Automotive

Production reference design for advanced in-cabin sensing to enhance vehicle safety and comfort

Mon, Jan 08, 2024

Eyeris Technologie, OMNIVISION and Leopard Imaging, have announced their partnership on a production reference design to improve safety and comfort in the entire automobile cabin. This jointly developed reference design integrates Eyeris’ advanced monocular three-dimensional (3D) sensing AI software algorithm into Leopard Imaging’s 5-megapixel (MP) backside illuminated (BSI) global shutter (GS) camera, which uses OMNIVISION’s OX05B image sensor and OAX4600 image signal processor (ISP). The advanced depth-aware driver monitoring system (DMS) and occupant monitoring system (OMS) production reference design will be showcased during CES 2024 at Leopard Imaging’s booth #9529,

The new production reference design is the first in the automotive industry to address the need for depth-aware in-cabin sensing data. Eyeris’ monocular 3D sensing AI technology enables any 2D image sensor, including the latest RGB-IR sensors, to provide valuable depth-aware whole-cabin sensing including DMS and OMS data. In addition to using OMNIVISION’s OX05B 5MP RGB-IR image sensor, this advanced production reference design also uses OMNIVISION’s OAX4600 ISP to process Eyeris‘ monocular 3D sensing AI data. Together with Leopard Imaging’s camera design-house capabilities, this comprehensive production reference design enables auto manufacturers and tier-ones to achieve faster time-to-market with reduced costs and low integration risk.

“Our partnership with OMNIVISION and Leopard Imaging offers automotive customers the industry’s most advanced 3D software along with a hardware production reference design kit for in-cabin sensing,” said Modar Alaoui, founder and CEO of Eyeris. “It is a true turn-key solution that’s readily available, with a unique combination of AI-based depth-aware DMS and OMS data, processed on OMNIVISION’s RGB-IR image sensor and ISP platform.”

“We are excited to partner with Eyeris and Leopard Imaging on this combined solution, which integrates a unique set of capabilities developed specifically for monocular 3D in-cabin monitoring systems,” said Paul Wu, staff marketing manager at OMNIVISION. “OMNIVISION’s ISP processing technology and dedicated neural processing unit (NPU) ensure robust, latency-free image processing, and our OX05B sensor offers the best performance in extremely low light conditions.”

“We’re delighted to work with Eyeris and OMNIVISION on this advanced production reference design for in-cabin monocular 3D sensing AI,” said Cliff Cheng, senior vice president of marketing, Leopard Imaging. “Our camera design and manufacturing experience combined with our advanced imaging solutions are a testament to our commitment for pushing innovation boundaries for the future of automotive in-cabin sensing.”

https://www.eyeris.ai.

https://www.ovt.com.

https://www.leopardimaging.com.

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u-blox module unlocks new automotive use cases

Fri, Jan 05, 2024

u-blox has announced JODY-W6, a concurrent dual-band Wi-Fi 6E module with Bluetooth 5.3, including LE Audio, in a compact size (13.8 x 19.8 x 2.5 mm). The new module targets automotive use cases in infotainment and navigation, advanced telematics, as well as OEM telematics.

According to the TSR (Techno Systems Research CO. LTD.) Wireless Connectivity Market Report, Wi-Fi 6 and 6E technologies are experiencing significant and promising growth in the automotive industry. Wi-Fi 6 focuses on efficiency, with reduced data congestion, improved network capacity, and lower overall power consumption. Instead, Wi-Fi 6E focuses on spectrum, enabling more concurrent users, reduced congestion, and enhanced security.

Not only does the u-blox JODY-W6 deliver the benefits of Wi-Fi 6E, but it also features dual-mode Bluetooth with LE Audio. JODY-W6 is globally certified and can withstand operating temperatures from -40 °C up to 105 °C.

The module is available with either two or three antennas. Upon request, it can also integrate an LTE filter. An EVK and an M.2 card will be available for the JODY-W6 series. Furthermore, its compatibility with previous JODY modules to ensure seamless scalability.

“JODY-W6 is a smart and reliable solution that helps overcome congestion and fulfils scalability requirements through its highly adaptable compact size. Specific use cases include support for AppleCarPlay and AndroidAuto, personalised entertainment, data off-loading, and smart/roof-integrated antennas.

The u-blox JODY-W6 comes equipped with an embedded NXP Semiconductors AW693 chipset.

