Automotive

HaiLa showcases first Wi-Fi-based extreme-low-power backscatter chip

Mon, Jan 15, 2024

HaiLa Technologies has announced the availability of the BSC2000 RF evaluation chip development and demonstration kits. Presto Engineering successfully collaborated with HaiLa to develop the first complete analog and digital implementation of HaiLa’s passive backscatter technology adapted to Wi-Fi RF bands.

Supporting an SPI interface, the chip brings seamless connectivity to a wide range of IoT devices, such as multi-channel temperature and humidity sensors. The joint partnership to develop the BSC2000 demonstrates the path to extreme-low power in IoT devices used in building, home and industrial automation; consumer electronics and wearables; smart transportation; agriculture; medical; and automotive markets.

“HaiLa is pleased to have collaborated with Presto Engineering on the silicon implementation of the BSC2000, and we’re excited to showcase our technology at CES 2024,” said Derek Kuhn, President and CEO, HaiLa Technologies, Inc. “This is another step forward in our mission to enable sustainable scaling of IoT over existing wireless infrastructures, helping end-users meet their net-zero goals through a massive reduction in battery waste. Presto’s long experience in ultra-low power RFID and NFC allowed HaiLa to complement its team with expert resources embedded into the development process, delivering the completed BSC2000 ASIC as one team.”

According to Cedric Mayor, CEO, Presto Engineering, “We are proud to support HaiLa on a key industry initiative to help reduce carbon footprint of connected objects. This project has shown that pushing the limit of IoT power efficiency is not only possible but a game changer for mitigating the cost and waste of battery usage.” Mayor adds, “With our deep expertise in RF mixed-signal chip design and ultra-low power architectures, we look forward to extending our partnership with HaiLa to jointly address new business opportunities leveraging their unique IP in future projects.”

HaiLa’s passive backscatter foundational technology is protocol-agnostic. As the most common wireless local area network (WLAN) technology in residential, enterprise and industrial environments globally, HaiLa has focused its first adaptation on Wi-Fi as a key infrastructure enabler for IoT deployments.

https://www.haila.io

https://www.presto-eng.com

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GaN FETs Enable 75 – 231 ampere laser diode control in nanoseconds for advanced automotive autonomy

Mon, Jan 15, 2024

EPC introduces three evaluation boards – EPC9179, EPC9181, and EPC9180 – featuring pulse current laser drivers of  75 A, 125 A, and 231 A , showcasing EPC’s AEC-Q101 GaN FETs. These FETs; EPC2252, EPC2204A, and EPC2218A are 30% smaller and more cost-effective than their predecessors. Designed for both long and short-range automotive lidar systems, these boards expedite solution evaluation with varied input and output options.

All boards share identical functionality, differing only in peak current and pulse width. Utilising a resonant discharge power stage, they employ a ground-referenced GaN FET driven by LMG1020 gate driver. The GaN FET’s ultrafast switching enables rapid discharge of a charged capacitor through the load’s stray inductance, enabling peak discharge currents of tens to hundreds of amps within nanoseconds. The printed circuit board is designed to minimise power loops and common source inductance while offering mounting flexibility for laser diodes or alternative loads. To enhance user-friendliness, all boards ship with EPC9989 interposer PCBs, featuring various footprints to accommodate a variety of laser diodes or other loads. Customers can choose one that meets their needs to evaluate the GaN solutions.

The EPC9179/81/80 boards are designed to be triggered from 3.3V logic or differential logic signals such as LVDS. For single-ended inputs, the boards can operate with input voltages down to 2.5 V or 1.8 V with a simple modification. Designing an automotive lidar system is complex, and finding a reliable solution is challenging. The purpose of these evaluation boards is to simplify the evaluation of powerful GaN-based lidar drivers that switch faster and deliver higher pulse current than other semiconductor solutions. For technical details, EPC offers full schematics, bill of materials (BOM), PCB layout files, and a quick start guide on EPC’s website.

“To meet the growing demand for automotive lidar, these cost-effective boards, featuring our latest AEC products, streamline evaluation, reducing time-to-market with exceptional switching performance,” said Alex Lidow, CEO, and co-founder of EPC.

https://epc-co.com

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NXP extends industry first 28 nm RFCMOS radar One-Chip Family

Thu, Jan 11, 2024

NXP has announced an extension of its automotive radar one-chip family. The new SAF86xx monolithically integrates a high-performance radar transceiver, a multi-core radar processor and a MACsec hardware engine for state-of-the-art secure data communication over Automotive Ethernet. Combined with NXP’s S32 high-performance processors, vehicle network connectivity and power management, the full system solution paves the way for advanced, software-defined radar.

