VSI claims first automotive industry standard, high speed SerDes silicon 

Believed to be the first commercial SerDes IC that complies with the ASA (Automotive SerDes Alliance) Motion Link standard, VS775 provides high speed data transmission for automotive camera applications. 

VSI develops high speed communication semiconductors for vehicles and has introduced the industry’s first commercial serialiser/deserialiser (SerDes) silicon that complies with the ASA standard. It has a data transmission rate of up to 16Gbits per second, so that the engine control unit (ECU) can quickly process high resolution image data collected by vehicle image sensors, especially electric vehicles, and autonomous vehicles. 

The VS775 provides a commercial camera link semiconductor that will resolve the bandwidth concerns associated with using more high resolution image sensors in advanced autonomous vehicle designs for automotive OEMs worldwide, said VSI. 

As the level of autonomous driving becomes more advanced, the number of sensors such as cameras and lidar and radar mounted on vehicles increases, which creates demand for real time, high speed data transmission. For example, it is expected that more than 20 sensors will be required for one vehicle at ASIL 4 and 5 autonomous driving, which requires high speed data transmission technology.

The ASA standardisation means that there are no interoperability issues causes by OEMs using proprietary technology, pointed out VSI.

In addition to high-speed data transmission, the VS775 features a low power design that reduces power consumption by up to 50 per cent compared to existing products, said VSI. The compact size means it is optimised for electric vehicles and automotive camera modules where there is limited space.

Steve Kang, founder and CEO of VSI, said: “As an industry-standard product, the VS775 guarantees interoperability that existing SerDes products cannot provide, which will reduce OEMs’ development periods and drive down costs. This in turn should accelerate the evolution of self-driving cars and electric vehicles and drive the future of the automobile industry.” 

Currently, VSI is in the process of supplying contracts for camera link solutions for advanced driver assistance systems (ADAS) with global automotive parts suppliers (Tier 1). The company plans to expand the support range of high-speed bandwidth to 32 and 64Gbits per second through subsequent development of the VS775. 

VSI is a fabless company that designs high speed communication semiconductors for vehicles and high-speed transmission of large volumes of data generated in real-time from autonomous driving and electric vehicles. 

VSI is a semiconductor technology-intensive start up and its major customers are global automotive OEMs and Tier 1 and Tier 2 companies. 

http://www.vsitech.co.kr 

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4D imaging radar architecture drives autonomous mobility, says Ambarella

Ambarella has introduced what it claims to be the world’s first centralised 4D imaging radar architecture which allows both central processing of raw radar data and deep, low-level fusion with other sensor inputs (including cameras, lidar and ultrasonics). Thie result is greater environmental perception and safer path planning in AI-based ADAS and L2+ to L5 autonomous driving systems or autonomous robotics, said the company.

Ambarella has used its Oculii radar technology which includes AI software algorithms.

By optimising the Oculii algorithms for its CV3 AI domain controller SoC family and adding specific radar signal processing acceleration, the architecture dynamically adapts radar waveforms to its surroundings to provide high angular resolution of 0.5 degrees and a dense point cloud up to 10s of thousands of points per frame, with a long detection range up to 500+ meters. 

The CV3’s AI performance per Watt offers the compute and memory capacity needed to achieve high radar density, range and sensitivity, said the company. A single CV3 can provide high performance, real time processing for perception, low level sensor fusion and path planning, centrally and simultaneously, within autonomous vehicles and robots.

This is all achieved with fewer antenna MIMO channels than competing 4D imaging radars, said Ambarella, which reduces the data bandwidth and results in “significantly lower power consumption” said the company. 

The data sets of competing 4D imaging radar technologies are too large to transport and process centrally. They generate multiple Tbits per second of data per module, while consuming more than 20W of power per radar module, due to thousands of MIMO antennas used by each module to provide the high angular resolution required for 4D imaging radar. This figure is multiplied across a vehicle’s six or more radar modules, making central processing impractical for other radar technologies, which must process radar data across thousands of antennas. 

The data sets of competing 4D imaging radar technologies are too large to transport and process centrally. They generate multiple Tbits per second of data per module, while consuming more than 20W of power per radar module, due to thousands of MIMO antennas used by each module to provide the high angular resolution required for 4D imaging radar. This figure is multiplied across a vehicle’s six or more radar modules, making central processing impractical for other radar technologies, explained Ambarella.

Applying AI software to dynamically adapt the radar waveforms generated with existing monolithic microwave integrated circuit (MMIC) devices and using AI sparsification to create virtual antennas, Oculii technology reduces the antenna array for each processor-less MMIC radar head in this new architecture to six transmit x eight receive. 

While the number of MMICs is drastically reduced, a high 0.5 degrees of joint azimuth and elevation angular resolution is achieved, reported Ambarella. The centralised architecture consumes significantly less power, at the maximum duty cycle, and reduces the bandwidth for data transport by a factor of six. It also eliminates the need for pre-filtered, edge processing which can result in loss of sensor information.

