SiC gate driver could help extend the driving range of electric vehicles

A highly integrated, functional safety-compliant, isolated gate driver has been released by Texas Instruments (TI). The company claimed that the driver could enable engineers to design more efficient traction inverters and maximise the driving range of electric vehicles (EVs). 

The UCC5880-Q1 reinforced isolated gate driver is claimed to offer features that enable EV powertrain engineers to increase power density and reduce system design complexity and cost. 

According to TI, semiconductor innovations in traction inverter systems are helping to overcome critical barriers to their widespread adoption. These innovations are said to enable automakers to build safer, more efficient and more reliable silicon carbide (SiC)- and insulated-gate bipolar transistor (IGBT)-based traction inverters by designing with UCC5880-Q1, featuring real-time variable gate-drive strength, Serial Peripheral Interface (SPI), advanced SiC monitoring and protection and diagnostics for functional safety.

The company said that the driver can be easily paired with other high-voltage power-conversion products, such as the UCC14141-Q1 isolated bias supply module, to improve power density and help engineers reach the high levels of traction inverter performance.

Achieving any increase in efficiency is difficult for designers, given that the majority of traction inverters already operate at 90 per cent efficiency or higher, according to TI. But by varying the gate-drive strength in real time, in steps between 20 A and 5 A, designers can improve system efficiency with the UCC5880-Q1 gate driver by as much as 2 per cent by minimising SiC switching power losses, resulting in up to seven more miles of EV driving range per battery charge, it claimed. For an EV user who charges their vehicle three times per week, that could mean more than 1,000 additional miles per year. 

It is claimed that engineers can reduce components and prototype a more efficient traction inverter system by using the SiC EV Traction Inverter Reference Design. This customisable, tested design includes the UCC5880-Q1, a bias-supply power module, real-time control MCUs and high-precision sensing.

Preproduction quantities of the automotive-grade, ISO26262-compliant UCC5880-Q1 are available in a 10.5mm x 7.5-mm, 32-pin shrink small-outline package (SSOP). Pricing starts at US$5.90 in 1,000-unit quantities. Designers can purchase a UCC5880-Q1 evaluation module for US$249. 

TI is exhibiting at the Power Conversion and Intelligent Motion (PCIM) Europe conference, Nuremberg, (9-11 May) at Hall 7, Booth No. 459.

https://www.TI.com

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Magnachip introduces 600V SJ MOSFETs with fast recovery body diodes

Magnachip has introduced 600V super junction MOSFETs with RDS(on) as low as 44 mOhm for EV chargers and servers. There are nine products in the 600V MOSFET family, featuring the proprietary design technology.

Magnachip’s design provides specific on-resistance (RSP) reduction of about 10 per cent, achieved while maintaining the same cell-pitches of previous generation MOSFETs.

The 600V super junction MOSFETs are equipped with a fast recovery body diode. The proprietary technology significantly enhances system efficiency with reduced reverse recovery time (trr) and switching loss. Therefore, the figure of merit to evaluate general performance of MOSFETs was improved by more than 10 per cent compared to the previous generation, said Magnachip. The 600V super junction MOSFETs can be used widely in industrial applications, such as solar inverters, energy storage systems, uninterruptible power supply systems, and a variety of electronics.

One of the nine MOSFETs is the MMQ60R044RFTH which offers a low RDS(on) of 44 mOhm, making it suitable for electric vehicle chargers and servers. 

“Now that we have introduced these 600V SJ MOSFET products, we are aiming to unveil new 650V and 700V SJ MOSFET products with fast recovery body diode in the second half of 2023,” said YJ Kim, CEO of Magnachip. 

Magnachip Semiconductor is a designer and manufacturer of analogue and mixed-signal semiconductor platforms for communications, IoT, consumer, computing, industrial and automotive applications. The company has more than 40 years’ of operating history, owns a portfolio of approximately 1,100 registered patents and pending applications, and has extensive engineering, design and manufacturing process expertise. 

http://www.magnachip.com

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CAN FD can accelerate AI in 5G V2X and AIoT smart manufacturing applications

Capitalising on the growth in the V2X (vehicle to everything) market, Antzer Tech, a subsidiary of Innodisk, has introduced the CAN FD series featuring high speed transmission, large data capacity, and downward compatibility. It is suitable for customers worldwide in the fields of electric vehicle, self-driving cars, and unmanned systems using mass data.

CANbus has been indispensable for traditional telematics, explains Antzer. Not only does it simplify wiring, but it realises highly reliable communication without host computers. As more IoT and V2X applications emerge, however, data loading also increases which could result in latency. The GADN-FD7L0 and FARO-FD700 offer high speed performance, and CAN standard downward compatibility for a painless smart upgrade, said Antzer Tech.

The CAN FD solution by Antzer Tech addresses the limitation of data transmission speeds and increases the data payload capacity by eight times compared with the CANbus network. 

For example, in telematics systems, it collects multiple system data of power management, radar sensing, cameras and GPS non-stop. According to Antzer, the CAN FD can break through the limitations of CANbus and contribute to unmanned smart manufacturing and logistics systems, despite the complexity of data transmission in these sectors. 

In addition, the CAN FD features high fault tolerance and debugging capabilities to enhance data reliability.

For safety requirements, it complies with the industry-level wide-temperature standard and features GNSS (Global Navigation Satellite System) and UDR / ADR  (untethered dead reckoning / automotive dead reckoning) functions to offer accurate positioning in tunnels, mountains, and other environments with unstable signals. This capability helps to increase transportation safety and optimise management as for unmanned telematics systems, said Antzer.

Innodisk provides flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications. 

https://www.innodisk.com

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Dedicated software library accompanies MEMS inertial sensing module 

The ASM330LHB is an automotive-qualified MEMS inertial-sensing module by STMicroelectronics. It provides measurements for a variety of vehicle functions and is provided with dedicated software which addresses functional-safety applications up to ASIL B1.

The module contains a three-axis digital accelerometer and three-axis digital gyroscope and provides a six-channel synchronised output. The inertial measurements can improve the precise positioning of the car in context, said ST. It can support ADAS (advanced driver assistance systems) or vehicle to everything (V2X) communication, help stabilise key sensing systems like radar, lidar and visual cameras, and assist semi-automated driving applications up to L2+. It can also be used to enable a variety of functionalities in the car body, added ST.

Used with the companion software, the ASM330LHB supports automotive systems that require safety integrity up to level B. Using two ASM330LHB sensor modules for fail-safe redundancy delivers resilient contextual data for driver-assistance applications, such as lane centring, emergency braking, cruise assistance and semi-automated driving. The ASIL B -compatible software library has been developed in accordance with the automotive functional-safety standard ISO 26262 and certified independently by TÜV SÜD. The library implements dedicated safety mechanisms, including data integrity and accuracy to ensure compliance with ASIL B automotive systems.

The ASM330LHB has embedded intelligence to add new services about the car status when the driver is away. The integrated machine learning core draws just a few microA of current, said ST and a machine learning algorithm can detect events such as theft attempts, jacking-up or towing, or impacts from other vehicles. 

By monitoring threshold combinations, the integrated finite state machine can detect when the vehicle is in motion or stationary, and for sensing vibrations or instability.

The accelerometer and gyroscope inside the module maintain high stability over time and temperature and have very low noise, achieving an overall bias instability of three degrees per hour. The ASM330LHB operates over the extended temperature range of -40 to +105 degrees C and has multiple operating modes that let designers optimise the data-update rate and power consumption.

The ASM330LHB is AEC-Q100 qualified and in production now in a 2.5 x 3.0mm 14-lead VFLGA package.

http://www.st.com 

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