The highly integrated radar SoC (System-on-Chip) is intended for streaming rich low-level radar sensor data at up to 1 Gbit/s. It helps carmakers optimize next-generation ADAS partitioning for software-defined vehicles, while providing for a smooth transition to new architectures. Additionally, OEMs will be able to easily introduce new software-defined radar features during the lifetime of the vehicle through Over-the-Air (OTA) updates.

It also shares a common architecture with the SAF85xx introduced last year and leverages 28 nm RFCMOS performance for significantly improved radar sensor capabilities, compared to prior-generation 40 nm or 45 nm products. It enables Tier-1 suppliers to build more compact and power-efficient radar sensors. Drivers and other road users will benefit from extended detection range beyond 300 m, along with more reliable detection of small objects like curb stones as well as vulnerable road users including cyclists and pedestrians.

The new radar one-chip supports NCAP safety functions including emergency braking and blind-spot detection. It also supports advanced ADAS and autonomous driving applications, including advanced comfort features for SAE levels 2+ and 3 such as traffic jam assist, highway pilot and park assist, front and rear cross-traffic alerts, as well as lateral and rear collision avoidance.

“Using our new SAF86xx radar one-chip family, OEMs can quickly and easily migrate their current radar platforms to new software-defined vehicle architectures,” said Steffen Spannagel, SVP and GM, ADAS, NXP Semiconductors. “A network of connected radar sensors with software-defined functions on a dedicated S32R radar processor in a distributed architecture can enhance radar-based perception to support advancements in autonomous driving. That includes 360-degree sensing, more powerful AI-based algorithms and secure OTA software updates.”

The comprehensive SAF8xxx family featuring the new SAF86xx and SAF85xx can be tailored for individual OEM use cases. It supports a range of sensor outputs, including object, point cloud-, or range-FFT-level data for smart sensors in today’s architectures and streaming sensors in future distributed architectures.

https://www.nxp.com/saf86xx

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TI debuts new automotive chips at CES, enabling automakers to create smarter, safer vehicles

Tue, Jan 09, 2024

Texas Instruments has introduced new semiconductors designed to improve automotive safety and intelligence. The AWR2544 77GHz millimeter-wave radar sensor chip is the industry’s first for satellite radar architectures, enabling higher levels of autonomy by improving sensor fusion and decision-making in ADAS. TI’s new software-programmable driver chips, the DRV3946-Q1 integrated contactor driver and DRV3901-Q1 integrated squib driver for pyro fuses, offer built-in diagnostics and support functional safety for battery management and powertrain systems. TI is demonstrating these new products at the 2024 Consumer Electronics Show (CES).

Many automakers are adding more sensors around the car to improve vehicle safety and autonomy. TI’s AWR2544 single-chip radar sensor is the industry’s first designed for satellite architectures. In satellite architectures, radar sensors output semi-processed data to a central processor for ADAS decision-making using sensor fusion algorithms, taking advantage of the 360-degree sensor coverage to achieve higher levels of vehicle safety.

The AWR2544 single-chip radar sensor is also the industry’s first with launch-on-package (LOP) technology. LOP technology helps reduce the size of the sensor by as much as 30% by mounting a 3D waveguide antenna on the opposite side of the printed circuit board. LOP technology also enables sensor ranges to extend beyond 200m with a single chip. In satellite architectures, these features enable automakers to increase ADAS intelligence for higher vehicle autonomy levels to make smarter decisions from farther away. The AWR2544 is the latest in TI’s radar sensor portfolio, which supports a wide range of ADAS applications and architectures with sensors developed for corner, front, imaging, side and rear radar systems.

Supporting the trend toward software-defined vehicles is challenging designers to develop smarter, more advanced battery management systems (BMS). Two new highly integrated, software-programmable driver chips from TI address requirements for safer and more efficient control of high-voltage disconnect circuits in a BMS or other powertrain system. Both drivers are International Organization for Standardization (ISO) 26262 functional safety-compliant and offer built-in diagnostics and protection to reduce automotive engineers’ development time.

For BMS and other powertrain systems, the DRV3946-Q1 is the industry’s first fully integrated contactor driver. It includes a peak-and-hold current controller that helps automakers increase system power efficiency. The device also implements safety diagnostics to monitor the condition of the contactor.

TI’s DRV3901-Q1 fully integrated squib driver enables an intelligent pyro fuse disconnect system by using built-in circuitry to monitor the pyro fuse and provide diagnostic information to the system microcontroller. This gives hybrid electric vehicle (HEV) and EV BMS designers flexibility to use a pyro fuse instead of traditional melting fuse systems while minimizing design complexity.

https://www.ti.com/

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