Additional benefits of the centralised architecture include easier over the air (OTA) software updates. Instead of individually updating each radar module’s processor after determining the processor and OS being used in each, the Ambarella architecture requires a single OTA update to the CV3 SoC and aggregated across all of the system’s radar heads. These radar heads eliminate the need for a processor, which reduces bill of material costs as well as costs in the event of damage from an accident (most radars are located behind the vehicle’s bumper). Additionally, many of the edge-processor radar modules deployed today never receive software updates because of this software complexity.

The centralised architecture will be demonstrated at Ambarella’s invitation-only event taking place during CES in Las Vegas in January. For sampling and evaluation information, contact Ambarella.

https://www.ambarella.com

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HighTec supports ST’s Stellar SR6x automotive MCU family  

Authorised ST partner, HighTec has announced that its Eclipse-based multi-architecture and multi-core compiler suite now supports ST Microelectronics’ latest Stellar 32-bit microcontroller series, the SR6x, for automotive software development.

HighTec’s compiler suite already supports the SPC5x 32-bit microcontroller family from STMicroelectronics.

The HighTec C/C++ compiler and its standard libraries are qualified according to ISO 26262 ASIL D. The associated qualification packages accelerate the development of safe automotive applications and could lead to the era of the software-defined vehicle. In its support for the Stellar SR6x family, HighTec will also offer its certified micro kernel real time operating system (RTOS) PXROS-HR, for data protection, functional safety for automotive applications, said the company.

ST’s Stellar SR6x family of 32-bit microcontrollers includes multiple series to address a range of automotive applications, such as zone and domain controllers that simplify in-vehicle wiring to support the transition to software-defined platforms. There is also support for central gateways, body integration controllers, drivetrain and motion control processors, and electric vehicle battery management. Stellar SR6x MCUs are based on up to six Arm Cortex-R52 cores with lockstep and split/lock capability. This ensures performance, real time processing and freedom from interference while running multiple applications in parallel, said HighTec.

The 32-bit automotive MCUs embed an EVITA-compliant, ISO 21434-compliant hardware security module (HSM) for cybersecurity protection. They also meet the requirements of security levels up to ASIL D, according to ISO 26262. A hypervisor enables the management of multiple virtual machines without interference, said Hightec. For over the air software updates, the memory architecture enables the duplication of the NVM (non-volatile memory) to eliminate downtime and the need to allocate extra memory.

The HighTec C/C++ compiler is based on the open-source technology LLVM.

In addition to the compiler and the real-time operating system, automotive developers can obtain other ST automotive software components from HighTec. These include MCAL, components for safety development such as CST (CoreSelfTest), IST (InstructionSelfTest), and an MCAL qualification package for ISO 26262-compliant software development, as well as other security components such as HSMs.

HighTec’s support team provides development and consulting services regarding performance optimisation, functional safety, porting from single core to multi-core systems and in AutoSAR environments.

http://www.hightec-rt.com

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Renesas unveils family of automotive radar transceivers with high accuracy and low power consumption

Renesas Electronics Corporation is entering the automotive radar market with the introduction of a 4×4-channel, 76-81GHz transceiver designed to meet the requirements of ADAS (advanced driver assistance systems) and Level 3 and higher autonomous driving applications. 

Renesas will incorporate the new RAA270205 high-definition radar transceiver into its growing sensor fusion portfolio, which combines radar, vision systems, and other sensing modalities.

Designed in co-operation with Steradian Semiconductors Private Limited, which Renesas acquired earlier this year, the new transceiver MMIC (monolithic microwave integrated circuit) is especially suited for imaging radar, long-range forward-looking radar and 4D radar, but can also be used for corner and central-processing radar architectures, the so-called ‘satellite’ automotive radar systems, said the company. Equipped with 4Tx and 4Rx channels, the RAA270205 supports up to 16 MIMO (multiple-input and multiple-output) channels. It can be cascaded to enable higher channel count and better radar resolution.

The RAA270205 features up to 5GHz of bandwidth and a 112.5MSPS ADC (analog-to-digital converter) sampling rate that it claims is nearly three times faster than those of competing devices. Power consumption of 1.2W is 50 per cent lower than that of comparable transceivers and it delivers a noise figure of 9dB, which is 3dB less than other radar transceivers, it says. Its chirp rate of up to 300MHz/microAs improves radar resolution and object detection.

“Today’s radar transceiver MMICs must achieve higher definition to support the high-accuracy requirements of ADAS and autonomous driving safety platforms,” said Vivek Bhan, senior vice-president and deputy general manager of Renesas’ automotive solution business unit“Working in close collaboration with Steradian, which brings deep radar design expertise, we are expanding our sensor fusion offerings with a focus on functional safety and low power consumption to help our customers lower their development costs and improve time to market.”

Renesas plans to combine the RAA270205 transceiver with other compatible devices from its portfolio to support automotive radar systems. These combinations will include the satellite radar system for AD/ADAS, which will be available in Q2/2023. 

 The RAA270205 will be available in 1Q/2023 in sample quantities, with commercial production planned for 2024. The transceiver is available in a small, easy-to-integrate eWLB (embedded wafer-level ball-grid array) package, measuring 7.6×5.6mm. It will be fully compliant with automotive industry requirements such as IATF 16949, AEC-Q100 Grade2 and ASIL B. 

Visit Renesas at electronica 2022, Hall B4, 179

https://renesas.com

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