Automotive

SemiQ unveils high-performance QSiC power modules in half-bridge packages

Wed, Dec 20, 2023

SemiQ has expanded its QSiC power modules portfolio with the introduction of a new series of 1200V silicon-carbide (SiC) power MOSFETs in half-bridge packages.

Engineered and tested to operate reliably in demanding environments, these new compact, high-performance modules enable high-power-density implementations while minimising dynamic and static losses. Featuring high breakdown voltage (>1400V), the new QSiC modules support high-temperature operation (Tj = 175°C) with low Rds(On) shift over the full temperature range. In addition, the modules exhibit industry-leading gate oxide stability and long gate oxide lifetime, avalanche unclamped inductive switching (UIS) ruggedness and long short-circuit withstand time.

With a solid foundation of high-performance ceramics, the new SiC modules are suitable for EV charging, on-board chargers (OBCs), DC-DC converters, E-compressors, fuel cell converters, medical power supplies, photovoltaic inverters, energy storage systems, solar and wind energy systems, data centre power supplies, UPS/PFC circuits, Vienna rectifiers, and other automotive and industrial applications.

To ensure that each module has a stable gate threshold voltage and high-quality gate oxide, SemiQ’s modules undergo gate burn-in testing at the wafer level. Besides the burn-in test, which helps to stabilise the extrinsic failure rate, stress tests such as gate stress, high-temperature reverse bias (HTRB) drain stress, and high humidity, high voltage, high temperature (H3TRB) allow achieving the required automotive and industrial grade quality levels. The devices also have extended short-circuit ratings. All modules have undergone testing exceeding 1350V.

https://semiq.com/

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Press-fit terminal power modules for a solder-free solution in high-volume manufacturing

Thu, Dec 07, 2023

The E-Mobility, sustainability and data centre markets require products that are conducive to high-volume manufacturing. To better automate the installation process, Press-Fit terminals are often used because they offer a solder-free solution to mount power modules to the PCB. Microchip Technology has announced its expansive portfolio of SP1F and SP3F power modules are now available with Press-Fit terminals for high-volume applications.

Solder-free Press-Fit power module terminals allow for automated or robotic installation, which simplifies and speeds up the assembly process to reduce manufacturing costs. The high accuracy of the terminal locations and the novel Press-Fit pin design in the SP1F and SP3F power modules enables high-reliability contact with the printed circuit card. Overall, a Press-Fit power module solution can save valuable time and production costs.

There are over 200 variants available in Microchip’s SP1F and SP3F power modules portfolio, with options to use mSiC technology or Si semiconductors and an array of topologies and ratings. The SP1F and SP3F are offered in voltage range of 600V-1700V and up to 280A.

With Press-Fit technology, the power module pins are not soldered to the PCB. Instead, the electrical connection is made by pressing the pins into properly sized PCB holes. A key advantage of a Press-Fit power module solution is it eliminates the need for wave soldering. This is especially important when the PCB is made to also include Surface-Mount Technology (SMT) components.

“Our power modules with Press-Fit terminals offer customers the flexibility to fully customise their design and are cost-effective power solutions for high-volume production,” said Leon Gross, vice president of Microchip’s discrete products group. “This type of plug-and-play power solution also provides a highly reliable mounting solution for automated or robotic assembly.”

The highly configurable SP1F and SP3F power modules are fully compliant with the Restriction of Hazardous Substances Directive (RoHS).

https://www.microchip.com

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ST introduces AI-enabled automotive inertial measurement unit for always-aware applications up to 125°C

Tue, Dec 05, 2023

ST’s ASM330LHHXG1 inertial measurement unit (IMU) for automotive applications combines in-sensor AI with enhanced low-power operation and 125°C operating temperature range for reliability in harsh environments.

ST’s new automotive IMU contains a 3-axis accelerometer and 3-axis gyroscope and draws less than 800µA with both sensors running, cutting the system power budget and encouraging use in always-aware applications. In-sensor AI leverages the built-in machine-learning core (MLC) and finite state machine (FSM), offloading the host processor and enabling low-latency, energy-efficient event detection and classification. The extended temperature range gives flexibility to deploy smart sensors containing the ASM330LHHXG1 in harsh locations including near engine components, in direct sunlight, or whenever on-board power dissipation might increase the temperature above standard operating levels.

With the integrated MLC and FSM, the ASM330LHHXG1 handles applications that need fast and deterministic response with minimal power demand. These include navigation assistance and telematics, theft prevention, impact detection, and motion-activated functions.

ST’s MEMS ecosystem helps accelerate evaluation, prototyping and development with the ASM330LHHXG1, leveraging Unico-GUI and AlgoBuilder tools and MEMS-sensor adapter boards (STEVAL-MKI243A). Also, engineers can find ready-to-use application examples at ST’s GitHub repository area. The MLC repository contains use cases such as tilt, towing, and vehicle-status detection. The FSM repository has further inspiration including motion/stationary detection and shake detection.

While the IMU has dual operating modes that let designers optimise the data-update rate and power consumption, the accelerometer and gyroscope maintain high stability over time and temperature. The accelerometer has a selectable full-scale range of ±2/±4/±8/±16g, while the gyroscope’s angular rate can be set to ±125, ±250, ±500, ±1000, ±2000, or ±4000 degrees per second.

The ASM330LHHXG1 is AEC-Q100 qualified and in production now. It is available in an over-molded 14-lead plastic land grid array (LGA) package.

For more information, please visit http://www.st.com/automotive-experience

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Experience the most complete In-Cabin Monitoring Solution at CES

Mon, Dec 04, 2023

Melexis and emotion3D are launching a revolutionary automotive in-cabin monitoring solution based on 3D time-of-flight technology (ToF). It overcomes limitations of established driver monitoring systems (DMS).

Legislative momentum for advanced driver distraction warning (ADDW) is growing worldwide. Driver Monitoring Systems (DMS) strive to detect driver inattentiveness, fatigue, and distraction. Occupant Monitoring Systems (OMS) aim to provide occupant detection, classification and body tracking to enhance passive safety through smart restraint control (RCS) & dynamic automatic suppression systems (DASS). 3D ToF technology uniquely offers the best performance to merge both DMS & OMS applications into a single camera solution.

3D ToF cameras utilising Melexis’ automotive-qualified MLX75027, true VGA ToF sensor, and emotion3D’s CABIN EYE software simultaneously generate IR and distance images, thereby mapping a full scene in three dimensions. This essential information is used to accurately assess driver fitness to drive, whilst indicating the location of other occupants in the vehicle, detect limb position, track movements and body or hand gestures. Direct access to measured distance data greatly improves image segmentation options, reduces the computational load and thus lowers system cost.

“The combination of Melexis’ automotive track record in 3D sensing with easily accessible application software from emotion3D helps customers to overcome the challenges to create improved safety systems ”, says Kristof Lieben, Product Manager at Melexis. “Overall, this joint offering significantly simplifies and accelerates the development of camera monitoring systems. It enables competitively priced solutions that will enhance safety for everyone on the road and can increase comfort & convenience for its users.”

“This Driver & Occupant Monitoring System (DOMS) solution in partnership with Melexis showcases the latest technology in the field to combine three important concerns in the in-cabin environment: active safety, passive safety and user experience” said Florian Seitner, CEO of emotion3D. “We hope to welcome many visitors from the automotive industry to come see the demonstrator in action at CES this January.”

https://www.melexis.com

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