AMD and ECARX collaborate on immersive cockpit in-vehicle computing

AMD and mobility technology company, Ecarx, will work together on an in-vehicle computing platform for electric vehicles (EVs), expected to be in mass production in late 2023. The Ecarx digital cockpit in-vehicle platform will be offered with AMD Ryzen Embedded V2000 processors and AMD Radeon RX 6000 Series GPUs (graphic processor units) and Ecarx hardware and software. 

The digital cockpit’s features will include driver information mode, heads-up display, rear seat entertainment, multiple-displays, multi-zone voice recognition, gaming and a 3D user experience. 

Ecarx is AMD’s first strategic ecosystem partner in China for the digital cockpit. 

“The global automotive industry is transforming towards an intelligent future at an unprecedented pace with demand for computing power and graphics capabilities rapidly increasing,” said Ziyu Shen, chairman and CEO of Ecarx. “With this collaboration, we will further enable OEMs and tier 1 suppliers to enhance their digital cockpit experiences as they seek to create greater consumer value through intelligent connected cars.”

“EV adoption is now a key underlying factor for growth in the automotive semiconductor market and the associated semiconductor demand is forecast to grow at a CAGR [compound annual growth rate] of 31 per cent over 2021 to 2026,” said Asif Anwar, executive director – PBCS and EVS, Strategy Analytics. He believes domain- and zonal-based architecture will drive adoption of the digital cockpit, ADAS (advanced driver assistance systems) and the connected vehicle.

The Ryzen Embedded V2000 Series processors are the second generation designed for automotive in-vehicle infotainment and instrumentation applications. They are also used in industrial edge, thin client and miniPC systems. The processors can power up to four independent displays simultaneously in 4K resolution; it is equipped with up to eight CPU cores and seven GPU compute units. A single AMD Ryzen Embedded V2000 Series processor provides up to two times the multi-threaded performance per Watt, up to 30 per cent better single-thread CPU performance and up to 40 per cent better graphics performance over the previous generation. 

AMD Radeon RX 6000 Series GPUs are built upon the AMD RDNA 2 graphics architecture. This is, said AMD, the only graphics architecture that spans from next-generation desktop PCs, laptops and consoles to mobile devices and automotive infotainment systems. It offers up to two time higher performance) and up to 50 per cent more performance per Watt in select titles compared to the previous generation AMD RDNA architecture.

Ecarx’s current core products include infotainment head units (IHU), digital cockpits, vehicle chipsets, a core operating system and integrated software stack. It is also developing a full-stack automotive computing platform. 

Its technology has been integrated into more than 3.2 million cars worldwide. 

For more than 50 years, AMD has developed computing, graphics and visualisation technologies. 

http://www.amd.com 

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Pluggable transceiver module provides optical GbE in vehicles

KDPOF has developed and validated the first 1000BASE-RH SFP module for optical Gbit connectivity in vehicles. The small form factor pluggable (SFP) transceiver module is based on a standard SFP supporting multi-source agreement registers via I2C bus. The module can operate at 100 and 1,000Mbit per second. It integrates the whole 1000BASE-RHC PHY and the header connector for SI-POF optical harness. 

The SFP module has been tested and validated in a functional demo. According to Carlos Pardo, CEO and co-founder of KDPOF, who described it as the first milestone for future commercial optical 1000BASE-RH SFP modules, for integration into the optical ecosystem in automotives. 

The SFP supports 1000BASE-X, 100BASE-X, and SGMII (with and without auto-negotiation) as electrical interfaces. It monitors the received optical power, the link margin, the junction temperature, and the supply voltages, among others.

The SFP design has been sampled and validated. KDPOF and Ethernet network testing and visibility tool company, Aukua Systems, are collaborating to optimise the 1000BASE-RHC SFP and make it available in Q3 2022.

Fabless semiconductor supplier KDPOF provides high speed optical networking for harsh environments. Making Gbit communications over fibre optics a reality, KDPOF technology supplies 1Gbit per second POF links for automotive, industrial, and home networks. KDPOF was founded in 2010 in Madrid, Spain, and offers technology as either ASSP or intellectual property (IP) to be integrated in SoCs. The adaptive system works with a range of optoelectronics and low cost large core optical fibres, which provide carmakers low risk, low cost and short time-to-market, claimed the company.

https://www.kdpof.com

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3D magnetic resolver IC is smallest available, claims Melexis

For industrial and automotive applications, the MLX90381 AEC-Q100 / ISO 26262 -compliant pico-resolver is supplied in a DFN-6 package, measuring just 2.0 x 2.5mm. Only three external capacitors are required to complete the circuit.

