ST releases innovative satellite navigation receiver to democratise precise positioning

ST has introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle systems, and safety-critical applications such as autonomous driving. They have also been designed to improve positioning capabilities in multiple industrial applications including asset trackers, mobile robots for home deliveries, managing machinery and crop monitoring in smart agriculture, timing systems such as base stations, and many more.

“Our new Teseo VI receivers represent a real breakthrough among positioning engines for several reasons: they are the first to integrate multi-constellation and quad-band signal processing in a single die; they are the first to embed a dual-Arm®-core architecture enabling both very high performance and ASIL-level safety for assisted and autonomous driving applications. Last but not least, they embed ST’s proprietary embedded Non-Volatile-Memory (PCM), thus delivering a very integrated, cost-effective, and reliable platform for new precise-positioning solutions,” said Luca Celant, Digital Audio and Signal Solutions General Manager, STMicroelectronics. “ST’s new satellite-navigation receivers will support exciting, advanced capabilities in automotive ADAS applications and enable many new use cases being implemented by industrial companies.”

Teseo VI is the first in the market to integrate all the necessary system elements for centimetre accuracy into one die, supporting simultaneous multi-constellation and quad-band operations. This innovation simplifies the development of end-user navigation and positioning products, enhances reliability even in challenging conditions like urban canyons, and reduces bill-of-materials costs. Additionally, the single chip accelerates time to market and allows for compact and lightweight form factors.

The new Teseo VI family of precise positioning receiver chips leverages decades of experience and integrates multiple ST proprietary technologies, including precise positioning and advanced embedded memory.

ST’s new GNSS device family includes the Teseo VI STA8600A and Teseo VI+, STA8610A, each with dual independent Arm® Cortex®-M7 processing cores for local control of all the IC’s (integrated circuit) functions. The Cortex-M7 brings powerful 32-bit processing and helps enable concurrent multi-constellation and multi-band operation on a single die.

Teseo VI+ can also host various enhanced positioning engines, developed independently by third ST Authorised Partner companies, to provide complete real-time kinematics for centimetre position accuracy.

Completing the family, the Teseo APP2 STA9200MA operates dual cores in lockstep, providing hardware redundancy for applications such as road vehicle guidance meeting ISO 26262 ASIL-B functional safety. Pin-compatibility between Teseo APP2 and other Teseo VI ICs simplifies PCB design for companies producing ASIL-certified and non-ASIL applications.

All variants feature ST’s innovative RF architecture and GNSS baseband design provides quad-band GNSS support (L1, L2, L5 and E6) with the unique ability to acquire and track only L5. This is highly effective in reducing outliers and increasing robustness in difficult conditions such as urban canyons and in the presence of jammers.

In addition, the proprietary phase-change memory (PCM) technology removes external memory needs, thereby minimising the system bill of materials (BOM) and simplifying the manufacturing supply chain. Proprietary PCM is robust to withstand challenging environments such as automotive, non-volatile like Flash, and has a small cell architecture suited to space-efficient on-chip integration.

The ICs all contain a full set of hardware cyber security features including secure boot, over-the-air firmware update, and output-data protection. In addition, ST’s hardware security module (HSM) provides robust protection against online hacking. The devices comply with the latest UNECE R155 and ISO 21434 specifications that mandate cybersecurity by design.

The Teseo VI product family is supported by an established ecosystem of suppliers and partners for algorithms, reference designs, and compatible complementary hardware.

The Teseo VI product family includes also two new GNSS automotive modules: the Teseo-VIC6A in a 16mm x 12mm form factor (embedding Teseo VI), and the Teseo-ELE6A in a 17mm x 22mm form factor (embedding Teseo VI+). These new modules simplify the integration of Teseo VI/VI+ ICs on the customer platform and ensure optimum performance.

https://www.st.com/teseo6

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Rohm’s new TVS diodes support in-vehicle communication systems for autonomous driving

Rohm has developed bidirectional TVS (ESD protection) diodes compatible with CAN FD (CAN with Flexible Data rate) high-speed in-vehicle communication. Such protocols are seeing an increased demand in line with the ongoing advancement in autonomous driving and advanced driver assistance systems (ADAS). CAN FD is a crucial communication technology for safe, real-time data transmission between ECUs (Electronic Control Units) in vehicles. The new products achieve high-quality in-vehicle transmission by protecting electronic devices such as ECUs from surges and electrostatic discharge (ESD) while maintaining signal integrity in high-speed communication systems such as CAN FD.

The rapid evolution of autonomous driving technology and ADAS is boosting the demand for faster, more reliable automotive communication. Autonomous driving in particular requires quick and accurate processing of vast amounts of data from sensors such as cameras, LiDAR and radar – leading to the adoption of CAN FD that enables faster, higher capacity data transfer compared to traditional CAN used in automotive communication.