“The AW693 SoC (System-on-Chip) embedded in the automotive JODY-W6 SoM (System-on-Module) leverages the latest concurrent dual-band Wi-Fi 6E and Bluetooth LE audio technologies to unlock new opportunities for a wide variety of use cases and businesses in the automotive domain. The AW693 chipset is packed with advanced features, including MU-MIMO, OFDMA, and target wake time (TWT), allowing the u-blox JODY-W6 compact module to benefit from the synergy of our gold partnership,” says Larry Olivas, Vice President and General Manager of Wireless Connectivity Solutions, NXP Semiconductors.

https://www.u-blox.com

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R&S verifies NXP’s next generation automotive radar sensor reference design for extremely short object distances

Fri, Dec 22, 2023

The radar target simulator R&S RTS has been used to verify the performance of NXP® Semiconductors’ next-generation radar sensor reference design. This collaboration enables the automotive industry to take another step forward in the development of automotive radar, the principal technology that enables advanced driver assistance systems (ADAS) and autonomous driving features.

Engineers from both companies conducted a comprehensive series of tests to verify the new sensor reference design which is based on a NXP’s 28 nm RFCMOS radar one-chip SoC (SAF85xx). The R&S RTS radar test system combines the R&S AREG800 automotive radar echo generator with the R&S QAT100 antenna mmW frontend, offering unique short-distance object simulation capabilities as well as superior RF performance and advanced signal processing with many advanced functions. This enables realistic tests of next generation automotive radar applications and brings automotive industry’s vision of fully autonomous driving one step closer.

NXP’s next generation automotive radar sensor reference design is enabled by the industry’s first 28 nm RFCMOS radar one-chip SoC family leveraging the R&S RTS radar test system. The radar sensor reference design can be used for short, medium and long-range radar applications to serve challenging NCAP (NCAP: New Car Assessment Program) safety requirements as well as comfort functions like highway pilot or urban pilot for the fast-growing segment of L2+ and L3 vehicles.

The R&S RTS is the only test system suitable for complete characterisation of radar sensors and radar echo generation with object distances down to the airgap value of the radar under test. It combines the R&S AREG800A automotive radar echo generator as a backend and the R&S QAT100 antenna array or the R&S AREG8-81S as a frontend. The technically superior test solution is suitable for the whole automotive radar lifecycle including development lab, hardware-in-the-loop (HIL), vehicle-in-the-loop (VIL), validation and production application requirements. The solution is also fully scalable and can emulate the most complex traffic scenarios for advanced driver assistance systems.

Adi Baumann, Senior Director ADAS R&D, at NXP Semiconductors says: “We have been collaborating closely and successfully with Rohde & Schwarz for many years on the verification of our automotive radar sensor reference designs. Rohde & Schwarz’ cutting-edge automotive radar test systems allows us high-quality and highly efficient validation of our automotive radar products and proves outstanding performance of our radar one-chip. The level of experience, quality and support that Rohde & Schwarz provides to NXP is making a difference.”

Gerald Tietscher, Vice President Signal Generators, Power Supplies and Meters from Rohde & Schwarz says: “We are grateful for the collaboration with NXP to accelerate the deployment of advanced automotive radar sensors based on 28 nm automotive radar chips. They serve ever more challenging NCAP safety requirements and will help enable new safety applications. Our experience in automotive radar testing allows us to provide a best-in-class test solution for this radar sensor design based on the industry’s first 28 nm RFCMOS one-chip radar SoC.”

NXP will present the latest developments for radar including the automotive radar sensor reference design at CES 2024 trade show in Las Vegas from January 9 to 12, 2024, at booth CP18.

https://www.rohde-schwarz.com/

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SemiQ unveils high-performance QSiC power modules in half-bridge packages

Wed, Dec 20, 2023

SemiQ has expanded its QSiC power modules portfolio with the introduction of a new series of 1200V silicon-carbide (SiC) power MOSFETs in half-bridge packages.

Engineered and tested to operate reliably in demanding environments, these new compact, high-performance modules enable high-power-density implementations while minimising dynamic and static losses. Featuring high breakdown voltage (>1400V), the new QSiC modules support high-temperature operation (Tj = 175°C) with low Rds(On) shift over the full temperature range. In addition, the modules exhibit industry-leading gate oxide stability and long gate oxide lifetime, avalanche unclamped inductive switching (UIS) ruggedness and long short-circuit withstand time.

With a solid foundation of high-performance ceramics, the new SiC modules are suitable for EV charging, on-board chargers (OBCs), DC-DC converters, E-compressors, fuel cell converters, medical power supplies, photovoltaic inverters, energy storage systems, solar and wind energy systems, data centre power supplies, UPS/PFC circuits, Vienna rectifiers, and other automotive and industrial applications.

To ensure that each module has a stable gate threshold voltage and high-quality gate oxide, SemiQ’s modules undergo gate burn-in testing at the wafer level. Besides the burn-in test, which helps to stabilise the extrinsic failure rate, stress tests such as gate stress, high-temperature reverse bias (HTRB) drain stress, and high humidity, high voltage, high temperature (H3TRB) allow achieving the required automotive and industrial grade quality levels. The devices also have extended short-circuit ratings. All modules have undergone testing exceeding 1350V.

https://semiq.com/

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