The ASIL-ready IC is programmable at module level and enables sensored mechatronic miniaturisation, particularly in rotor position detection, said the company. Being AEC-Q100 and ISO 26262 compliant (ASIL B SEooC), also makes it suitable for automotive safety related systems.

The 3D magnetic pico-resolver has a small outline and analogue outputs providing sine and cosine signals. It uses Melexis’ Triaxis Hall technology and can be used for absolute rotary position sensing where its low latency and fast response characteristics are able to measure rotational speeds of more than 50,000 rpm.

The MLX90381 pico-resolver can be used with DC, brushless DC (BLDC) and permanent magnet synchronous motors (PMSM) in applications such as e-valves and e-bike motors. 

The MLX90381 can be combined with Melexis’ family of smart embedded LIN drivers. These include the MLX81330 and MLX81332 (up to 10W) for directly driving flaps, valves and single-coil fans and pumps. It also works with the MLX81340, MLX81344 and MLX81346 pre-drivers (up to 2000W) which are incorporated into power blowers, engine cooling fans, pumps, window lifters, seat adjusters and sunroofs.

The selectable magnetic field axes (X/Y, X/Z and Z/Y) enable the MLX90381 to handle on-axis position sensing as well as off-axis through-shaft sensing. The sensitivity and filter bandwidth of each axis can be programmed directly through the device’s I2C interface. A dedicated high sensitivity version of the pico-resolver allows additional robustness against external magnetic stray fields.

The MLX90381 is available for order now.

Melexis designs, develops and delivers mixed-signal semiconductor sensor and actuator components addressing the integration of sensing, driving and communication into products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis specialises in automotive semiconductor sensors. Today, on average, every new car produced worldwide contains 13 Melexis chips, according to the company. The portfolio includes magnetic sensors, MEMS sensors (pressure, TPMS, infrared), sensor interface ICs, optoelectronic single point and linear array sensors and time of flight (ToF). The company’s driver IC portfolio incorporates advanced DC and BLDC motor controllers, LED drivers and FET pre-driver ICs.

Melexis is headquartered in Belgium.

http://www.melexis.com

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Tensilica DSP IP cores target radar and lidar

Two IP cores have been added to the Tensilica ConnX family of DSPs by Cadence. Intended for embedded processing in automotive, consumer and industrial markets, the ConnX 110 and ConnX 120 DSPs’ architecture is optimised for small memory footprint and low-power signal processing. The ConnX 110 and ConnX 120 DSPs share a common instruction set architecture (ISA) with the ConnX B10 and B20 DSPs preserving software compatibility for easy migration. 

The 128-bit ConnX 110 DSP and 256-bit ConnX 120 DSP feature an N-way programming model an, like the rest of the Tensilica DSP portfolio, support the Tensilica Instruction Extension (TIE) language, which allows customers to tailor the instruction set, add specialised data types, and implement tightly integrated interfaces between the DSP and external logic. 

The new DSPs are supported by a comprehensive set of complex math library functions in the NatureDSP, Eigen and Radar libraries. As with all existing ConnX DSPs, they are automotive-ready with full ISO 26262 compliance to ASIL-D with FlexLock or to ASIL-B.

The Tensilica ConnX 110 and 120 DSPs have an optimised instruction set for radar, lidar and communications applications. They also feature optional acceleration operations for linear-feedback shift, convolutional encoding, single peak search and dual peak search. The 128-bit (ConnX 110) and 256-bit (ConnX 120) SIMD are suitable for complex math operations based on eight-, 16- and 32-bit fixed-point and half-, standard- and double-precision floating-point.

The ConnX 120 additionally offers Viterbi and Turbo decoders.
NXP uses Cadence Tensilica DSP cores for its ADAS (advanced driver assistance system) product offerings, said Robert Dunnigan, director program management ADAS at NXP Semiconductors. 

Another customer, indie Semiconductor develops multiple sensor modalities “in the pursuit of the uncrashable car”. Lionel Federspiel, executive vice president of engineering for indie Semiconductor, commented: “Cadence’s Tensilica ConnX processor family in conjunction with indie’s architecture is ideally suited to implement unique design solutions with high performance, low power, and gate count optimisation. As a pure-play automotive solutions innovator, quality and reliability are essential to the success of our products.”

“Radar and communications processing trends require solutions that perform more processing in less time,” explained David Glasco, vice president of research and development for Tensilica IP at Cadence. “Automotive radar demands multi-antenna, high-resolution systems with rapid response. Similarly, 5G wireless communications requires much higher data rates and lower latencies than previous generations. The Tensilica ConnX 110 and ConnX 120 DSPs meet these demands by extending the already-efficient processing capability of the ConnX DSPs and enhancing them with even more fixed- and floating-point complex data processing capacity at low power and area.”

http://www.cadence.com

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