At the same time, to achieve high-speed in-vehicle communication, it is necessary to ensure stable transmission even under harsh environments. This has led to a growing demand for protection components that offer low terminal capacitance along with superior surge current rating and clamping voltage performance. As a result, the market for TVS diodes for automotive communication is expected to continue to grow in the future.

To meet market needs, Rohm developed the ESDCANxx series that combines low terminal capacitance with excellent surge tolerance. Two package types are available: SOT-23 (2.9mm × 2.4mm) and DFN1010 (1.0mm × 1.0mm), both supporting standoff voltages (VRWM) of 24V and 27V. The SOT-23 package includes four models: 24V ESDCAN24HPY / ESDCAN24HXY and 27V ESDCAN27HPY / ESDCAN27HXY. Similarly, the DFN1010 package is also offered in four models: 24V ESDCAN24YPA / ESDCAN24YXA and 27V ESDCAN27YPA / ESDCAN27YXA, totalling 8 products in the lineup.

The new products feature an optimised element structure that reduces terminal capacitance to a maximum of 3.5pF, preventing signal degradation during high-speed communication. High surge tolerance is also achieved, significantly improving the protection of electronic devices in automotive environments. For example, the 27V products of the DFN1010 package delivers approx. 3.2 times higher surge current rating and 16% lower clamping voltage compared to standard CAN FD-compatible products. This effectively safeguards expensive surge-sensitive electronic devices such as in-vehicle ECUs, ensuring high reliability even under harsh automotive environments.

https://www.rohm.com

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ST’s new Edge AI, NPU-accelerated microcontrollers now available from Mouser

Mouser is now shipping the new STM32N6 high-performance microcontroller from STMicroelectronics. The STM32N6 is the newest and most powerful of the STM32 family, optimised for edge-intensive AI algorithms in automotive, smart industry, robotics, drones, healthcare, smart buildings, smart homes, smart farming, and personal electronic applications.

STMicroelectronics STM32N6 MCU is the first of the STM32 series featuring ST’s proprietary Neural-ART Accelerator, specifically architected for embedded inference, delivering 600 times more machine-learning performance than existing high-end STM32 MCUs. The STM32N6’s Neural-ART Accelerator clocks at 1GHz, providing 600 giga-operations per second (GOPS) at an average of 3 tera-operations per second (TOPS), delivering energy efficiency while allowing machine learning applications requiring an accelerated microprocessor to now run on an MCU.

The STM32N6’s machine learning performance makes it possible to run computer vision, audio processing and sound analysis for consumer and industrial applications at the edge, utilising a Cortex-M55 MCU running at 800 MHz, a robust 4.2 MB embedded RAM that also includes a NeoChrom GPU alongside an H.264 hardware encoder, and a Helium™ M-Profile Vector Extension. The STM32N6 delivers remarkable AI performance and provides excellent flexibility in a small silicon package ideal for embedded systems and wearables.

The STM32N6 is supported by the STM32N6570-DK discovery kit. The kit is a complete demonstration and development platform for the STM32N6 and provides a full range of hardware features to enable users to evaluate the device. The kit includes USB Type-C, Octo SPI flash memory and Hexadeca SPI PSRAM devices, Ethernet connectivity, a camera module, a 5″ LCD touchscreen, and more. Four flexible extension connectors offer easy expansion capabilities for applications such as wireless connectivity, analog applications, and sensors.

https://www.mouser.com

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Molex has released compact power over coax solution

Molex, has announced the availability of its new compact MMCX Power over Coax (PoC) solution, which features a patent-pending mating technique to ensure secure and stable connections while maintaining electrical ground continuity. This product innovation is ideally suited for space-constrained applications where reliable RF connections and continuous power delivery are paramount, such as automotive liquid-crystal display (LCD) mirrors, driver monitoring systems or industrial sensors.

The MMCX Power over Coax (PoC) product not only alleviates persistent reliability problems, it also is backward compatible with IEC 61169-52 MMCX jack receptacles to facilitate seamless product upgrades. This alleviates the need to redesign existing PCB receptacles, which can save significant time while reducing costs associated with product integration. Compliance with current and future standards offers customers a future-proof solution to meet evolving RF connection and power delivery requirements.

The compact product is 30% smaller than traditional MMC connectors, making it ideal for customers seeking to replace larger, heavier MCX connectors as well as more robust and reliable performance. MMCX Power over Coax is especially advantageous in applications where separate power and data connectors is either impractical or undesirable. To date, MMCX Power over Coax is being tested and deployed in a variety of agriculture, automotive and industrial automation applications.

Additionally, this future-proof solution improves performance for a vast range of miniaturised, rugged and reliable products, encompassing remote and mobile devices, unmanned aerial vehicles, portable electronics, smart-home automation systems, as well as IoT sensors and infrastructure. MMCX Power over Coax also accommodates the stringent reliability requirements for GPS antennas, intelligent transport management systems, wireless meter readers and more.

https://www.molex.com

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