diagnostic libraries to cover the ISO 26262-compliant dsPIC33CK1024MP7xx DSCs. These AUTOSAR-ready dsPIC33C DSCs, used together with Microchip’s TA100 CryptoAutomotive security ICs, enable the implementation of robust security in automotive designs.

Software and tools from Microchip Technology include certified MPLAB XC16 compiler functional safety licenses, MPLAB X IDE (integrated development environment), MPLAB Code Configurator (MCC), programming and debugging tools for dsPIC33C DSCs, ISO 26262- and ASPICE-compliant MCAL drivers for dsPIC33C DSCs, ISO 26262 functional safety packages for dsPIC33C DSCs and software libraries and reference code for security use cases. Third-party software includes MICROSAR Classic from Vector and KSAR OS from KPIT Technologies. Third-party hardware tools include TRACE32 debugger from Lauterbach.

http://www.microchip.com

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Low voltage 3A buck converter provides wide input range for vehicle interiors

Tue, May 17, 2022

Automotive-compliant synchronous buck converters announced by Diodes are intended for high power density automotive designs, for example in vehicle telematics, ADAS, power and infotainment systems and instrumentation clusters.

The AP61300Q and AP61302Q synchronous buck converters are 3A-rated and have a wide input voltage range of 2.4 to 5.5V.

Incorporated into each buck converter is a 70mOhm, high side power MOSFET and a 50mOhm low side power MOSFET. Together, said Diodes, they deliver high efficiency step down DC/DC conversion. They also support fast switching speeds allowing smaller accompanying passives to be specified, reducing the overall bill of materials (BoM) and saving space, confirmed the company.

Depending on the load conditions, the AP61300Q and AP61302Q can be configured to pulse frequency modulation (PFM) or pulse width modulation (PWM) operating modes (using the enable pin). The quiescent current (IQ) of 19 microA, when in PFM mode, allows them to maintain elevated efficiencies even in light load situations. The low drop out (LDO) mode permits output voltage regulation to be maintained when the input voltage comes close to the V out voltage.

The constant on-time (COT) control functionality of both the AP61300Q and AP61302Q feature, rapid transient response, easy loop stabilisation and low output voltage ripple with only minimal external components required. Diodes explained that less PCB area is needed which contributes to a reduction in overall production costs.

The AP61300Q and AP61302Q are supplied in SOT563 packages. Both are AEC-Q100 Grade 1 qualified, PPAP-capable and manufactured in IATF 16949-certified facilities.

Diodes supplies semiconductor products to customers in the consumer electronics, computing, communications, industrial and automotive markets. Its portfolio includes discrete, analogue and mixed-signal products together with packaging technology to meet customers’ needs. The company has a broad range of application-specific products, sales teams and operations in 31 sites around the world, including engineering, testing, manufacturing, and customer services.

http://www.diodes.com

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Two automotive processors from NXP deliver GHz speeds

3D image sensor is ISO26262-compliant

Microchip offers ISO 26262-compliant, AUTOSAR-ready DSCs

Low voltage 3A buck converter provides wide input range for vehicle interiors

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